CDDFN2-T3.3LC TVS Diode

PL
IA
NT
CO
M
*R
oH
S
Features
Applications
■ Bidirectional TVS 3.3 V
■ Computers and peripherals
■ Low capacitance - 13 pF
■ Communication systems
■ ESD protection >15 kV
■ Audio & video equipment
■ Fits 0402 footprint
■ Portable instrumentation
■ RoHS compliant*
CDDFN2-T3.3LC - Surface Mount TVS Diode
General Information
The Bourns® Model CDDFN2-T3.3LC low capacitance device provides ESD, EFT and
surge protection for external ports of electronic devices such as cellular phones,
handheld electronics and other portable electronic devices.
The device measures 1.0 mm x 0.60 mm x 0.55 mm and is available in a DFN-2
package and is intended to be mounted directly onto an FR4 printed circuit board.
The device will fit a 0402 footprint.
The device is designed to meet IEC 61000-4-2 (ESD), IEC 61000-4-4 (EFT) and
IEC 61000-4-5 (Surge) protection requirements.
E
T
E
L
O
S
B
O
Thermal Characteristics (@ TA = 25 °C Unless Otherwise Noted)
Parameter
Operating Supply Voltage
Peak Pulse Current @ 8/20 μs
Operating Temperature
Storage Temperature
Symbol
VDC
IPP
TOPR
TSTG
Min.
-3.8
-55
-55
Typ.
5
+25
+25
Max.
3.8
+125
+150
Unit
V
A
ºC
ºC
Max.
3.3
6.5
1.0
16.5
6.5
8
Unit
V
V
μA
pF
V
V
Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted)
Parameter
Working Peak Voltage
Breakdown Voltage @ 1 mA
Leakage Current @ 3.3 V
Capacitance @ 0 V, 1 MHz
Clamping Voltage @ IP = 1 A 8/20 μs
Clamping Voltage @ IPP = 5 A 8/20 μs
ESD Protection per IEC 61000-4-2
Contact Discharge
Air Discharge
EFT Protection per IEC 61000-4-4
@ 5/50 nS
EFT Protection per IEC 61000-4-5
@ 8/20 μS
Symbol
VWM
VBR
IL
CJ
VC
VC
Min.
ESD
ESD
8
15
Typ.
3.0
4
0.1
13
5.0
6.5
kV
kV
EFT
50
A
Surge
5
A
Asia-Pacific: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
Europe: Tel: +41-41 768 5555 • Fax: +41-41 768 5510
The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
CDDFN2-T3.3LC - Surface Mount TVS Diode
Product Dimensions
Recommended PCB Footprint
This is a molded DFN-2 package with lead free 100 % Sn plating on
the terminations. It weighs approximately 30 mg.
1.40
(0.055)
0.85
(0.033)
TOP VIEW
0.30
(0.012)
A
0.80
(0.031)
B
0.55
(0.022)
E
T
E
L
O
S
B
O
0.55
(0.022)
Typical Part Marking
SIDE VIEW
CDDFN2-T3.3LC ...........................................................................3L
C
C1
D
BOTTOM
VIEW
E
How to Order
CD DFN2 - T 3.3 LC
Common Diode
Chip Diode
Package
DFN2 = DFN-2 Package
Model
Transient Voltage Suppressor
45 °
Working Peak Reverse Voltage
3.3 = 3.3 VRWM (Volts)
F
Suffix
LC = Low Capacitance Bidirectional Diode
0.15
(0.006)
0.05
(0.002)
Block Diagram
DIMENSIONS:
Symbol
Min.
A
B
C
C1
0.51
(0.020)
0.00
(0.000)
D
E
F
0.10
(0.004)
0.45
(0.018)
DIMENSIONS:
MM
(INCHES)
Dimensions
Nom.
1.00
(0.039)
0.60
(0.024)
0.55
(0.022)
0.02
(0.001)
0.65
(0.026)
0.25
(0.010)
0.60
(0.024)
MM
(INCHES)
Max.
0.60
(0.024)
0.05
(0.002)
0.35
(0.014)
0.70
(0.028)
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
CDDFN2-T3.3LC - Surface Mount TVS Diode
Performance Graphs
Overshoot & Clamping Voltage
120
Test Waveform Parameters
tt = 8 µs
td = 20 µs
tt
100
80
30
5 Volts per Division
IPP – Peak Pulse Current (% of IPP)
Pulse Waveform
et
60
40
td = t|IPP/2
20
25
15
5
2
0
E
T
E
L
O
S
B
O
0.2
-5
0
5
10
15
20
25
30
-490.00 ns
t – Time (µs)
10.00 ns
510.00 ns
ESD Test Pulse: 25 kilovolt, 1/30 ns (waveshape)
Typical Capacitance Variation of CIN vs VIN
Power Derating Curve
Mounting on Glass Epoxy PCBs
16
100
14
Input Capacitance (pF)
Power Rating (%)
80
12
Pin 1 to Pin 2
10
8
6
4
60
40
20
f = 1 MHz,
T = 25 °C
2
0
0
-4
-3
-2
-1
0
1
2
3
Input Voltage (V)
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
4
0
25
50
75
100
Ambient Temperature (°C)
125
150
CDDFN2-T3.3LC - Surface Mount TVS Diode
Packaging Information
The surface mount product is packaged in an 8 mm x 4 mm tape and reel format per EIA-481 standard.
P
0
P
1
d
T
E
Index Hole
120 °
F
D2
W
B
D1 D
P
A
Trailer
.......
.......
End
E
T
E
L
O
S
B
O
C
Device
.......
.......
.......
.......
Leader
.......
.......
DIMENSIONS:
10 pitches (min.)
W1
Start
MM
(INCHES)
10 pitches (min.)
Direction of Feed
Item
Symbol
DFN-2
0.80 ± 0.10
(0.031 ± 0.004)
Carrier Width
A
Carrier Length
B
Carrier Depth
C
Sprocket Hole
d
Reel Outside Diameter
D
178
(7.008)
Reel Inner Diameter
D1
50.0
MIN.
(1.969)
Feed Hole Diameter
D2
13.0 ± 0.20
(0.512 ± 0.008)
Sprocket Hole Position
E
1.75 ± 0.10
(0.069 ± 0.004)
Punch Hole Position
F
3.50 ± 0.05
(0.138 ± 0.002)
Punch Hole Pitch
P
4.00 ± 0.10
(0.157 ± 0.004)
Sprocket Hole Pitch
P0
4.00 ± 0.10
(0.157 ± 0.004)
Embossment Center
P1
2.00 ± 0.05
(0.079 ± 0.002)
Overall Tape Thickness
T
0.20 ± 0.10
(0.008 ± 0.004)
Tape Width
W
8.00 ± 0.20
(0.315 ± 0.008)
Reel Width
W1
Quantity per Reel
--
1.20 ± 0.10
(0.047 ± 0.004)
0.70 ± 0.10
(0.027 ± 0.004)
1.55 ± 0.05
(0.061 ± 0.002)
14.4
MAX.
(0.567)
5000
REV. 02/12
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Similar pages