05-08-1930

WR Package
72-Lead QFN (10mm × 10mm)
(Reference LTC DWG # 05-08-1930 Rev A)
0°–14° (×4)
0.65 REF
10.50 ±0.05
6.00 ±0.15
MAX
1.0mm
0.02
8.90 ±0.05
8.50 REF
(4 SIDES)
0.20
REF
6.00 ±0.15
0.50
DETAIL A
0.25 ±0.05
0.50 BSC
0.8 ±0.05
0.60 MAX
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.10 M C A B
0.0.5 M C
0.15 C
10.00 BSC
B
9.75 BSC
B
0.60
MAX
b
0.25 ±0.05
DETAIL B
0.5 ±0.1
6.00 ±0.15
55
72
54
1
PIN 1
10.00 9.75
BSC BSC
6.00 ±0.15
37
0.15 C
18
36
R0.300
TYP
C
0.50 BSC
19
DETAIL B
WR72 0213 REV A
DETAIL A
0.10 C
0.10 C
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220
2. DIMENSION “b” APPLIES TO METALIZED TERMINAL AND IS MEASURED BETWEEN
0.15mm AND 0.30mm FROM THE TERMINAL TIP. IF THE TERMINAL HAS OPTIONAL
RADIUS ON THE OTHER END OF THE TERMINAL, THE DIMENSION B SHOULD NOT BE
MEASURED IN THAT RADIUS AREA
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT
5. DRAWING NOT TO SCALE
COMPONENT
LTCXXXXXX
SEATING PLANE
PIN “A1”
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
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