LGA Package 144-Lead (16mm × 16mm × 1.82mm) (Reference LTC DWG # 05-08-1948 Rev Ø) SEE NOTES DETAIL A A aaa Z M L K J H G F E D C B 7 A 1 PAD “A1” CORNER 2 4 b DIA 0.630 PAD 1 3 4 5 6 MOLD CAP D F SUBSTRATE 7 8 H1 H2 Z // bbb Z 9 10 DETAIL B 11 e 12 X 3x, C (0.22 x45°) SEE NOTES G DETAIL B PACKAGE TOP VIEW e b Ø eee S Z X Y Y E aaa Z 0.630 ±0.025 SQ. 143x 3 PACKAGE BOTTOM VIEW 6.9850 5.7150 4.4450 3.1750 2. ALL DIMENSIONS ARE IN MILLIMETERS 1.9050 0.6350 0.0000 0.6350 1.9050 3.1750 4.4450 5.7150 6.9850 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 DETAIL A 6.9850 0.630 ±0.025 SQ. 143x 5.7150 4.4450 3.1750 1.9050 0.6350 0.0000 0.6350 1.9050 3.1750 4.4450 5.7150 6.9850 SUGGESTED PCB LAYOUT TOP VIEW 3 LAND DESIGNATION PER JESD MO-222, SPP-010 4 DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE DIMENSIONS SYMBOL A b D E e F G H1 H2 aaa bbb eee MIN 1.72 0.60 0.27 1.45 NOM 1.82 0.63 16.0 16.0 1.27 13.97 13.97 0.32 1.50 MAX 1.92 0.66 NOTES 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. THE TOTAL NUMBER OF PADS: 144 7 0.37 1.55 0.15 0.10 0.05 TOTAL NUMBER OF LGA PADS: 144 ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY LTMXXXXXX µModule COMPONENT PIN “A1” TRAY PIN 1 BEVEL PACKAGE IN TRAY LOADING ORIENTATION LGA 144 0513 REV Ø