05-08-1673

LGA Package
28-Lead (4mm × 6mm × 0.94mm)
(Reference LTC DWG # 05-08-1673 Rev Ø)
SEE NOTES
DETAIL A
ddd Z
aaa Z
28×
2×
23
A
22
PAD “A1”
CORNER
4
7
28
1
PIN 1 NOTCH
0.25 × 45°
b
1.33
0.20
A1
Z
0.20
DETAIL C
E
F
E1
1.10
SEE NOTES
SUBSTRATE
MOLD
CAP
3
DETAIL C
e
6
0.40
H1
aaa Z
DETAIL B
PACKAGE TOP VIEW
1.2500
0.7500
0.2500
0.0000
0.2500
0.7500
1.2500
DETAIL B
1.7500
1.33
0.70 ±0.05
1.2500
0.20
0.7500
0.20
6.50 ±0.05
1.10
0.2500
0.0000
0.2500
0.7500
1.2500
1.7500
2.2500
4.50 ±0.05
SUGGESTED PCB LAYOUT
TOP VIEW
0.20
0.65
NOM
0.94
0.02
0.25
4.00
6.00
0.50
4.50
2.50
2.40
4.40
0.24
0.70
ccc M Z X Y
2. ALL DIMENSIONS ARE IN MILLIMETERS
DIMENSIONS
MIN
0.85
0.01
0.22
8
PACKAGE BOTTOM VIEW
DETAIL A
0.25 ±0.05
2.2500
D1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
0.05
PACKAGE
OUTLINE
e
b
G
0.40
SYMBOL
A
A1
b
D
E
e
F
G
D1
E1
H1
H2
aaa
bbb
ccc
ddd
eee
fff
13
e/2
e
28b
eee M Z X Y
fff M Z
2×
ccc M Z X Y
Y
X
D
7
14
Z
// bbb Z
H2
MAX
1.03
0.03
0.28
NOTES
3
METAL FEATURES UNDER THE SOLDER MASK OPENING NOT SHOWN
SO AS NOT TO OBSCURE THESE TERMINIALS AND HEAT FEATURES
4
DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE
LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER
MAY BE EITHER A MOLD OR MARKED FEATURE
5. PRIMARY DATUM -Z- IS SEATING PLANE
6
7
0.28
0.75
0.15
0.10
0.08
0.10
0.15
0.08
TOTAL NUMBER OF LGA PADS: 28
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
THE EXPOSED HEAT FEATURE IS SEGMENTED AND ARRANGED
IN A MATRIX FORMAT. IT MAY HAVE OPTIONAL CORNER RADII
ON EACH SEGMENT
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
LTMXXXXXX
µModule
PACKAGE IN TRAY LOADING ORIENTATION
LGA 28 0615 REV Ø
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