BGS12AL7-4 Data Sheet (1.3 MB, EN)

BGS12AL7-4
SPDT RF Switch
Data Sheet
Revision 1.3, 2009-06-24
Preliminary
Industrial & Multimarket
Edition 2009-06-24
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2009 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
BGS12AL7-4
SPDT RF Switch
BGS12AL7-4 SPDT RF Switch
Revision History: 2009-06-24, Revision 1.3
Previous Revision: 2008-10-08, V1.2
Page
Subjects (major changes since last revision)
Converted to the new IFX Template.
9
Extended Supply Voltage Range
10
Pin Description Pin 7
11
Electrical Specifications @ 100 MHz
12
Correct Return Loss and Isolation axis label
14
Update Board Pad (SMD) & Apertures, Tape and Reel Info
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of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™
of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™,
PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™,
WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited.
Last Trademarks Update 2009-05-27
Preliminary Data Sheet
3
Revision 1.3, 2009-06-24
BGS12AL7-4
SPDT RF Switch
Table of Contents
Table of Contents
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2
Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4
Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5
Measurement Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
6
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Preliminary Data Sheet
4
Revision 1.3, 2009-06-24
BGS12AL7-4
SPDT RF Switch
List of Figures
List of Figures
Figure 1
Figure 2
Figure 3
Figure 4
Figure 5
Figure 6
Figure 7
Figure 8
Functional Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Pin Configuration (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Measurement Results (@ T = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Application Board: No External Components Necessary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Deembedding Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Package TSLP7-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Board Pad (SMD) & Apertures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Tape and Reel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Preliminary Data Sheet
5
Revision 1.3, 2009-06-24
BGS12AL7-4
SPDT RF Switch
List of Tables
List of Tables
Table 1
Table 2
Table 3
Table 4
Table 5
Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Operation Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Truth Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Preliminary Data Sheet
6
Revision 1.3, 2009-06-24
SPDT RF Switch
1
BGS12AL7-4
Features
Main features:
•
•
•
•
•
•
•
•
•
6
Low insertion loss
High port-to-port-isolation
Low harmonic generation
On-chip control logic
High ESD robustness
No external components required
General purpose switch for applications up to 3 GHz
Small leadless package TSLP-7-6
Lead and halogen free package (RoHS and WEEE compliant)
5
4
7
1
2
3
Description
The BGS12AL7-4 General Purpose RF MOS switch is designed to cover a broad range of applications from
30 MHz to 3 GHz. The symmetric design of its single pole double throw configuration, as shown in Figure 1 offers
high design flexibility. This single supply chip integrates on-chip CMOS logic driven by a simple, single-pin CMOS
or TTL compatible control input signal. The 0.1 dB compression point exceeds the switch’s maximum input power
level of 21 dBm, resulting in linear performance at all signal levels. The RF switch has a very low insertion loss of
0.4 dB in the 1 GHz and 0.5 dB in the 2 GHz range.
Unlike GaAs technology, external DC blocking capacitors at the RF ports are only required if DC voltage is applied
externally.
Product Name
Package
Chip
Marking
BGS12AL7-4
TSLP7-4
M4781
12
Preliminary Data Sheet
7
Revision 1.3, 2009-06-24
BGS12AL7-4
SPDT RF Switch
Features
The BGS12AL7-4 RF switch is manufactured in Infineon’s patented MOS technology, offering the performance of
GaAs with the economy and integration of conventional CMOS including the inherent higher ESD robustness.
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5)
5)
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Figure 1
Functional Diagram
Preliminary Data Sheet
8
Revision 1.3, 2009-06-24
BGS12AL7-4
SPDT RF Switch
Maximum Ratings
2
Maximum Ratings
Table 1
Maximum Ratings
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Note /
Test Condition
Storage temperature range
Tstg
-65
–
150
°C
–
DC Voltage at all pins to GND
VDC
–
–
5
V
–
RF power max. at all RF ports
PIN
–
–
24
dBm
–
VESD
–
–
1000
V
–
–
–
100
V
–
Unit
Note /
Test Condition
ESD Capability
Human Body Model IEC61340-3-1
Machine Model IEC61340-3-2
Table 2
Operation Ranges
Parameter
Symbol
Values
Min.
Typ.
Max.
Ambient temperature
TA
-30
–
85
°C
–
RF Frequency
f
0.03
–
3
GHz
–
Control voltage low
VCtrL
-0.3
–
0.3
V
–
Control voltage high
VCtrlH
1.4
–
Vdd
V
–
Supply voltage
Vdd
2.4
–
3.6
V
–
Current consumption Vdd Pin (over
temperature)
IVdd
80
–
350
μA
–
Current Consumption Vctrl Pin
ICtrl
–
–
30
μA
–
Power Range
Pin
–
–
–
dBm
–
(VSWR ∞: 1)
–
–
15
–
(VSWR 3: 1)
–
–
18
–
(VSWR 1: 1)
–
–
21
–
1)
1) Supply voltage must be connected before Control Voltage
Attention: Stresses above the max. values listed here may cause permanent damage to the device.
Exposure to absolute maximum rating conditions for extended periods may affect device
reliability. Maximum ratings are absolute ratings; exceeding only one of these values may
cause irreversible damage to the integrated circuit.
Preliminary Data Sheet
9
Revision 1.3, 2009-06-24
BGS12AL7-4
SPDT RF Switch
Pin Description
3
Pin Description
Table 3
Pin Description
Pin No.
Name
Pin
Type
Buffer
Type
1
RF2
I/O
RF Port 2 Out
2
GND
GND
Ground
3
RF1
I/O
RF Port 1 Out
4
Vdd
PWR
Supply Voltage
5
RFIN
I/O
RF Port In
6
CTRL
I
Control Pin
7
NC
NC
It is recommended to connect Pin 7 to Ground
Ctrl
RFin
Vdd
6
5
4
Function
7
Gnd
1
2
3
RF2
GND
RF1
Figure 2
Pin Configuration (top view)
Table 4
Truth Table
TSLP7- 4.vsd
Ctrl 1
RF 1
RF 2
0
1
0
1
0
1
Preliminary Data Sheet
10
Revision 1.3, 2009-06-24
BGS12AL7-4
SPDT RF Switch
Electrical Specifications
4
Electrical Specifications
Test Conditions:
•
•
•
•
•
Termination port impedance: Z0 = 50 Ω
Temperature range: TA = -30 °C...+85 °C
Supply Voltage: Vdd = 2.8 V
Pin = 15 dBm
Across operating range of control voltages: VCtrH = 1.4...2.8 V
Table 5
Electrical Characteristics
Parameter
Symbol
Values
Min.
Insertion Loss
IL
Isolation RFin - RF1
Isolation RFin - RF2
Isolation RF1 - RF2
Isolation RF ports - Vdd, Vctrl
RL
ISORFin-RF1
ISORFin-RF2
ISORF1-RF2
ISORF-DC
On Switching Time (10-90%) RF
ton
–
dB
f = 0.1 GHz TX,
0.4
1)
–
dB
f = 1 GHz TX,
–
0.5
1)
–
dB
f = 2 GHz TX,
–
302)
–
dB
f = 0.1 GHz
15
22
–
dB
f = 1 GHz
13
22
–
dB
f = 2 GHz
–
dB
f = 0.1 GHz
–
dB
f = 1 GHz
–
dB
f = 2 GHz
–
dB
f = 0.1 GHz
–
dB
f = 1 GHz
–
dB
f = 2 GHz
–
dB
f = 0.1 GHz
–
dB
f = 1 GHz
–
50
22
32
18
25
–
50
22
32
18
25
–
50
24
32
18
25
25
2)
2)
–
dB
f = 2 GHz
30
2)
–
dB
f = 1 GHz
20
2)
–
dB
f = 2 GHz
-75
-50
dBm
f = 1 GHz
–
-80
2)
-50
dBm
f = 2 GHz
–
32)
5
μs
f = 1 GHz
5
μs
f = 1 GHz
120
–
μA
–
–
–
dBm
f = 1 GHz
–
toff
–
Current Consumption at Vdd Pin
Idd
–
P0.1dB
2)
2)
Off Switching Time (10-90%) RF
Input 0.1 dB compression
Max.
0.3
–
15
Harmonic Generation up to 12.75 GHz PHarm
Note / Test Condition
1)2)
–
Return Loss
Typ.
Unit
21
0.5
2)
2)
1) @TA= 25 °C
2) Not measured in production, verified by design
Preliminary Data Sheet
11
Revision 1.3, 2009-06-24
BGS12AL7-4
SPDT RF Switch
Measurement Results
5
Measurement Results
Insertion Loss RFin to RF1 / RFin to RF2
Return Loss RFin Port
0
-0.2
-5
-0.4
-10
-0.6
-15
Return Loss (dB)
Insertion Loss (dB)
0.0
-0.8
-1.0
-1.2
-1.4
RF1 mode
RF2 mode
-1.6
-1.8
0.5
1.0
1.5
2.0
2.5
-25
-30
-35
RF1 mode
RF2 mode
-40
-45
-2.0
0.0
-20
3.0
3.5
-50
4.0
0.0
0.5
1.0
1.5
freq, GHz
Return Loss RF1 Port / RF2 Port
2.5
3.0
3.5
4.0
3.5
4.0
Isolation RFin to RF2 / RFin to RF1
0
0
-5
-5
-10
-10
-15
-15
Isolation (dB)
Return Loss (dB)
2.0
freq, GHz
-20
-25
-30
-35
RF1 mode
RF2 mode
-40
-45
-20
-25
-30
-35
RF1 mode
RF2 mode
-40
-45
-50
-50
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0.0
0.5
1.0
1.5
freq, GHz
2.0
2.5
3.0
freq, GHz
Isolation RF1 to RF2 / RF2 to RF1
Pin versus Pout (0.1dB Compression Point)
0
30
no compression
observed up to 24dBm
-5
-10
25
-20
Pout (dBm)
Isolation (dB)
-15
-25
-30
-35
RF1 mode
RF2 mode
-40
-45
-50
0.0
15
RF1/RF2 mode
10
5
0.5
1.0
1.5
2.0
freq, GHz
Figure 3
20
2.5
3.0
3.5
4.0
8
10
12
14
BGS 12AL 7-4_ measurement_results_ V3.vsd
16
18
20
22
24
26
28
30
Pin (dBm)
Measurement Results (@ T = 25°C)
Preliminary Data Sheet
12
Revision 1.3, 2009-06-24
BGS12AL7-4
SPDT RF Switch
Measurement Results
Application Board
BGS12 AL7-4 _application_ board .vsd
Figure 4
Application Board: No External Components Necessary
BGS 12AL 7-4_application _deem bedding _board .vsd
Figure 5
Deembedding Board
Preliminary Data Sheet
13
Revision 1.3, 2009-06-24
BGS12AL7-4
SPDT RF Switch
Package Outlines
6
Package Outlines
Package TSLP7- 4.vsd
Figure 6
Package TSLP7-4
SMD
NSMD
TSLP 7-4_board _ pad _and_ apertures.vsd
Figure 7
Board Pad (SMD) & Apertures
0.5
BGS 12AL 7-4_Tape _and _Reel.vsd
Figure 8
Tape and Reel
Dimensions in mm
You can find all of our packages, sorts of packing and others in our Infineon Internet Page “Products”:
http://www.infineon.com/products.
Preliminary Data Sheet
14
Revision 1.3, 2009-06-24
w w w . i n f i n e o n . c o m
Published by Infineon Technologies AG
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