PANASONIC DN8797MS

Hall ICs
DN8797MS
3 V operation Hall IC
One-way magnetic field operation
Unit: mm
2.80 +0.20
–0.30
■ Overview
1.50 +0.25
–0.05
0.40 +0.10
–0.05
1.45
0.95
0.65±0.15
1
0.95
2.90 +0.20
–0.05
1.90±0.20
0.65±0.15
The DN8797MS is a 3 V operation Hall IC which
includes a Hall element, amplifier circuit, Schmidt circuit,
stabilized power supply and temperature compensation circuit which are integrated on a single chip with a fine patterning technology. The magnetic input signal is outputted by being converted to high or low. We have improved
the conventional circuit to realize a stable operation covering from low to high supply voltage and from low to
high temperature.
3
0.16 +0.10
–0.06
0.10 to 0.30
0.40±0.20
0 to 0.10
■ Features
0.80
1.10 +0.20
–0.10
2
• Wide operating supply voltage range
(VCC = 2.7 V to 14.4 V)
• Wide operating ambient temperature (−40°C to +85°C)
• Package: Mini type (3-pin type)
(1.1 mm thick: Same as a standard transistor)
• Eqipped with an output pull-up resistor (typical 56 kΩ)
MINI-3D
Note) The package of this product will be changed
to lead-free type (MINI-3DA). See the new
package dimensions section later of this
datasheet.
■ Applications
• DC brushless motor, fan motor, rotation sensor, detection of cover open/close (example for a cellular phone),
position sensor
2
VCC
■ Block Diagram
56 kΩ
(typ.)
Constant
voltage source
Comparator
Hall element
GND
1
Out
Amplifier
3
Publication date: November 2002
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DN8797MS
■ Pin Descriptions
Pin No.
Symbol
Description
1
Out
Output pin
2
VCC
Supply voltage pin
3
GND
Ground pin
■ Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
VCC
18
V
VOUT
18
Supply current
ICC

mA
Power dissipation
PD
120
mW
Operating ambient temperature
Topr
−20 to +85
°C
Storage temperature
Tstg
−55 to +125
°C
Supply voltage
Note) 1. Except for the operating ambient temperature and storage temperature, all ratings are for Ta = 25°C.
2. The reverse insertion of this IC will cause its breakdown.
3. It will operate normally in several tens of ms after power on.
4. This IC is not suitable for car electrical equipment.
■ Recommended Operating Range
Parameter
Symbol
Range
Unit
VCC
2.7 to 14.4
V
Supply voltage
■ Electrical Characteristics at Ta = 25°C
Parameter
Symbol
Operating magnetic flux density 1
BH-L
Operating magnetic flux density 2
Conditions
Min
Typ
Max
Unit
VCC = 3 V
−20


mT
BL-H
VCC = 3 V


−3
mT
Hysteresis width
BW
VCC = 3 V
0.2
1.5
4
mT
Output voltage 1
VOL1
VCC = 14.4 V, IO = 5 mA, B = −22 mT

0.07
0.30
V
Output voltage 2
VOL2
VCC = 2.7 V, IO = 5 mA, B = −22 mT

0.07
0.30
V
Output voltage 3
VOH1
VCC = 14.4 V, IO = −20 µA, B = −3 mT
12.8
13.3
13.8
V
Output voltage 4
VOH2
VCC = 2.7 V, IO = −20 µA, B = −3 mT
1.05
1.55
2.05
V
Output short-circuited current
−IOS
VCC = 14.4 V, B = −3 mT, VO = 0 V
0.19
0.27
0.39
mA
Supply current 1
ICC1
VCC = 14.4 V, B = −3 mT
1.0
3.4
6.0
mA
Supply current 2
ICC2
VCC = 2.7 V, B = −3 mT
1.0
2.5
6.0
mA
Note) 1. Symbol BH-L stands for the operating magnetic flux density where its output level varies from high to low.
2. Symbol BL-H stands for the operating magnetic flux density where its output level varies from low to high.
3. The variation of operating magnetic flux density does not depend on supply voltage due to its built-in stabilized power
source. (VCC should be confined to the range of 2.7 V to 14.4 V.)
4. A supply current changes by maximum 1 mA when its output level varies from high to low.
2
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DN8797MS
■ Technical Data
• Position of a Hall element (unit in mm)
Distance from a package surface to sensor part: 0.71 mm
A Hall element is placed on the shaded part in the figure.
0.5
1.2
0.5
0.5
• Magneto-electro conversion characteristics
Output voltage
S
BL-H
BW
BH-L
N
Applied magnetic flux density B
Direction of applied magnetic field
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DN8797MS
■ Technical Data (continued)
• Output Rise Time
(V)
3
2
VCC = 3 V
1
0
0
10
t (ns)
(V)
3
10%
2
− applied magnetic field
90%
1
0
0
10
t (ns)
Output Rise Time
(V)
3
2
− applied magnetic field
1
0
0
1
t (µs)
Output Rise Time
VCC = 3.0 V, Pull-Up-R. = 56 kΩ
Output Rise Time
Sample. 1
− aooliedmagnetic field (µs)
8.98
+ aooliedmagnetic field (ns)
292
4
Sample. 2
Sample. 3
Sample. 4
Sample. 5
Average
7.72
9.18
8.06
8.78
8.74
318
356
280
320
313
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DN8797MS
■ Technical Data (continued)
• Main characterisitcs
Output low voltage  Ambient temperature (VCC = 2.7 V)
Output low voltage  Ambient temperature (VCC = 5.0 V)
IO = 5 mA
IO = 6 mA
IO = 7 mA
IO = 8 mA
IO = 9 mA
IO = 10 mA
IO = 5 mA
IO = 6 mA
IO = 7mA
IO = 8 mA
IO = 9 mA
IO = 10 mA
0.25
Output Low voltage (V)
Output Low voltage (V)
0.25
0.20
0.15
0.10
0.05
0
−50
0
50
100
0.20
0.15
0.10
0.05
0
−50
150
0
Ambient temperature (°C)
50
100
Output low voltage  Ambient temperature (VCC = 20 V)
Output low voltage  Supply voltage (Temp. = −50°C)
IO = 5 mA
IO = 6 mA
IO = 7 mA
IO = 8 mA
IO = 9 mA
IO = 10 mA
IO = 5 mA
IO = 6 mA
IO = 7 mA
IO = 8 mA
IO = 9 mA
IO = 10 mA
0.25
Output Low voltage (V)
Output Low voltage (V)
0.25
0.20
0.15
0.10
0.05
0
−50
0.20
0.15
0.10
0.05
0
0
50
100
0
150
5
10
15
20
Supply voltage (V)
Ambient temperature (°C)
Output low voltage  Supply voltage (Temp. = 25°C)
Output low voltage  Supply voltage (Temp. = 150°C)
IO = 5 mA
IO = 6 mA
IO = 7 mA
IO = 8 mA
IO = 9 mA
IO = 10 mA
IO = 5 mA
IO = 6 mA
IO = 7 mA
IO = 8 mA
IO = 9 mA
IO = 10 mA
0.25
Output Low voltage (V)
0.25
Output Low voltage (V)
150
Ambient temperature (°C)
0.20
0.15
0.10
0.05
0.20
0.15
0.10
0.05
0
0
0
5
10
15
20
Supply voltage (V)
0
5
10
15
20
Supply voltage (V)
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DN8797MS
■ Technical Data (continued)
• Main characterisitcs (continued)
Pull-up resistor  Ambient temperature
Pull-up resistor  Supply voltage
Temp. = −50°C
Temp. = 25°C
Temp. = 150°C
90
90
85
85
Pull-up resistor (kΩ)
Pull-up resistor (kΩ)
IO = 2.7 V
IO = 20 V
80
75
70
65
60
55
50
45
40
−50
80
75
70
65
60
55
50
45
40
0
50
100
150
0
5
Ambient temperature (°C)
Supply current  Ambient temperature
7
7
6
6
Supply current (mA)
Supply current (mA)
20
Temp. = −50°C (Output = High)
Temp. = −50°C(Output = Low)
Temp. = 25°C (Output = High)
Temp. = 25°C (Output = Low)
Temp. = 150°C (Output = High)
Temp. = 150°C (Output = Low)
5
4
3
2
5
4
3
2
1
1
0
0
50
100
150
0
5
10
Supply voltage (V)
Ambient temperature (°C)
6
15
Supply current  Supply voltage
VCC = 2.7 V(Output = High)
VCC = 2.7 V(Output = Low)
VCC = 5.0 V(Output = High)
VCC = 5.0 V(Output = Low)
VCC = 20 V(Output = High)
VCC = 20 V(Output = Low)
0
−50
10
Supply voltage (V)
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20
DN8797MS
■ Technical Data (continued)
• Main characterisitcs (DN8796MS/DN8798MS) (continued)
Operating magnetic flux density (mT)
BL-H-1
BH-L-1
BL-H-2
BH-L-2
BL-H-3
BH-L-3
15
10
5
0
−5
−10
−15
−20
−50
0
50
100
150
Operating magnetic flux density (mT)
Operating magnetic flux density  Ambient temperature (VCC = 2.7 V) Operating magnetic flux density  Ambient temperature (VCC = 3.0 V)
BL-H-1
BH-L-1
BL-H-2
BH-L-2
BL-H-3
BH-L-3
15
10
5
0
−5
−10
−15
−20
−50
Operating magnetic flux density (mT)
BL-H-1
BH-L-1
BL-H-2
BH-L-2
BL-H-3
BH-L-3
15
10
5
0
−5
−10
−15
0
50
50
100
150
100
150
Operating magnetic flux density  Supply voltage
Operating magnetic flux density (mT)
Operating magnetic flux density  Ambient temperature (VCC = 20 V)
−20
−50
0
Ambient temperature (°C)
Ambient temperature (°C)
Ambient temperature (°C)
BL-H (Temp. = −50°C)
BH-L (Temp. = −50°C)
BL-H (Temp. = 150°C)
BH-L (Temp. = 150°C)
10
5
0
−5
−10
−15
−20
0
5
10
15
20
Supply voltage (V)
Operating magnetic flux density (mT)
Operating magnetic flux density  Supply voltage
BL-H (Temp. = −50°C)
BH-L (Temp. = −50°C)
BL-H (Temp. = 150°C)
BH-L (Temp. = 150°C)
10.0
5.0
0.0
−5.0
−10.0
−15.0
−20.0
2.2
2.4
2.6
2.8
3.0
Supply voltage (V)
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DN8797MS
■ Technical Data (continued)
BL-H-1
BH-L-1
BL-H-2
BH-L-2
BL-H-3
BH-L-3
25
20
15
10
5
0
−50
0
50
100
150
BL-H-1
BH-L-1
BL-H-2
BH-L-2
BL-H-3
BH-L-3
Operating magnetic flux density (mT)
Operating magnetic flux density (mT)
• Main characterisitcs (DN8797MS/DN8799MS) (continued)
Operating magnetic flux density  Ambient temperature (VCC = 2.7 V) Operating magnetic flux density  Ambient temperature (VCC = 3.0 V)
25
20
15
10
5
0
−50
0
BL-H-1
BH-L-1
BL-H-2
BH-L-2
BL-H-3
BH-L-3
25
20
15
10
5
0
50
100
150
20
18
16
14
12
10
0
5
18
16
14
12
3.0
Operating magnetic flux density (mT)
Operating magnetic flux density (mT)
20
2.8
20
BW (Temp. = −50°C)
BW (Temp. = 125°C)
5
4
3
2
1
0
0
5
10
Supply voltage (V)
Supply voltage (V)
8
15
Operating magnetic flux density  Supply voltage
BL-H (Temp. = −50°C)
BH-L (Temp. = −50°C)
BL-H (Temp. = 125°C)
BH-L (Temp. = 125°C)
2.6
10
Supply voltage (V)
Operating magnetic flux density  Supply voltage
2.4
150
BL-H (Temp. = −50°C)
BH-L (Temp. = −50°C)
BL-H (Temp. = 125°C)
BH-L (Temp. = 125°C)
Ambient temperature (°C)
10
2.2
100
Operating magnetic flux density  Supply voltage
Operating magnetic flux density (mT)
Operating magnetic flux density (mT)
Operating magnetic flux density  Ambient temperature (VCC = 20 V)
0
−50
50
Ambient temperature (°C)
Ambient temperature (°C)
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20
DN8797MS
■ Caution on Use of Hall ICs
The Hall ICs are often used to detect movement. In such cases, the position of the Hall IC may be changed by
exposition to shock or vibration over a long period of time, and it causes the detection level change. To prevent this, fix
the package with adhesives or fix it on a dedicated case.
1. A case using an adhesive
Some kinds of adhesive generate corrosive gas (such as chloric gas) during curing. This corrosive gas corrodes the
aluminum on the surface of the Hall IC, and may cause a functional defect of disconnection.
If Hall IC is to be sealed after installation, attention should be given to the adhesive or resin used for peripherals
and substrate cleaner, as well as to the adhesive used for Hall IC installation. Please confirm the above matter to those
manufacturers before using.
We could not select the specified adhesive, for we find it difficult to guarantee the ingredient of each adhesive.
2. Power supply line/Power transmission line
If a power supply line/power transmission line becomes longer, noise and/or oscillation may be found on the line.
In this case, set the capacitor of 0.1 µF to 10 µF near the Hall IC to prevent it.
If a voltage of 18 V or more is thought to be applied to the power supply line (flyback voltage from coil or the
ignition pulse, etc.), avoid it with external components (capacitor, resistor, Zener diode, diode, surge absorbing elements,
etc.).
3. On mounting of the surface mount type package (MINI-3D)
When mounted on the printed circuit board, the Hall IC may be highly stressed by the warp that may occur from
the soldering. This may also cause a change in the operating magnetic flux density and a deterioration of its resistance
to moisture.
Wrong
Correct
4. VCC and GND
Do not reverse VCC and GND. If the VCC and GND pins are reversely connected, this IC will be destroyed. If the
IC GND-pin voltage is set higher than other pin voltage, the IC configuration will become the same as a forward
biased diode. Therefore, it will turn on at the diode forward voltage (approximately 0.7 V), and a large current will
flow through the IC, ending up in its destruction. (This is common to monolithic IC.)
5. Cautions on power-on of Hall IC
When a Hall IC is turned on, the position of the magnet or looseness may change the output of a Hall IC, and a pulse
may be generated. Therefore, care should be given whenever the output state of a Hall IC is critical when the supply
power is on.
6. On fixing a Hall IC to holder
When a Hall IC is mounted on the printed circuit board with a holder and the coefficient of expansion of the holder
is large, the lead wire of the Hall IC will be stretched and it may give a stress to the Hall IC.
If the lead wire is stressed intensely due to the distortion of holder or board, the adhesives between the package
and the lead wire may be weakened and cause a minute gap resulting in the deterioration of its resistance to moisture.
Sensitivity may also be changed by this stress.
7. On using flux in soldering
Choose a flux which does not include ingredients from halogen group, such as chlorine, fluorine, etc. The
ingredients of halogen group may enter where the lead frame and package resin joint, causing corrosion and the
disconnection of the aluminum wiring on the surface of an IC chip.
8. In case of the magnetic field of a magnet is too strong
Output may be inverted when applying a magnetic flux density of 100 mT or more. Accordingly, magnetic flux
density should be used within the range of 100 mT.
9. On surface treatment of mini-mold package
Surface treatment is available in either smooth or dull finish.
10. On soldering of the surface mount type package
Surface mounting type Hall ICs are apt to change its electrical characteristics due to the stress from soldering at
mounting. Therefore, avoid the mounting by flow (dipping) and a soldering iron. Please mount it by reflow soldering
abiding by its recommended conditions.
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DN8797MS
■ New Package Dimensions (Unit: mm)
(1.45)
0.40+0.10
-0.05
0.10 M
0.65±0.15
• MINI-3DA (Lead-free package)
0 to 0.10
0.10
2.80+0.20
-0.30
0.11+0.10
-0.05
1.10+0.30
-0.10
2
1.10+0.20
-0.10
1
0.95
0.95
1.90±0.20
2.90+0.20
-0.05
0.65±0.15
1.50+0.25
-0.05
3
0.40±0.20
0.10 to 0.30
Seating plane
10
SPC00008CJB
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government
if any of the products or technologies described in this material and controlled under the "Foreign
Exchange and Foreign Trade Law" is to be exported or taken out of Japan.
(2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license.
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the
product or technologies as described in this material.
(4) The products described in this material are intended to be used for standard applications or general
electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment,
combustion equipment, life support systems and safety devices) in which exceptional quality and
reliability are required, or if the failure or malfunction of the products may directly jeopardize life or
harm the human body.
• Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without
notice for modification and/or improvement. At the final stage of your design, purchasing, or use of
the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that
the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of
incidence of break down and failure mode, possible to occur to semiconductor products. Measures
on the systems such as redundant design, arresting the spread of fire or preventing glitch are
recommended in order to prevent physical injury, fire, social damages, for example, by using the
products.
(7) When using products for which damp-proof packing is required, observe the conditions (including
shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets
are individually exchanged.
(8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written
permission of Matsushita Electric Industrial Co., Ltd.
2002 JUL