05-08-1973

BGA Package
42-Lead (22mm × 9mm × 5.16mm)
(Reference LTC DWG# 05-08-1973 Rev Ø)
Z
A
aaa Z
E
Y
X
SEE NOTES
DETAIL A
A2
SEE NOTES
7
6
5
4
3
2
7
1
PIN 1
3
A
PIN “A1”
CORNER
A1
4
b
B
ccc Z
C
D
E
b1
MOLD
CAP
F
SUBSTRATE
H
Z
// bbb Z
D
G
H1
H2
DETAIL B
J
F
K
L
Øb (42 PLACES)
ddd M Z X Y
eee M Z
M
N
P
R
S
DETAIL A
e
T
aaa Z
e
DETAIL B
PACKAGE SIDE VIEW
PACKAGE BOTTOM VIEW
3.81
2.54
1.27
0.635 ±0.025 Ø 42x
b
G
0.00
1.27
3.49
2.54
3.81
4.13
PACKAGE TOP VIEW
10.16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
8.89
2. ALL DIMENSIONS ARE IN MILLIMETERS
DIMENSIONS
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
H1
H2
aaa
bbb
ccc
ddd
eee
0.00
6.35
7.62
MIN
4.91
0.50
4.41
0.60
0.60
0.46
3.95
NOM
5.16
0.60
4.56
0.75
0.63
22.0
9.0
1.27
20.32
7.62
0.56
4.00
MAX
5.41
0.70
4.71
0.90
0.66
0.66
4.05
0.15
0.10
0.15
0.15
0.08
TOTAL NUMBER OF BALLS: 42
NOTES
3
BALL DESIGNATION PER JESD MS-028 AND JEP95
4
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu
7
COMPONENT
PIN “A1”
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
LTMXXXXXX
µModule
8.89
10.16
SUGGESTED PCB LAYOUT
TOP VIEW
9.84
10.48
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
BGA 42 0714 REV Ø
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