05-08-1519

LGA Package
20-Lead (4mm × 3mm × 0.75mm)
(Reference LTC DWG # 05-08-1519 Rev Ø)
aaa Z
b
17
SEE NOTES
7
20
20×
2×
ddd Z
DETAIL A
ccc M Z X Y
A
PAD “A1”
CORNER
16
4
1
PIN 1 NOTCH
0.25 × 45°
b
1.225
0.20
SEE NOTES
F
D1
Z
A1
e
DETAIL C
aaa Z
10
Y
E
20b
eee M Z X Y
fff M Z
Z
// bbb Z
2×
e/2
e
PACKAGE BOTTOM VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
DETAIL B
0.7500
0.2500
0.0000
0.2500
0.7500
DETAIL A
DIMENSIONS
PACKAGE
OUTLINE
0.25 ±0.05
1.2500
0.20
0.70 ±0.05
0.20
0.7500
0.2500
0.0000
0.2500
4.50 ±0.05
1.225
0.725
0.7500
1.2500
3.50 ±0.05
SUGGESTED PCB LAYOUT
TOP VIEW
SYMBOL
A
A1
b
D
E
e
F
G
D1
E1
H1
H2
aaa
bbb
ccc
ddd
eee
fff
MIN
0.61
0.020
0.247
0.16
0.45
NOM
0.75
0.030
0.250
4.00
3.00
0.50
2.50
1.50
2.65
1.65
0.20
0.55
7
G
H1
H2
e
E1
DETAIL B
PACKAGE TOP VIEW
6
11
DETAIL C
X
0.275
0.725
SUBSTRATE
MOLD
CAP
3
6
ccc M Z X Y
D
MAX
0.84
0.040
0.253
0.40
2. ALL DIMENSIONS ARE IN MILLIMETERS
3
METAL FEATURES UNDER THE SOLDER MASK OPENING NOT SHOWN
SO AS NOT TO OBSCURE THESE TERMINIALS AND HEAT FEATURES
4
DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE
LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER
MAY BE EITHER A MOLD OR MARKED FEATURE
NOTES
5. PRIMARY DATUM -Z- IS SEATING PLANE
6
7
0.24
0.60
0.10
0.10
0.08
0.10
0.15
0.08
TOTAL NUMBER OF LGA PADS: 20
THE EXPOSED HEAT FEATURE IS SEGMENTED AND ARRANGED
IN A MATRIX FORMAT. IT MAY HAVE OPTIONAL CORNER RADII
ON EACH SEGMENT
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
LTXXXXXX
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
LGA 20 1115 REV Ø
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