05-08-1674

BGA Package
84-Lead (15.00mm × 9.00mm × 4.92mm)
(Reference LTC DWG# 05-08-1674 Rev Ø)
A
Z
SEE NOTES
A2
X
SEE NOTES
DETAIL A
7
G
PIN 1
3
A1
A
ccc Z
B
PIN “A1”
CORNER
C
4
b1
MOLD
CAP
b
D
E
SUBSTRATE
H1
H2
F
F
G
Z
// bbb Z
D
DETAIL B
H
J
e
Øb (84 PLACES)
K
ddd M Z X Y
eee M Z
L
M
aaa Z
aaa Z
E
7
Y
PACKAGE TOP VIEW
DETAIL B
PACKAGE SIDE VIEW
5
4
3
2
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
3.810
2.540
2. ALL DIMENSIONS ARE IN MILLIMETERS
1.270
0.315
0.315
1.270
2.540
3.810
0.000
DETAIL A
6
PACKAGE BOTTOM VIEW
DIMENSIONS
6.985
0.630 ±0.025 Ø 84x
5.715
4.445
3.175
1.905
0.635
0.000
0.635
1.905
3.175
4.445
5.715
6.985
SUGGESTED PCB LAYOUT
TOP VIEW
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
H1
H2
aaa
bbb
ccc
ddd
eee
MIN
4.72
0.50
4.22
0.60
0.60
0.27
3.95
NOM
4.92
0.60
4.32
0.75
0.63
15.00
9.00
1.27
13.97
7.62
0.32
4.00
MAX
5.12
0.70
4.42
0.90
0.66
0.37
4.05
0.15
0.10
0.20
0.30
0.15
TOTAL NUMBER OF BALLS: 84
NOTES
3
BALL DESIGNATION PER JESD MS-028 AND JEP95
4
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu
7
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
LTMXXXXXX
µModule
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
BGA 84 0415 REV Ø
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