Product Tape and Reel Specifications

Product Tape and Reel
Specification
 1998-2016 Microchip Technology Inc.
DS00000151J
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
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hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate,
dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ,
KEELOQ logo, Kleer, LANCheck, LINK MD, MediaLB, MOST,
MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo,
RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O
are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
ClockWorks, The Embedded Control Solutions Company,
ETHERSYNCH, Hyper Speed Control, HyperLight Load,
IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut,
BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, Dynamic Average Matching, DAM, ECAN,
EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip
Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker,
Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITYMANAGEMENTSYSTEM
CERTIFIEDBYDNV
== ISO/TS16949==
DS00000151J-page 2
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 1998-2016, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
ISBN: 978-1-5224-0392-0
 1998-2016 Microchip Technology Inc.
Product Tape and Reel Specification
GENERAL INFORMATION
Many Microchip products are available packed into embossed tape that is wound onto a reel. This
document provides the general specifications for such packing.
This specification follows the Electronic Components Industry Association standard EIA-481.
Material from EIA-481-D is used with permission of the Electronic Components Industry
Association. This standard is available for purchase from IHS (www.global.ihs.com).
EMBOSSED TAPE DIMENSIONS
Embossed tape 8-24 mm wide has a single row of sprocket holes along one edge of the tape, as
shown in Figure 1.
Constant dimensions are listed in Table 1.
Variable dimensions, except for the individual cavity dimensions, are listed in Table 2.
Cavity dimensions are listed in Tables 5 through 12.
Embossed tape 32-200 mm wide has single row of sprocket holes along both edges of the tape,
as shown in Figure 2.
Constant dimensions are listed in Table 3.
Variable dimensions, except for the individual cavity dimensions, are listed in Table 4.
Cavity dimensions are listed in Tables 5 through 12.
1998-2016 Microchip Technology Inc.
DS00000151J-page 3
Product Tape and Reel Specification
FIGURE 1: 8, 12, 16 AND 24 mm EMBOSSED CARRIER TAPE DIMENSIONS
P0 [10 pitches cumulative
tolerance on tape ±0.2 mm
T
ØD0
T2
P2
E1
F
K0
S1
T1
W
E2
B0
ØD1
A0
P1
COVER TAPE
DIRECTION OF UNREELING
TABLE 1: Constant Dimensions for Embossed 8 mm~24 mm Carrier Tape
Tape Size
D0
8 mm
12 mm
16 mm
D1
Min.
1.0
1.5
+0.1 / -0.0
24 mm
1.5
1.5
P2
R
(Ref.)
2.0±0.05
25
2.0±0.05
30
2.0±0.1
30
2.0±0.1
30
P0
E1
1.75±0.1
4.0±0.1
1.5
S1
Min.
T
Max.
T1
Max
0.6
0.6
0.1
TABLE 2: Variable Dimensions for Embossed 8 mm~24 mm Carrier Tape
Tape Size
B1
Max.
E2
Max.
F
P1
T2
Max.
W
Max.
8 mm
4.35
6.25
3.5±0.05
2.0±0.5 or
4.0±0.1
2.5
8.3
12 mm
8.2
10.25
5.5±0.05
2.0±0.05 or
4.0±0.1 or
8.0±0.1
6.5
12.3
8.0
16.3
12.0
24.3
16 mm
12.1
14.25
7.5±0.1
4.0±0.05 to
12.0±0.1 in
4.0 increments
24 mm
20.1
22.25
11.5±0.1
4.0±0.05 to
20.0±0.1 in
4.0 increments
A0, B0,
& K0
See Tables 5
through 12
Source: EIA-481
DS00000151J-page 4
1998-2016 Microchip Technology Inc.
Product Tape and Reel Specification
FIGURE 2: 32, 44, 56, 72, 88, 104, 120, 136, 152, 168, 184 and 200 mm EMBOSSED
CARRIER DIMENSIONS
P0 [10 pitches cumulative
tolerance on tape ±0.2 mm
T
ØD0
T2
P2
E1
F
K0
B0
T1
A0
W
ØD1
P1
COVER TAPE
DIRECTION OF UNREELING
TABLE 3: Constant Dimensions for Embossed 32 mm to 200 mm Carrier Tape
Tape Size
D0
D1
Min.
E1
P0
2.0±0.1
32 mm
44 mm
56 mm
P2
1.5
+0.1 / -0.0
2.0
1.75±0.1
4.0±0.1
2.0±0.15
2.0±0.2
R
(Ref.)
T
Max.
T1
Max
0.6
0.1
50
75
72 through 200 mm
1998-2016 Microchip Technology Inc.
DS00000151J-page 5
Product Tape and Reel Specification
TABLE 4: Variable Dimensions for Embossed 32 mm to 200 mm Carrier Tape
Tape Size
B1
Max.
F
P1
±0.1
S0
±0.1
T2
Max.
W
Max.
±0.3
32
23.0
14.2±0.10
4.0 to 32.0
28.4
12.0
32.0
44
35.0
20.2±0.15
4.0 to 44.0
40.4
16.0
44.0
56
46.0
26.2±0.15
4.0 to 56.0
52.4
20.0
56.0
72
60.0
34.2±0.30
68.4
30.0
72.0
188
76.0
42.2±0.30
84.4
30.0
88.0
104
91.0
50.2±0.35
100.4
35.0
104.0
120
107.0
58.2±0.35
116.4
40.0
120.0
136
123.0
66.2±0.40
132.4
40.0
136.0
152
139.0
74.2±0.40
148.4
40.0
152.0
168
153.0
82.2±0.45
164.4
40.0
168.0
184
169.0
90.2±0.45
180.4
40.0
184.0
200
185.0
98.2±0.50
196.4
40.0
200.0
4.0 to 72.0
A0, B0,
& K0
See Tables5
through 12
Source: EIA-481
INDEX MARKING QUADRANTS
Most devices have an index marking on the top surface, indicating the location of terminal 1 or A1,
as appropriate. The location of the index within the cavity is indicated by dividing the cavity into
numbered quadrants, and listing the quadrant in which the index mark appears.
FIGURE 3: INDEX MARKING QUADRANTS
Source: EIA-481
DS00000151J-page 6
1998-2016 Microchip Technology Inc.
Product Tape and Reel Specification
FIGURE 4: TERMINAL 1 (OR A1) INDEX MARKING QUADRANT EXAMPLES
EMBOSSED TAPE DIMENSION TABLES
The following tables list carrier tape and cavity dimensions by package type. The tables are
organized as follows:
• Table 5
Plastic Products with Leads
• Table 6
No-Lead Plastic Products (DFN, QFN, SON, etc.)
• Table 7
Grid Array Products (LGA, BGA, etc.)
• Table 8
Modules and System in Package (SiP) Products
• Table 9
SMSC Automotive (AIS) Products
• Table 10 SMSC Commercial Products
• Table 11 Supertex Products
• Table 12 ISSC Products
1998-2016 Microchip Technology Inc.
DS00000151J-page 7
Product Tape and Reel Specification
Body Size
Carrier Dimensions
(mm)
Cavity Dimensions
(mm)
W
P
A0
B0
K0
Index
Quadrant
Package
Type
Terminal
Count
TABLE 5: Microchip Technology Plastic Products, With Leads, Carrier Tape and Cavity
Dimensions
DDPAK
3
24
16
10.6
15.8
4.9
2
DDPAK
5
24
16
10.6
15.8
4.9
2
DDPAK
7
24
16
10.6
15.8
4.9
2
LQFP
20x20 mm
144
44
32
23.5
23.5
2
2
MQFP
10x10x2 mm
44
24
24
14.2
14.2
2.8
2
MQFP
14x14x2.7 mm
64
32
24
18
18
3.6
2
MSOP
3x3x1.0 mm
8
12
8
5.3
3.4
1.4
1
MSOP
3x3x1.0 mm
8
12
8
5.3
3.4
1.4
1
MSOP
3x3x1.0 mm
10
12
8
5.3
3.4
1.4
1
MSOP
3x3x1.0 mm
10
12
8
5.3
3.4
1.4
1
PLCC
11.5x11.5x 0.3 mm
28
24
16
13
13
4.9
1-2
PLCC
11.5x11.5x 0.3 mm
28
24
16
13
13
4.9
1-2
PLCC
11.5x11.5x 0.3 mm
32
24
16
13.1
15.5
3.9
1-2
PLCC
11.5x11.5x 0.3 mm
44
32
24
18
18
4.9
1-2
PLCC
11.5x11.5x 0.3 mm
44
32
24
18
18
4.9
1-2
PLCC
11.5x11.5x 0.3 mm
68
44
32
25.6
25.6
5.7
1-2
PLCC
11.5x11.5x 0.3 mm
68
44
32
25.6
25.6
5.8
1-2
PLCC
11.5x11.5x 0.3 mm
68
44
32
25.6
25.6
5.3
1-2
PLCC
11.5x11.5x 0.3 mm
84
44
36
30.7
30.7
5.8
1-2
QSOP
.150 in.
16
12
8
6.4
5.2
2.1
2
QSOP
.150 in.
16
12
8
6.4
5.2
2.1
2
QSOP
.150 in.
16
12
8
6.23
5.4
2.12
2
QSOP
.150 in.
16
12
8
6.5
5.2
2.1
2
SC70
3
8
4
2.4
2.6
1.2
3
SC70
5
8
4
2.25
2.4
1.22
3
SC70
6
8
4
2.25
2.4
1.22
3
SOIC
.150 in.
8
12
8
6.4
5.2
2.1
1
SOIC
.150 in.
8
12
8
6.5
5.2
2.1
1
DS00000151J-page 8
1998-2016 Microchip Technology Inc.
Product Tape and Reel Specification
Body Size
Carrier Dimensions
(mm)
Cavity Dimensions
(mm)
W
P
A0
B0
K0
Index
Quadrant
Package
Type
Terminal
Count
TABLE 5: Microchip Technology Plastic Products, With Leads, Carrier Tape and Cavity
Dimensions (Continued)
SOIC
.150 in.
8
12
8
6.4
5.2
2.1
1
SOIC
.150 in.
8
12
8
6.4
5.2
2.1
1
SOIC
.150 in.
8
12
8
6.4
5.2
2.1
1
SOIC
.150 in.
14
16
8
6.5
9.5
2.1
1
SOIC
.150 in.
14
16
8
6.4
9.05
2.1
1
SOIC
.150 in.
14
16
8
6.55
9.5
2.1
1
SOIC
.150 in.
16
16
8
6.5
10.3
2.1
1
SOIC
.150 in.
16
16
8
6.5
10.3
2
1
SOIC
.208 in.
8
16
12
8.3
5.7
2.3
1
SOIC
.300 in.
16
16
12
10.9
10.7
3
1
SOIC
.300 in.
18
24
16
11.1
12
2.8
1
SOIC
.300 in.
18
24
16
11.05
12.04
2.84
1
SOIC
.300 in.
18
24
16
11.1
12
2.8
1
SOIC
.300 in.
18
24
12
10.9
13.3
3
1
SOIC
.300 in.
20
24
12
10.9
13.3
3
1
SOIC
.300 in.
24
24
12
10.9
16
3
1
SOIC
.300 in.
28
24
12
10.9
18.5
3
1
SOIC
.300 in.
28
24
12
10.9
18.5
3
1
SOIC
.300 in.
28
24
12
10.9
18.5
3
1
SOT-143
4
8
4
3.19
2.8
1.31
3
SOT-223
3
12
8
6.83
7.42
1.88
3
12
8
6.83
7.42
1.88
SOT-223
SOT-23
3
8
4
3.15
2.77
1.22
2
SOT-23
5
8
4
3.23
3.17
1.37
2
SOT-23
6
8
4
3.23
3.17
1.37
2
SOT-23A
(Torex)
3
8
4
3.25
3.15
1.55
2
SOT-89
3
12
8
4.7
4.5
1.7
3
SOT-89
3
12
8
4.8
4.4
1.8
3
1998-2016 Microchip Technology Inc.
DS00000151J-page 9
Product Tape and Reel Specification
Body Size
Carrier Dimensions
(mm)
Cavity Dimensions
(mm)
W
P
A0
B0
K0
Index
Quadrant
Package
Type
Terminal
Count
TABLE 5: Microchip Technology Plastic Products, With Leads, Carrier Tape and Cavity
Dimensions (Continued)
SSOP
.150 in.
20
16
12
8.4
7.7
2.5
1
SSOP
.150 in.
20
16
12
8.4
7.6
2.5
1
SSOP
.150 in.
24
16
12
8.4
8.7
2.5
1
SSOP
.150 in.
28
24
12
8.3
10.7
2.2
1
SSOP
.150 in.
28
24
12
8.3
10.7
2.2
1
TO-92
2
18
12.7
TO-92
3
18
12.7
See Figure 14 and
Table 15
–
–
TQFP
10x10x1.0 mm
44
24
16
12.45
12.45
1.6
2
TQFP
10x10x1.0 mm
44
24
16
12.4
12.4
1.6
2
TQFP
10x10x1.0 mm
64
24
16
12.45
12.45
1.6
2
TQFP
10x10x1.0 mm
64
24
16
12.4
12.4
1.6
2
TQFP
12x12x1.0 mm
80
24
24
14.5
14.5
1.5
2
TQFP
12x12x1.0 mm
100
24
24
14.5
14.5
1.5
2
TQFP
14x14x1.0 mm
64
24
20
16.5
16.5
1.9
2
TQFP
14x14x1.0 mm
80
24
20
16.5
16.5
1.9
2
TQFP
14x14x1.0 mm
100
24
20
16.5
16.5
1.9
2
TQFP
16x16x1.0 mm
144
32
24
19
19
1.7
2
TQFP
7x7x1.0 mm
32
16
12
9.6
9.6
1.85
2
TQFP
7x7x1.0 mm
48
16
12
9.6
9.6
1.85
2
TSOP
12x20 mm
48
32
16
12.5
20.6
2.1
2
TSOP
8x14 mm
32
24
12
8.6
14.5
1.8
2
TSOP
8x20 mm
28
32
16
8.6
20.6
2.1
2
TSOP
8x20 mm
28
32
16
8.6
20.6
2.1
2
TSOP
8x20 mm
32
32
16
8.6
20.6
2.1
2
TSOP
8x20 mm
32
32
16
8.6
20.6
2.1
2
TSSOP
4.4 mm
8
12
8
6.75
3.4
1.3
1
TSSOP
4.4 mm
14
16
8
6.8
5.4
1.6
1
TSSOP
4.4 mm
14
16
8
6.8
5.4
1.6
1
DS00000151J-page 10
1998-2016 Microchip Technology Inc.
Product Tape and Reel Specification
Body Size
Carrier Dimensions
(mm)
Cavity Dimensions
(mm)
W
P
A0
B0
K0
Index
Quadrant
Package
Type
Terminal
Count
TABLE 5: Microchip Technology Plastic Products, With Leads, Carrier Tape and Cavity
Dimensions (Continued)
TSSOP
4.4 mm
14
16
8
6.8
5.4
1.6
1
TSSOP
4.4 mm
16
16
8
6.8
5.4
1.6
1
TSSOP
4.4 mm
16
16
8
6.8
5.4
1.6
1
TSSOP
4.4 mm
16
16
8
6.8
5.4
1.6
1
TSSOP
4.4 mm
20
16
8
6.8
6.9
1.6
1
TSSOP
4.4 mm
20
16
8
6.8
6.9
1.6
1
28
24
12
8.7
13.9
2.1
1-2
VSOP
1998-2016 Microchip Technology Inc.
DS00000151J-page 11
Product Tape and Reel Specification
Body Size
Carrier
Dimensions
(mm)
Cavity Dimensions (mm)
W
P
A0
B0
K0
Index
Quadrant
Package Type
Terminal
Count
TABLE 6: Microchip Technology Plastic Products, With No Leads, Carrier Tape and
Cavity Dimensions
DFN
2.5x2 mm
10
8
4
2.19
2.77
1.05
2
DFN
2x2x0.9 mm
6
8
4
2.3
2.3
1
2
DFN
2x2x0.9 mm
6
8
4
2.25
2.25
1
2
DFN
2x3x0.9 mm
6
8
4
2.3
3.2
1
2
DFN
2x3x0.9 mm
6
8
4
2.25
3.35
1.05
2
DFN
2x3x0.9 mm
6
12
8
2.2
3.2
1.1
2
DFN
2x3x0.9 mm
8
8
4
2.3
3.2
1
2
DFN
2x3x0.9 mm
8
8
4
2.25
3.35
1.05
2
DFN
2x3x0.9 mm
8
12
8
2.2
3.2
1.1
2
DFN
2x3x0.9 mm
8
12
4
2.3
3.3
1.1
2
DFN
3x3x0.9 mm
6
12
8
3.3
3.3
1.1
2
DFN
3x3x0.9 mm
6
12
8
3.3
3.3
1
2
DFN
3x3x0.9 mm
8
12
8
3.3
3.3
1.1
2
DFN
3x3x0.9 mm
8
12
8
3.3
3.3
1
2
DFN
3x3x0.9 mm
10
12
8
3.3
3.3
1.1
2
DFN
3x3x0.9 mm
10
12
8
3.3
3.3
1
2
DFN
4x4x09 mm
8
12
8
4.35
4.35
1.1
2
DFN
4x4x09 mm
16
12
8
4.35
4.35
1.1
2
DFN
4x4x09 mm
20
12
8
4.35
4.35
1.1
2
DFN
4x4x09 mm
24
12
8
4.35
4.35
1.1
2
DFN
4x4x09 mm
28
12
8
4.35
4.35
1.1
2
DFN-S
4x4x0.9 mm
8
12
8
4.35
4.35
1.1
2
DFN-S
5x6x0.9 mm
8
12
8
5.3
6.3
1.2
2
DFN-S
5x6x0.9 mm
8
16
12
5.3
6.3
1.3
2
DQFN
11x11 mm
132
24
16
11.4
11.4
1.2
2
QFN
3x3x0.9 mm
16
12
8
3.3
3.3
1.1
2
QFN
3x3x0.9 mm
16
12
8
3.3
3.3
1
2
QFN
4x4x0.9 mm
8
12
8
4.35
4.35
1.1
2
QFN
4x4x0.9 mm
8
12
8
4.35
4.35
1.1
2
DS00000151J-page 12
1998-2016 Microchip Technology Inc.
Product Tape and Reel Specification
Body Size
Carrier
Dimensions
(mm)
Cavity Dimensions (mm)
W
P
A0
B0
K0
Index
Quadrant
Package Type
Terminal
Count
TABLE 6: Microchip Technology Plastic Products, With No Leads, Carrier Tape and
Cavity Dimensions (Continued)
QFN
4x4x0.9 mm
16
12
8
4.35
4.35
1.1
2
QFN
4x4x0.9 mm
16
12
8
4.35
4.35
1.1
2
QFN
4x4x0.9 mm
20
12
8
4.35
4.35
1.1
2
QFN
4x4x0.9 mm
20
12
8
4.35
4.35
1.1
2
QFN
4x4x0.9 mm
24
12
8
4.35
4.35
1.1
2
QFN
4x4x0.9 mm
24
12
8
4.35
4.35
1.1
2
QFN
4x4x0.9 mm
28
12
8
4.35
4.35
1.1
2
QFN
4x4x0.9 mm
28
12
8
4.35
4.35
1.1
2
QFN
5x5x0.9 mm
20
12
8
5.25
5.25
1.1
2
QFN
5x5x0.9 mm
28
12
8
5.25
5.25
1.1
2
QFN
6x6x0.9 mm
28
16
12
6.3
6.3
1.1
2
QFN
6x6x0.9 mm
28
16
12
6.3
6.3
1.1
2
QFN
6x6x0.9 mm
28
16
12
6.3
6.3
1.1
2
QFN
7x7x0.9 mm
48
16
12
7.25
7.25
1.1
1
QFN
7x7x0.9 mm
56
16
12
7.25
7.25
1.1
2
QFN
8x8x0.9 mm
40
16
12
8.3
8.3
1.1
2
QFN
8x8x0.9 mm
40
16
12
8.3
8.3
1.1
2
QFN
8x8x0.9 mm
44
16
12
8.3
8.3
1.1
2
QFN
8x8x0.9 mm
44
16
12
8.3
8.3
1.1
2
QFN
9x9x0.9 mm
64
16
12
9.3
9.3
1.1
2
TDFN
2x3x0.8 mm
6
8
4
2.3
3.2
1
2
TDFN
2x3x0.8 mm
6
8
4
2.25
3.35
1.05
2
TDFN
2x3x0.8 mm
6
12
8
2.2
3.2
1.1
2
TDFN
2x3x0.8 mm
8
8
4
2.3
3.2
1
2
TDFN
2x3x0.8 mm
8
8
4
2.25
3.35
1.05
2
TDFN
2x3x0.8 mm
8
12
8
2.2
3.2
1.1
2
TDFN
3x3x0.8 mm
10
12
8
3.3
3.3
1.1
2
TDFN
3x3x0.8 mm
10
12
8
3.3
3.3
1
2
TDFN-S
5x6x0.8 mm
8
12
8
5.3
6.3
1.2
2
1998-2016 Microchip Technology Inc.
DS00000151J-page 13
Product Tape and Reel Specification
Body Size
Carrier
Dimensions
(mm)
Cavity Dimensions (mm)
W
P
A0
B0
K0
Index
Quadrant
Package Type
Terminal
Count
TABLE 6: Microchip Technology Plastic Products, With No Leads, Carrier Tape and
Cavity Dimensions (Continued)
TDFN-S
5x6x0.8 mm
8
16
12
5.3
6.3
1.3
2
UDFN
2x3x0.5 mm
8
12
4
2.3
3.3
0.8
2
UDFN
3x3x0.5 mm
10
12
8
3.4
3.4
0.55
2
UDFN
3x3x0.5 mm
10
12
8
3.3
3.3
0.8
2
UQFN
3x1.6x0.55 mm
6
12
8
1.95
3.5
0.75
2
UQFN
3x3x0.5 mm
10
12
8
3.4
3.4
0.55
2
UQFN
3x3x0.5 mm
16
12
8
3.4
3.4
0.55
2
UQFN
3x3x0.5 mm
20
12
8
3.4
3.4
0.55
2
UQFN
4x4x0.5 mm
28
12
8
4.25
4.25
0.9
2
UQFN
5x5x0.5 mm
40
12
8
5.3
5.3
0.75
2
UQFN
6x6x0.5 mm
48
16
12
6.3
6.3
0.9
2
UQFN
6x6x0.5 mm
48
16
12
6.3
6.3
0.8
2
VQFN
10x10x1.0
72
24
12
10.4
10.4
1.4
2
WSON
5x6x0.8 mm
8
16
8
5.6
6.6
1.5
2
X2QFN
2.5x2.5x0.4 mm
16
8
4
2.74
2.74
0.69
2
X2SON
2x2x0.4 mm
8
8
4
2.24
2.24
0.75
2
XSON
1.5x1.5x0.45 mm
6
8
4
1.65
1.65
0.71
2
XSON
2x2x0.45 mm
8
8
4
2.24
2.24
0.75
2
DS00000151J-page 14
1998-2016 Microchip Technology Inc.
Product Tape and Reel Specification
LBGA
Body Size
12x24 mm
91
Carrier
Dimensions
(mm)
Cavity Dimensions (mm)
Index
Quadrant
Package Type
Terminal
Count
TABLE 7: Microchip Technology Grid Array Products Carrier Tape and Cavity
Dimensions
W
P
A0
B0
K0
44
16
12.5
24.5
2.4
1
16
12
6.5
8.5
2.1
1
LFBGA
6X8 mm
LFBGA
8x10 mm
56
24
12
8.2
10.4
1.7
1
LFBGA
8x10 mm
62
24
12
8.2
10.4
1.7
1
LFBGA
8x10 mm
63
24
12
8.2
10.4
1.7
1
LFBGA
8x10 mm
64
24
12
8.2
10.4
1.7
1
TBGA
10x13
80
24
16
10.6
13.6
1.9
1
TFBGA
10x10x1.0 mm
121
24
12
10.3
10.3
1.5
1
TFBGA
12x12x1.2 mm
176
24
16
12.6
12.6
1.9
1
TFBGA
6x6 mm
84
12
8
6.3
6.3
1.3
1
TFBGA
6x8x1.0 mm
48
16
12
6.5
8.5
2.1
1
TFBGA
8x10x1.2 mm
48
24
12
8.2
10.4
1.7
1
TFBGA
9x9x1.2 mm
84
16
12
9.25
9.25
2.1
1
VFBGA
6x8x0.8 mm
44
16
12
6.5
8.5
2.1
1
VFBGA
6x8x0.8 mm
56
16
12
6.5
8.5
2.1
1
WFBGA
4x6x0.8 mm
34
12
8
4.4
6.4
1.4
1
WFBGA
4x6x0.8 mm
48
12
8
4.4
6.4
1.4
1
WFBGA
5x6x0.8 mm
48
12
8
5.3
6.3
1.2
1
WFBGA
6x6x0.8 mm
64
16
12
6.3
6.3
0.9
1
WFBGA
8x8x08 mm
100
16
12
8.3
8.3
0.9
1
WFBGA
9x9x0.65 mm
144
16
12
9.6
9.9
0.9
1
XFBGA
7x7x0.5 mm
144
16
12
7.25
7.25
0.75
1
XFLGA
4x6x0.6 mm
48
12
8
4.4
6.4
1.4
1
XFLGA
5x6x0.6 mm
48
12
8
5.3
6.3
1.2
1
1998-2016 Microchip Technology Inc.
DS00000151J-page 15
Product Tape and Reel Specification
TABLE 8: Microchip Technology Module and System-In-Package (SiP) Carrier
RF Module (MA)
RF Module (MB, MC)
DS00000151J-page 16
Body Size
Carrier
Dimensions
(mm)
Cavity Dimensions (mm)
W
P
A0
B0
K0
Reel
Dia.
Index
Quadrant
Package Type
Terminal
Count
Tape and Cavity Dimensions
13.4x25.8x2 mm
35
44
24
18.2
28.35
2.5
330
1
15.4x22.0x1.85 mm
38
44
24
18.2
28.35
2.5
330
1
1998-2016 Microchip Technology Inc.
Product Tape and Reel Specification
Body Size
Carrier
Dimensions
(mm)
Cavity Dimensions (mm)
W
P
A0
B0
K0
Index
Quadrant
Package Type
Terminal
Count
TABLE 9: SMSC Automotive (AIS) Products Carrier Tape and Cavity Dimensions
BGA
12x12 mm
196
24
24
12.5
12.5
1.8
1
LQFP
10x10x1.4 mm
44
24
16
12.35
12.35
2.2
1
LQFP
14x14x1.4 mm
100
32
24
16.8
16.8
2.1
1
MQFP
14x20x2.7 mm
128
44
24
18.9
24.9
3.9
1
QFN
4x4x0.9 mm
16
12
8
4.35
4.35
1.1
1
QFN
4x4x0.9 mm
20
12
8
4.35
4.35
1.1
1
QFN
4x4x0.9 mm
24
12
8
4.35
4.35
1.1
1
QFN
5x5x0.9 mm
28
12
8
5.25
5.25
1.1
1
QFN
5x5x0.9 mm
32
12
8
5.25
5.25
1.1
1
QFN
6x6x0.9 mm
36
16
12
6.3
6.3
1.1
1
QFN
6x6x0.9 mm
40
16
12
6.3
6.3
1.1
1
QFN
7x7x0.9 mm
48
16
12
7.25
7.25
1.1
1
QFN
7x7x0.9 mm
56
16
12
7.25
7.25
1.1
1
QFN
8x8x0.9 mm
56
16
12
8.3
8.3
1.4
1
QFN
9x9x0.9 mm
64
16
12
9.3
9.3
1.1
1
QFN
10x10x0.9 mm
72
24
12
10.4
10.4
1.4
1
SiP
12.42x8.92x1.98 mm
45
24
12
9.3
12.75
2.3
2
SOIC
.150 in.
8
12
8
6.4
5.2
2.1
1
SOIC
.300 in.
28
32
16
10.9
18.5
3.2
1
TQFP
10x10x1.0 mm
44
24
16
12.45
12.45
1.6
1
TQFP
10x10x1.0 mm
64
24
16
12.45
12.45
1.6
1
TQFP
14x14x1.0 mm
128
24
20
16.5
16.5
1.55
1
1998-2016 Microchip Technology Inc.
DS00000151J-page 17
Product Tape and Reel Specification
DFN
Body Size
Carrier
Dimensions
(mm)
Cavity Dimensions (mm)
W
P
A0
B0
K0
Index
Quadrant
Package Type
Terminal
Count
TABLE 10: SMSC Commercial Products Carrier Tape and Cavity Dimensions
3x3x0.9 mm
16
12
8
3.3
3.3
1.1
1
LFBGA
13x13x1.3 mm
225
24
16
13.3
13.3
2.25
1
LFBGA
27x27x1.6 mm
324
44
32
27.5
27.5
3.6
1
MSOP
3x3x1.0 mm
8
12
8
5.3
3.4
1.4
1
MSOP
3x3x1.0 mm
10
12
8
5.3
3.4
1.4
1
PLCC
11.5x11.5x4.3 mm
28
24
16
13
13
4.9
1-2
QFN
1.8x1.3x0.55 mm
10
8
4
1.49
1.99
0.75
1
QFN
10x10x0.9 mm
72
24
12
10.4
10.4
1.4
1
QFN
2.1.x1.6x0.55 mm
10
8
4
1.75
2.25
0.81
1
QFN
3x3x0.9 mm
16
12
8
3.3
3.3
1.1
1
QFN
4x4x0.9 mm
12
12
8
4.35
4.35
1.1
1
QFN
4x4x0.9 mm
16
12
8
4.35
4.35
1.1
1
QFN
4x4x0.9 mm
20
12
8
4.35
4.35
1.1
1
QFN
4x4x0.9 mm
24
12
8
4.35
4.35
1.1
1
QFN
5x5x0.9 mm
28
12
8
5.25
5.25
1.1
1
QFN
5x5x0.9 mm
32
12
8
5.25
5.25
1.1
1
QFN
6x6x0.9 mm
36
16
12
6.3
6.3
1.1
1
QFN
6x6x0.9 mm
40
16
12
6.3
6.3
1.1
1
QFN
7x7x0.9 mm
48
16
12
7.25
7.25
1.1
1
QFN
7x7x0.9 mm
56
16
12
7.25
7.25
1.1
1
QFN
8x8x0.9 mm
56
16
12
8.3
8.3
1.4
1
QFN
9x9x0.9 mm
64
16
12
9.3
9.3
1.1
1
QFP
14x20 mm
100
44
32
19
25
3.9
1
SOIC
.150 in.
8
12
8
6.4
5.2
2.1
1
SOIC
.150 in.
14
16
8
6.5
9.5
2.1
1
SOIC
.150 in.
16
12
8
6.4
5.2
2.1
1
QSOP
.150 in.
24
16
8
6.5
9.5
2.3
1
QSOP
.150 in.
28
16
8
6.5
10.3
2.3
1
TDFN
2x3x0.75 mm
8
12
8
2.2
3.2
1.1
2
DS00000151J-page 18
1998-2016 Microchip Technology Inc.
Product Tape and Reel Specification
TFBGA
Body Size
Carrier
Dimensions
(mm)
Cavity Dimensions (mm)
W
P
A0
B0
K0
Index
Quadrant
Package Type
Terminal
Count
TABLE 10: SMSC Commercial Products Carrier Tape and Cavity Dimensions (Continued)
7x7x1.0 mm
144
16
12
7.3
7.3
2.1
1
TQFP
14x14x1.0 mm
128
24
20
16.5
16.5
1.55
1
TSOT
2.9x1.6 mm
5
8
4
3.23
3.17
1.37
2
TSOT
2.9x1.6 mm
6
8
4
3.23
3.17
1.37
2
UFBGA
3x3x0.6 mm
25
12
8
3.3
3.3
1.1
1
VFBGA
3x3x0.6 mm
25
12
8
3.3
3.3
1.1
1
VFBGA
4x4x0.8 mm
40
12
8
4.35
4.35
1.1
1
WFBGA
11x11x0.8 mm
169
24
16
11.4
11.4
1.2
1
WLCSP
2x2x0.62 mm
25
8
4
2.18
2.18
0.81
1
1998-2016 Microchip Technology Inc.
DS00000151J-page 19
Product Tape and Reel Specification
CERQUAD
Body Size
Carrier
Dimensions (mm)
Cavity Dimensions
(mm)
W
P
A0
B0
K0
Index
Quadrant
Package Type
Terminal
Count
TABLE 11: Supertex Products Carrier Tape and Cavity Dimensions
.650x.650 in.
44
32
24
18
18
4.9
1-2
FPBGA
5.7x5 mm
25
12
8
6.25
5.25
1.4
1
FPBGA
6x5.35 mm
26
16
8
5.5
6.5
1.2
2
LQFP
7x7x1.4 mm
32
16
12
9.8
9.8
1.7
1
LQFP
7x7x1.4 mm
32
16
12
9.6
9.6
1.85
1
LQFP
7x7x1.4 mm
48
16
12
9.8
9.8
1.7
1
LQFP
7x7x1.4 mm
48
16
12
9.6
9.6
1.85
1
MSOP
3x3 mm
8
12
8
5.3
3.4
1.4
1
MSOP
3x3 mm
8
12
8
5.3
3.4
1.4
1
MSOP
3x3 mm
10
12
8
5.3
3.4
1.4
1
MSOP
3x3 mm
10
12
8
5.3
3.4
1.4
1
PLCC
11.5x11.5x4.3 mm
28
24
16
13
13
4.9
1-2
PLCC
11.5x11.5x4.3 mm
28
24
16
13
13
4.9
1-2
PLCC
44
32
24
18
18
4.9
1-2
PLCC
44
32
24
18
18
4.1
1-2
PQFP (FP=3.9mm)
10x10x2 mm
44
24
24
15.35
15.35
2.7
1
QFN
4x4x0.9 mm
16
12
8
4.3
4.3
1.25
2
QFN
4x4x0.9 mm
16
12
8
4.35
4.35
1.1
2
QFN
4x4x0.9 mm
16
12
8
4.35
4.35
1.1
2
QFN
4x4x0.9 mm
16
12
8
4.25
4.25
1.13
2
QSOP
7.5 mm (.300 in.)
44
32
12
10.9
18.3
3
1
SOIC
.150 in.
8
12
8
6.4
5.2
2.1
1
SOIC
.150 in.
8
12
8
6.4
5.2
2.1
1
SOIC
.150 in.
8
12
8
6.5
5.2
2.1
1
SOIC
.150 in.
8
12
8
6.5
5.4
2
1
SOIC
.150 in.
8
12
8
6.5
5.3
2.1
1
SOIC
.150 in.
14
16
8
6.55
9.5
2.1
1
SOIC
.150 in.
14
16
8
6.5
9.5
2.1
1
SOIC
.150 in.
14
16
8
6.5
9.5
2.3
1
DS00000151J-page 20
1998-2016 Microchip Technology Inc.
Product Tape and Reel Specification
Body Size
Carrier
Dimensions (mm)
Cavity Dimensions
(mm)
W
P
A0
B0
K0
Index
Quadrant
Package Type
Terminal
Count
TABLE 11: Supertex Products Carrier Tape and Cavity Dimensions (Continued)
SOIC
.150 in.
16
16
8
6.5
10.3
2.1
1
SOIC
.300 in.
16
8
8
6.55
10.38
2.1
1
SOIC
.300 in.
20
24
12
10.9
13.3
3
1
SOIC
.300 in.
20
24
12
10.9
13.3
3
1
SOIC
.300 in.
24
24
12
10.9
16
3
1
SOIC
.300 in.
24
24
12
10.8
15.9
3.2
1
SOIC
.300 in.
28
32
12
10.9
18.3
3
1
SOIC
.300 in.
16
16
12
10.9
10.7
3
1
SOIC
.300 in.
16
16
12
10.9
10.7
3.2
1
SOT-223
3
12
8
6.83
7.42
1.88
3
SOT-23
3
8
4
3.15
2.77
1.22
3
SOT-23
5
8
4
3.23
3.17
1.37
3
SOT-89
3
12
8
4.6
4.78
1.91
4
SOT-89
3
12
8
4.52
4.84
1.84
4
TO-252 (D-Pak)
3
16
12
10.3
6.9
2.6
4
TO-252 (D-Pak)
5
16
12
10.3
6.9
2.6
4
TO-92
3
TSSOP
See Figure 14 and Table 15
–
4.4 mm
24
16
8
6.9
9
1.7
1
VDFN
3x4x1.0 mm
10
12
8
3.3
4.3
1.2
2
VDFN
4x4x1.0 mm
8
12
8
4.35
4.35
1.1
1
VDFN
4x4x1.0 mm
8
12
8
4.3
4.3
1.1
1
VDFN
4x4x1.0 mm
12
12
8
4.3
4.3
1.25
1
VDFN
4x4x1.0 mm
12
12
8
4.35
4.35
1.1
1
VDFN
4x4x1.0 mm
12
12
8
4.25
4.25
1.13
1
VDFN
5x5x1.0 mm
8
12
8
5.25
5.25
1.1
1
VDFN
5x5x1.0 mm
8
12
8
5.3
5.3
1.25
1
VDFN
5x5x1.0 mm
18
12
8
5.25
5.25
1.1
1
VDFN
5x5x1.0 mm
18
12
8
5.3
5.3
1.25
1
VQFN
3x3x0.9 mm
16
12
8
3.3
3.3
1.1
1
1998-2016 Microchip Technology Inc.
DS00000151J-page 21
Product Tape and Reel Specification
Body Size
Carrier
Dimensions (mm)
Cavity Dimensions
(mm)
W
P
A0
B0
K0
Index
Quadrant
Package Type
Terminal
Count
TABLE 11: Supertex Products Carrier Tape and Cavity Dimensions (Continued)
VQFN
3x3x0.9 mm
16
12
8
3.3
3.3
1
1
VQFN
3x3x0.9 mm
16
12
8
3.25
3.25
1.15
1
VQFN
3x3x0.9 mm
16
12
8
3.25
3.25
1.25
1
VQFN
4x4x0.9 mm
12
12
8
4.3
4.3
1.25
1
VQFN
4x4x0.9 mm
12
12
8
4.35
4.35
1.1
1
VQFN
4x4x0.9 mm
12
12
8
4.35
4.35
1.1
1
VQFN
4x4x0.9 mm
12
12
8
4.25
4.25
1.13
1
VQFN
4x4x0.9 mm
24
12
8
4.3
4.3
1.25
1
VQFN
4x4x0.9 mm
24
12
8
4.35
4.35
1.1
1
VQFN
4x4x0.9 mm
24
12
8
4.25
4.25
1.13
1
VQFN
4x4x1.0 mm
16
12
8
4.3
4.3
1.25
1
VQFN
4x4x1.0 mm
16
12
8
4.35
4.35
1.1
1
VQFN
4x4x1.0 mm
16
12
8
4.25
4.25
1.13
1
VQFN
5x5x1.0 mm
32
12
8
5.25
5.25
1.1
1
VQFN
5x5x1.0 mm
32
12
8
5.3
5.3
1.25
1
VQFN
6x6x1.0 mm
33
16
12
6.3
6.3
1.1
1
VQFN
6x6x1.0 mm
33
16
12
6.3
6.3
1
1
VQFN
6x6x1.0 mm
40
16
12
6.3
6.3
1.1
1
VQFN
6x6x1.0 mm
40
16
12
6.3
6.3
1
1
VQFN
7x7x1.0 mm
48
16
12
7.35
7.35
1.25
1
VQFN
7x7x1.0 mm
48
16
12
7.25
7.25
1.1
1
VQFN
8x8x1.0 mm
56
16
12
8.3
8.3
1.1
1
VQFN
8x8x1.0 mm
56
16
12
8.4
8.4
1.25
1
WDFN
3x3x0.8 mm
8
12
8
3.3
3.3
1.1
1
WDFN
3x3x0.8 mm
8
12
8
3.3
3.3
1
1
WDFN
3x3x0.8 mm
8
12
8
3.25
3.25
1.15
1
WDFN
3x3x0.8 mm
8
12
8
3.25
3.25
1.25
1
WDFN
3x3x0.8 mm
10
12
8
3.3
3.3
1.1
1
WDFN
3x3x0.8 mm
10
12
8
3.3
3.3
1
1
DS00000151J-page 22
1998-2016 Microchip Technology Inc.
Product Tape and Reel Specification
Body Size
Carrier
Dimensions (mm)
Cavity Dimensions
(mm)
W
P
A0
B0
K0
Index
Quadrant
Package Type
Terminal
Count
TABLE 11: Supertex Products Carrier Tape and Cavity Dimensions (Continued)
WDFN
4x4x0.8 mm
10
12
8
4.3
4.3
1.25
1
WDFN
4x4x0.8 mm
10
12
8
4.35
4.35
1.1
1
WDFN
4x4x0.8 mm
10
12
8
4.25
4.25
1.13
1
WFGA
3x3x0.85 mm
6
12
8
3.3
3.3
1.1
1
WFGA
3x3x0.85 mm
6
12
8
3.3
3.3
1
1
WQFN
3x3x0.8 mm
12
12
8
3.3
3.3
1.1
1
WQFN
3x3x0.8 mm
12
12
8
3.3
3.3
1
1
WQFN
3x3x0.8 mm
12
12
8
3.25
3.25
1.15
1
WQFN
3x3x0.8 mm
12
12
8
3.25
3.25
1.25
1
WQFN
3x3x0.8 mm
16
12
8
3.3
3.3
1.1
1
WQFN
3x3x0.8 mm
16
12
8
3.3
3.3
1
1
WQFN
3x3x0.8 mm
16
12
8
3.25
3.25
1.15
1
WQFN
3x3x0.8 mm
16
12
8
3.25
3.25
1.25
1
WQFN
4x5x0.9 mm
24
12
8
4.3
5.3
1.2
1
WQFN
5x5x0.8 mm
32
12
8
5.25
5.25
1.1
1
WQFN
5x5x0.8 mm
32
12
8
5.3
5.3
1.25
1
WQFN
5x5x0.8 mm
40
12
8
5.25
5.25
1.1
1
WQFN
5x5x0.8 mm
40
12
8
5.3
5.3
1.25
1
WQFN
6x6x0.8 mm
32
16
12
6.3
6.3
1.1
1
WQFN
6x6x0.8 mm
32
16
12
6.3
6.3
1
1
WQFN
7x7x0.8 mm
44
16
12
7.35
7.35
1.25
1
WQFN
7x7x0.8 mm
44
16
12
7.25
7.25
1.1
1
1998-2016 Microchip Technology Inc.
DS00000151J-page 23
Product Tape and Reel Specification
Body Size
Carrier
Dimensions
(mm)
W
P
A0
B0
K0
Index
Quadrant
Package Type
Terminal
Count
TABLE 12: ISSC Products Carrier Tape and Cavity Dimensions
Cavity Dimensions (mm)
BGA
12x12 mm
196
24
24
12.5
12.5
1.8
1
LQFP
10x10x1.4 mm
44
24
16
12.35
12.35
2.2
1
LQFP
14x14x1.4 mm
100
32
24
16.8
16.8
2.1
1
MQFP
14x20x2.7 mm
128
44
24
18.9
24.9
3.9
1
QFN
4x4x0.9 mm
16
12
8
4.35
4.35
1.1
1
QFN
4x4x0.9 mm
20
12
8
4.35
4.35
1.1
1
QFN
4x4x0.9 mm
24
12
8
4.35
4.35
1.1
1
QFN
5x5x0.9 mm
28
12
8
5.25
5.25
1.1
1
QFN
5x5x0.9 mm
32
12
8
5.25
5.25
1.1
1
QFN
6x6x0.9 mm
36
16
12
6.3
6.3
1.1
1
QFN
6x6x0.9 mm
40
16
12
6.3
6.3
1.1
1
QFN
7x7x0.9 mm
48
16
12
7.25
7.25
1.1
1
QFN
7x7x0.9 mm
56
16
12
7.25
7.25
1.1
1
QFN
8x8x0.9 mm
56
16
12
8.3
8.3
1.4
1
QFN
9x9x0.9 mm
64
16
12
9.3
9.3
1.1
1
QFN
10x10x0.9 mm
72
24
12
10.4
10.4
1.4
1
SiP
12.42x8.92x1.98 mm
45
24
12
9.3
12.75
2.3
2
SOIC
.150 in.
8
12
8
6.4
5.2
2.1
1
SOIC
.300 in.
28
32
16
10.9
18.5
3.2
1
TQFP
10x10x1.0 mm
44
24
16
12.45
12.45
1.6
1
TQFP
10x10x1.0 mm
64
24
16
12.45
12.45
1.6
1
TQFP
14x14x1.0 mm
128
24
20
16.5
16.5
1.55
1
DS00000151J-page 24
1998-2016 Microchip Technology Inc.
Product Tape and Reel Specification
WAFER LEVEL CHIPSCALE PACKAGES (WLCSP, CSP)
Please contact your Microchip sales representative or supplier for specific carrier tape information.
TABLE 13: Cover Tape Dimensions
Carrier Width
Width (mm)
Thickness (mm)
8 mm
5.3
0.062
12 mm
9.3
0.062
12 mm
9.2
0.05
12 mm
9.05
0.05
16 mm
13.05
0.05
16 mm
13.3
0.05
24 mm
21
0.05
32 mm
25.5
0.05
44 mm
37.5
0.05
Source: EIA-481
1998-2016 Microchip Technology Inc.
DS00000151J-page 25
Product Tape and Reel Specification
FIGURE 5: Maximum Component Rotation for Punched and Embossed Carrier Tape
Maximum Component
Rotation
Side View
Maximum Component
Rotation
Top View
Ĭ°T
Typical Pocket
Centerline
B0
Ĭ°S
Typical Component
Centerline
A0
Tape Width (mm)
Maximum Rotation
Θ°T
Tape Width (mm)
Maximum Rotation
Θ°S
8, 12
20
8, 12
20
16~200
10
16~56
10
72~200
5
Source: EIA-481
FIGURE 6: Maximum Lateral Movement for Punched and Embossed Carrier
16~200 mm Tape
8 mm and 12 mm Tape
0.5 mm maximum
0.5 mm maximum
1.0 mm maximum
1.0 mm maximum
Source: EIA-481
DS00000151J-page 26
1998-2016 Microchip Technology Inc.
Product Tape and Reel Specification
FIGURE 7: Bar Code Label Area for Punched and Embossed Carrier
LABEL
COVER TAPE
SPROCKET HOLES
CARRIER TAPE
Source: EIA-481
FIGURE 8: Bending Radius for Punched and Embossed Carrier
Punched
Embossed
Source: EIA-481
1998-2016 Microchip Technology Inc.
DS00000151J-page 27
Product Tape and Reel Specification
FIGURE 9: Maximum Camber for Punched and Embossed Carrier
1mm maxium either direction
Straight Edge
250mm
Source: EIA-481
To measure camber accurately, place the starting end of the carrier tape sample on the
left end of the measurement fixture or straight edge. Moving to the right, measure the
allowable camber at the highest point between where the left edge and the right edge of
the carrier tape make contact with the measurement fixture or straight edge.
Straight Edge
Only measure camber in the section of carrier tape
that is above the straight edge
Source: EIA-481
DS00000151J-page 28
1998-2016 Microchip Technology Inc.
Product Tape and Reel Specification
FIGURE 10: Ten Pitches Cumulative Sprocket Holes Measurement
10 PITCHES CUMULATIVE
Source: EIA-481
FIGURE 11: Tape Leader and Trailer Dimensions
1. There shall be a leader of 400 mm minimum of cover tape, which includes at least 100 mm of
carrier tape with empty compartments and sealed by the cover tape. All of the leader may consist of the carrier tape with empty compartments sealed by cover tape.
2. There shall be a trailer of 160 mm minimum of empty carrier tape sealed with cover tape. The
entire carrier tape must release from the reel hub as the last portion of the tape unwinds from
the reel without damage to the carrier tape and the remaining components in the cavities.
Source: EIA-481
1998-2016 Microchip Technology Inc.
DS00000151J-page 29
Product Tape and Reel Specification
FIGURE 12: Reel With a Drive Hole
R28.55
25.4
Optional Access Hole
(Ø40 mm min.)
Ø9.5
7.6
Drive Hole
W2
(Measured
at hub)
A
C
N
(Arbor hole
Diameter)
W1
(Measured
at hub)
Source: EIA-481
FIGURE 13: Reel Without a Drive Hole
Full Radius,
See Note
Access Hole at
Slot Location
(Ø40 mm min.)
W2
(Measured
at hub)
A
D
C
N
(Arbor hole
Diameter)
(see Note)
If present, tape
slot in core
for tape start:
2.5 mm min. width x
10.0 mm min. depth
W1
(Measured
at hub)
Source: EIA-481
DS00000151J-page 30
1998-2016 Microchip Technology Inc.
Product Tape and Reel Specification
TABLE 14: Plastic Reel Dimensions:
Carrier
Width
(A) Reel Dia.
(mm)
±3.0 or as
specified
(N) Hub Dia. (mm)
±1.5 or as specified
(W1) Reel
Thickness (mm)
+2.0/-0.0 or as
specified
(W2) Total
Thickness
(mm) Max
(C) Center Hole Dia.
(mm)
±0.2 or as specified
8 mm
330
60
8.4
14.4
13
8 mm
178±2.0
60.5±0.5
8.4+1.5/-0
14.4
13+0.5/-0.2
8 mm
180+0/-1.5
60+1/-0
9+1/-0
11.4±1.0
13
8 mm
177-—179
59—61
8.5—9.5
--
12.8—13.5
12 mm
328—332
100—101
13.0—14.0
18.4
12.8—13.5
12 mm
328—332
100—102
12.4—14.4
18.4
12.8—13.5
12 mm
328—332
179.5—183.5
12.4—13.4
18.2
12.8—13.5
12 mm
330+2.0
100±2.0
12.4+2/-0
18.4
13+0.5/-0.2
16 mm
328—332
100—101
17.0—18.0
22.5
12.5—13.5
16 mm
328—332
100—102
16.4—18.4
22.4
12.8—13.5
16 mm
330±2.0
100±2.0
16.4+2/-0
22.4
13+0.5/-0.2
24 mm
328-332
100—102
24.4—26.4
38.4
12.8—13.5
24 mm
330±2.0
100±2.0
24.4±2.0
30.4
13+0.5/-0.2
32 mm
328—332
100—102
32.4—34.4
38.4
12.8—13.5
32 mm
330±2.0
100±2.0
32.4±2.0
38.4
13+0.5/-0.2
44 mm
328—332
100—102
44.4—46.4
50.4
12.8—13.5
44 mm
330±2.0
100±2.0
44.4±2.0
50.4
13+0.5/-0.2
Source: EIA-481
1998-2016 Microchip Technology Inc.
DS00000151J-page 31
Product Tape and Reel Specification
FIGURE 14:TO-92 Carrier Tape Dimensions
/($'
/($'
$'+(6,9( 7$3(
',5(&7,21 2) 815((/,1*
/($'
X X X
3,1 3,1 67$1'$5' 5((/
5(9(56( 5((/
/($'
,, ,
DS00000151J-page 32
,, ,,
,, ,,
,, ,,
1998-2016 Microchip Technology Inc.
Product Tape and Reel Specification
TABLE 15: TO-92 Carrier Tape Dimensions
Symbol
Description
Dimension (mm)
D
Sprocket Hole Diameter
4.0 ±0.2
P
Device Pitch
12.7 ±0.1
P0
Feed Hole Pitch
12.7 ±0.1
P1
Ordinate to Adjacent lead (2-Lead TO-92)
5.07 ±0.7
P2
Ordinate to Center Lead (3-Lead TO-92)
6.35 ±0.7
F1
2 Lead TO-92 Spacing
2.54 +0.6/-0.2
F
3 Lead TO-92 Spacing
2.54 +0.4/-0.1
H0
Height to Seating Plane (Formed Leads)
15.5 MIN.
H1
Overall Height Above Abscissa
32.2 MAX.
H
Height to Seating Plane (Straight Leads)
16 - 21
W
Carrier Tape Width
18
W6
Adhesive Tape Position
3 MAX.
-
Output Quantity Units
1000
-
Reel Diameter
355
Source: EIA-481
1998-2016 Microchip Technology Inc.
DS00000151J-page 33
Product Tape and Reel Specification
NOTES:
DS00000151J-page 34
1998-2016 Microchip Technology Inc.
Product Tape and Reel Specification
APPENDIX A:
REVISION HISTORY
Revision J Document (March 2016)
Specification rewrite.
Revision H Document (November 2011)
Removed the section "Dimensions and Tolerances" that was Appendix A in the previous
version.
Revision G Document (September 2010)
Included additional package style codes, so
packages that are identical except for the
associated package designators are listed
separately; once by the Microchip designator,
and again by the TelCom designator. For
example, a 5-Lead SOT-23 package is listed
twice in the Carrier Tape and Cavity Dimensions table — once as an OT package style
code, and again as a CT package style code.
Revision F Document (February 2008)
The content and drawings in this document
have been revised for this new version.
1998-2016 Microchip Technology Inc.
DS00000151J-page 35
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Germany - Dusseldorf
Tel: 49-2129-3766400
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Hong Kong
Tel: 852-2943-5100
Fax: 852-2401-3431
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
Austin, TX
Tel: 512-257-3370
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Canada - Toronto
Tel: 905-673-0699
Fax: 905-673-6509
China - Dongguan
Tel: 86-769-8702-9880
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
Germany - Karlsruhe
Tel: 49-721-625370
India - Pune
Tel: 91-20-3019-1500
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Italy - Venice
Tel: 39-049-7625286
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Kaohsiung
Tel: 886-7-213-7828
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Poland - Warsaw
Tel: 48-22-3325737
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
07/14/15
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