DC8 Package 8-Lead Plastic DFN (2mm × 2mm) (Reference LTC DWG # 05-08-1939 Rev Ø) Exposed Pad Variation AA 1.8 REF 0.90 REF 0.23 REF 0.85 ±0.05 2.60 ±0.05 PACKAGE OUTLINE 0.335 REF 0.25 ±0.05 0.45 BSC RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 2.00 ±0.05 (4 SIDES) PIN 1 BAR TOP MARK (SEE NOTE 6) 2.00 SQ ±0.05 1.8 REF 5 8 0.23 0.335 REF REF 0.55 ±0.05 PIN 1 NOTCH R = 0.15 (DC8MA) DFN 0113 REV Ø 4 0.200 REF 0.75 ±0.05 1 0.23 ±0.05 0.45 BSC BOTTOM VIEW—EXPOSED PAD 0.00 – 0.05 NOTE: 1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE