CRS2010

MATERIAL DECLARATION SHEET
Material Number
CRS 2010
Product Line
High power & anti-surge
chip resistors
Compliance Date
5-29-2013
RoHS Compliant
Yes (Lead
Exemption)
No.
1
Construction
Element(subpart)
Ceramic
MSL
Homogeneous
Material
Substrate
1
Material
weight
[mg]
21.4686
Homogeneous
Material\
Substances
if applicable
Materials
Mass %
Material
Mass % of
total unit wt.
Aluminum oxide
1344-28-1
96
83.687
Silicon dioxide
7631-86-9
4
3.487
CASRN
Magnesium oxide
1309-48-4
Subpart
mass of total
wt. (%)
87.175
2
Top conductor
Silver
0.3805
Silver
7440-22-4
100
1.545
1.545
3
Bottom conductor
Silver
0.1948
Silver
7440-22-4
100
0.791
0.791
Silver
7440-22-4
40
0.383
Ruthenium
dioxide
12036-10-1
20
0.192
Palladium
7440-05-3
15
0.144
Lead-containing
Glass
65997-18-4
25
0.240
4
Resistor
Headquarters Riverside CA
Silver Palladium
0.2361
0.959
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CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society
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MATERIAL DECLARATION SHEET
5
First encapsulating
Resin
Glass
65997-18-4
92
0.851
Chromium oxide
1308-38-9
8
0.074
Resin
25036-25-3
100
2.121
Silver
7440-22-4
85
1.736
Resin
9003-36-5
15
0.306
0.2277
6
Overcoat
Resin
0.5224
7
Side conductor
Silver
0.5031
0.925
2.121
2.042
8
Plating (Middle)
Nickel
0.4246
Nickel
7440-02-0
100
1.724
1.724
9
Plating (Outer)
Tin
0.6370
Tin
7440-31-5
100
2.587
2.587
Resin
25068-38-6
70
0.092
10
Marking
Resin
0.0324
Titanium oxide
1317-80-2
30
0.039
Total weight
0.131
24.6272
This Document was updated on: 05/29/2013
Important remarks:
1. It is the responsibility of the user to verify they are accessing the latest version.
2. Lead exemption – 7c-I
Headquarters Riverside CA
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CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society
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