05-08-1908

BGA Package
144-Lead (15mm × 15mm × 5.01mm)
(Reference LTC DWG # 05-08-1908 Rev Ø)
A2
aaa Z
SEE NOTES
DETAIL A
Z
A
G
e
7
b
M
b
A1
L
ccc Z
K
J
H
b1
MOLD
CAP
G
F
D
SUBSTRATE
E
Z
H2
// bbb Z
F
H1
D
DETAIL B
C
Øb (144 PLACES)
PIN “A1”
CORNER
A
ddd M Z X Y
eee M Z
X
0.0
12
SEE NOTES
Y
E
aaa Z
4
B
e
DETAIL B
PACKAGE SIDE VIEW
PACKAGE TOP VIEW
11
3
10
9
8
7
6
5
4
3
2
1
PIN 1
PACKAGE BOTTOM VIEW
6.9850
5.7150
4.4450
3.1750
1.9050
0.6350
0.0000
0.6350
1.9050
3.1750
4.4450
5.7150
6.9850
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
6.9850
0.630 ±0.025 Ø 144x
5.7150
4.4450
3.1750
1.9050
0.6350
0.0000
0.6350
1.9050
3.1750
4.4450
5.7150
6.9850
SUGGESTED PCB LAYOUT
TOP VIEW
2. ALL DIMENSIONS ARE IN MILLIMETERS
DETAIL A
DIMENSIONS
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
H1
H2
aaa
bbb
ccc
ddd
eee
MIN
4.81
0.50
4.31
0.60
0.60
0.36
3.95
NOM
5.01
0.60
4.41
0.75
0.63
15.00
15.00
1.27
13.97
13.97
0.41
4.00
MAX
5.21
0.70
4.51
0.90
0.66
0.46
4.05
0.15
0.10
0.20
0.30
0.15
TOTAL NUMBER OF BALLS: 144
3
BALL DESIGNATION PER JESD MS-028 AND JEP95
4
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
NOTES
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu
7
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
µModule
LTMXXXXXX
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
BGA 144 0613 REV Ø
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