CDNBS08-USBxB Series Steering Diode/TVS Array Combo

PL
IA
NT
Features
*R
oH
S
CO
M
■
■
■
■
■
Applications
Lead free as standard
RoHS compliant*
Protects 2 I/O ports
ESD protection > 40 KV
Low capacitance: 15 pF
■
■
■
■
Ethernet – 10/100 Base T
Computer I/O ports –
SCSI, FireWire & USB
Set-top box protection
Video cards
CDNBS08-USBxB Series - Steering Diode/TVS Array Combo
General Information
The markets of portable communications, computing and video equipment are
challenging the semiconductor industry to develop increasingly smaller electronic
components.
8
7
6
5
1
2
3
4
Bourns offers Steering Diode/Transient Voltage Suppressor Array combination diodes
for surge and ESD protection applications in an 8 lead narrow body SOIC package
size format. Bourns® Chip Diodes conform to JEDEC standards, are easy to handle
on standard pick and place equipment and their flat configuration minimizes roll
away.
The Bourns® device will meet IEC 61000-4-2 (ESD), IEC 61000-4-4 (EFT) and
IEC 61000-4-5 (Surge) requirements.
E
T
E
L
O
S
B
O
Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted)
Parameter
Symbol
Breakdown Voltage @ 1 mA
Working Peak Voltage
CDNBS08-
Unit
USB3B
USB6B
VBR
4.0
6.0
V
VWM
3.3
5.25
V
Maximum Clamping Voltage VC @ IP1
VF
6.0
7.0
V
Maximum Clamping Voltage
@ 8/20 µs VC @ IPP1
VF
12.9 V
@ 37 A
13.2 V
@ 35 A
V
ID
125
10
µA
Maximum Leakage Current @ VWM
Maximum Cap Bidirectional @ 0 V, 1 MHz
Peak Pulse Power (tp = 8/20 µs)
2
C j(SD)
15
pF
PPP
500
W
Notes:
1. See Pulse Wave Form.
2. See Peak Pulse Power vs. Pulse Time.
3. Electrical specifications refer to Pins 1 to 4 or Pin 5 to Pin 8.
Thermal Characteristics (@ TA = 25 °C Unless Otherwise Noted)
Parameter
Operating Temperature
Storage Temperature
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Symbol
Max.
Unit
TJ
-55 to +150
°C
TSTG
-55 to +150
°C
CDNBS08-USBxB Series - Steering Diode/TVS Array Combo
Product Dimensions
Recommended Footprint
This is a molded JEDEC narrow body SO-8 package with lead free
100 % Sn plating on the lead frame. It weighs approximately 15 mg
and has a flammability rating of UL 94V-0.
A
B
A
D
F
B
C
C
H
E
T
E
L
O
S
B
O
G
E
Dimensions
DIMENSIONS = MILLIMETERS
(INCHES)
D
E
A
1.143 - 1.397
(0.045 - 0.055)
B
0.635 - 0.889
(0.025 - 0.035)
6.223
Min.
(0.245)
C
Dimensions
A
4.80 - 5.00
(0.189 - 0.196)
B
3.80 - 4.00
(0.150 - 0.157)
C
5.80 - 6.20
(0.229 - 0.244)
D
1.35 - 1.75
(0.054 - 0.068)
E
0.10 - 0.25
(0.004 - 0.008)
F
0.25 - 0.50
(0.010 - 0.019)
G
0.40 - 1.250
(0.016 - 0.049)
H
0.18 - 0.25
(0.007 - 0.009)
D
3.937 - 4.191
(0.155 - 0.165)
E
1.016 - 1.27
(0.040 - 0.050)
How To Order
CD NBS08 - USB 3 B
Common Code
Chip Diode
Package
• NBS08 = Narrow Body SOIC8 Package
Model
USB = Specific USB Port Device
Minimum Breakdown Voltage
3 = 3.0 VBR (Volts)
Configuration
B = 2 Steering Diodes + 1 TVS Diode
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
CDNBS08-USBxB Series - Steering Diode/TVS Array Combo
Performance Graphs
Peak Pulse Power vs Pulse Time
Pulse Wave Form
120
IPP – Peak Pulse Current (% of IPP)
PPP – Peak Pulse Power (W)
10,000
500 W, 8/20 µs Waveform
1,000
100
Test Waveform Parameters
tt = 8 µs
td = 20 µs
tt
100
80
et
60
40
td = t|IPP/2
E
T
E
L
O
S
B
O
20
0
10
0.01
1
10
100
1,000
0
10,000
5
10
Block Diagram
15
20
25
30
t – Time (µs)
td – Pulse Duration (µs)
Power Derating Curve
7
6
100
5
% of Rated Power
8
80
Peak Pulse Power
8/20 µs
60
40
20
1
2
3
4
Average Power
0
0
25
50
75
100
125
150
TL – Lead Temperature (°C)
Device Pinout
Typical Part Marking
Pin
Function
CDNBS08-USB3B ......................................................................PRQ
1
VCC
CDNBS08-USB6B ......................................................................PRR
2
I/O 1
3
I/O 2
4
GND
5
GND
6
I/O 2
7
I/O 1
8
VCC
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
CDNBS08-USBxB Series - Steering Diode/TVS Array Combo
Packaging Specifications
The product will be dispensed in Tape and Reel format (see diagram below).
P
0
P
1
d
T
E
Index Hole
120 °
F
D2
W
B
D1 D
P
Trailer
A
C
E
T
E
L
O
S
B
O
Device
Leader
....... .......
....... .......
.......
....... ....... .......
End
DIMENSIONS:
10 pitches (min.)
10 pitches (min.)
Direction of Feed
Item
Carrier Width
Carrier Length
Carrier Depth
Sprocket Hole
Symbol
A
B
C
d
Reel Outside Diameter
D
Reel Inner Diameter
D1
Feed Hole Diameter
D2
Sprocket Hole Position
E
Punch Hole Position
F
Punch Hole Pitch
P
Sprocket Hole Pitch
P0
Embossment Center
P1
Overall Tape Thickness
T
Tape Width
W
Reel Width
W1
Quantity per Reel
-
NSOIC 8L
6.7 ± 0.10
(0.264 ± 0.004)
5.5 ± 0.10
0.217 ± 0.004
2.10 ± 0.10
0.083 ± 0.004
1.55 ± 0.05
(0.061 ± 0.002)
330
(12.992)
80.0
(3.1500) MIN.
13.0 ± 0.20
(0.512 ± 0.008)
1.75 ± 0.10
(0.069 ± 0.004)
3.50 ± 0.05
(0.138 ± 0.002)
8.00 ± 0.10
(0.315 ± 0.004)
4.00 ± 0.10
(0.157 ± 0.004)
2.00 ± 0.05
(0.079 ± 0.002)
0.20 ± 0.10
(0.008 ± 0.004)
12.00 ± 0.20
(0.472 ± 0.008)
18.4
(0.724) MAX.
2500
W1
Start
MM
(INCHES)
Devices are packed in accordance with EIA standard
RS-481-A.
Asia-Pacific:
Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
Europe:
Tel: +41-41 768 5555 • Fax: +41-41 768 5510
The Americas:
Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
REV. 09/09
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
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