RoHS Compliant Solder Reflow Profile - SMD Trimpot® Products Process Description 1. Apply solder paste to test board (8 - 10 mil thick) Materials Temperature • Sn 96.5 / Ag 3.0 / Cu 0.5 Alloy water soluble or no clean solder paste (see note 1) Room temperature Time Interval A) Acceptable (see Figure 1) 2. Place test units onto board 3. Ramp up (see note 2) 2.5 °C ± 0.5 °/sec. 4. Preheat (TS) Convection oven 150 °C to 190 °C 90 ± 30 sec. 5. Time above liquidus (TL) 220 °C 60-90 sec. 6. Peak temperature (TP) 250 °C +0 °/-5 ° 10-20 sec. within 5 °C of peak 7. Ramp down 8. Cleaning water clean profile Inspect solder joint to determine if solder joint is acceptable (i.e. exhibits wetting of joint’s surface). Use the following criteria (ref. acceptability of printed board assemblies, IPC-A-610): High pressure deionized water 60 PSI max. Room temperature (see note 2) 3 °C ± 0.5 °C/sec. 72 °F to 160 °F (22 °C to 71 °C) As required (1) The solder connection wetting angle (solder to component and solder to PCB termination) does not exceed 90 °. (2) Solder balls that do not violate minimum electrical clearances and are attached (soldered) to a metal surface. B) Unacceptable (see Figure 2) (1) Solder connection wetting angle exceeding 90 °. (2) Incomplete reflow of solder paste. (3) Dewetting. If unacceptable, determine cause and correct prior to next run. NOTES: Temperature of Lead/Pad Junction 1. Parts are not hermetically sealed. The seal is to withstand temporary exposure to board processing. (Derived using 6-zone Convection Oven) 2. Recommended to be cooled to room temperature prior to board wash but must be below 40 °C. Refer to ref. temperature profile. Temperature at lead/pad junction with “K” type thermocouple. tp TP CRITICAL ZONE T L TO TP RAMP-UP 3. Units that are board mounted for environmental testing must see a peak temperature in the reflow zone, as specified. This is to ensure that all test units will see “worst case conditions”. TL Temperature tL TS MAX. RAMP-DOWN TS MIN. 4. Ramp down rate to be measured from 250 °C to room temperature. ts PREHEAT 5. Process Description 8 does not apply to open frame trimmers. TROOM 6. Allow 3-6 inches minimum distance between the nozzle head and the device. 8 MINUTES MAX. t 25 *C TO PEAK Time 90 ° 90 ° FIGURE 1 - ACCEPTABLE 90 ° or < 90 ° > 90 ° > 90 ° FIGURE 2 - UNACCEPTABLE > 90 ° REV. 06/16 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.