PL
IA
NT
Features
CO
M
■
*R
oH
S
■
■
■
■
■
SIP (Single In-line Package)
Output voltage programmable from
0.75 Vdc to 5.5 Vdc via external resistor
6 A output current
Up to 92 % efficiency
Small size, low profile
Cost-efficient
■
■
■
■
■
Low output ripple and noise
High reliability
Remote on/off
Output overcurrent protection
(non-latching)
Sequencing function
SXT6A-12SA SIP Non-Isolated Power Module
Description
Bourns® SXT6A-12SA is a non-isolated DC-DC converter offering designers a cost and space-efficient solution with standard features
such as sequencing, remote on/off, precisely regulated programmable output voltage and overcurrent protection.
Specifications
Parameter
Min.
Nom.
Max.
Units
8.3
12
14
Vdc
4.5
Adc
Notes
INPUT
Voltage
Current
Remote ON/OFF:
Low or Open =
High =
Standard
On
Off
OUTPUT
Voltage Adjustment Range
Current
Voltage Setpoint Accuracy
Line Regulation
Load Regulation
Temperature Regulation
E
T
E
L
O
S
B
O
-P Option
Off
On
2.4
0.4
Vin
Vdc
Vdc
0.75
5.5
0.0
6.0
Vdc
Adc
-2.0
2.0
% Vo,set
10 µA max.
1 mA max.
0.3
% Vo,set
0.4
% Vo,set
% Vo,set
0 to +85 °C
0.4
Ripple (pk-pk) (20 MHz Bandwidth)
50
75
mVpk-pk
1 µF ceramic//10 µF tantalum capacitors
Ripple (rms)
15
30
mVrms
1 µF ceramic//10 µF tantalum capacitors
1 µF ceramic//10 µF tantalum capacitors
Dynamic Load Response:
50 % to 100 % Load or 100 % to 50 % Load;
(∆i/∆t = 2.5 A/µs; 25 °C)
200
25
mV
µs
50 % to 100 % Load or 100 % to 50 % Load;
(∆i/∆t = 2.5 A/µs; 25 °C)
50
50
mV
µs
10,000
kHrs
2 x 150 µF polymer capacitors
GENERAL
MTBF
Operating Temperature
-40
+85
°C
Storage Temperature
-55
+125
°C
Switching Frequency
300
Efficiency
81.0
%
84.0
%
86.0
%
88.0
%
90.0
%
92.0
%
(Vin = 12 Vdc, TA= 25 °C, Full Load)
kHz
Vo,set = 1.2 Vdc
Vo,set = 1.5 Vdc
Vo,set = 1.8 Vdc
Vo,set = 2.5 Vdc
Vo,set = 3.3 Vdc
Vo,set = 5.0 Vdc
Applications
■
■
■
Intermediate Bus architecture
Distributed power applications
Workstations and servers
■
■
■
Telecom equipment
Enterprise networks including LANs/WANs
Latest generation ICs (DSP, FPGA, ASIC) and microprocessor powered applications
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
Output Voltage Programming
Via external trim resistor between Trim and GND:
Rtrim =
[
Via application of external voltage between Trim and GND:
]
10.5
- 1.0 kΩ
Vo - 0.7525
Vtrim = (0.7 - 0.0667 x {Vo - 0.7525})
SXT6A-12SA SIP Non-Isolated Power Module
Product Dimensions
Recommended Hole Pattern
BACK VIEW OF BOARD
COMPONENT SIDE FOOTPRINT
25.4
(1.0000)
25.4
(1.0000)
OUTLINE AREA
12.70
(0.5000)
5
4
A
3
2
1
5.8
(0.23)
6.6
(0.26)
5 PINS
Die-Tech 315-0969-00
0.64
0.38
X
(0.025) (0.015)
12.32
(0.4850)
2.54
(0.100)
2.54
(0.100)
E
T
E
L
O
S
B
O
7.6
(0.30)
12.7
(0.500)
15.24
(0.600)
2.54
(0.100)
2.54
(0.100)
17.78
(0.700)
(
12.7
(0.500)
15.24
(0.600)
17.78
(0.700)
20.32
(0.800)
20.32
(0.800)
Pinout Detail
PIN
1
2
3
A
4
5
SIDE VIEW
6.53
(0.257)
MAX.
DIMENSIONS:
MM
(INCHES)
1.09
(0.043)
PLATED
THROUGH-HOLE
1.63
(0.064)
PAD SIZE
BOTH SIDES
6.26
(0.246)
REF.
L1 (REF.)
FUNCTION
VOUT
TRIM
GND
SEQ
VIN
ON/OFF
How to Order
S X T 6A - 12 S A (-P)
TOLERANCES:
0.5
(0.02)
0.25
DECIMAL .XX ±
(0.010)
Configuration
• S = SIP
DECIMAL .X ±
Internal Identifier
Identifies Sequencing Pin Function
Output Current (Amps)
Input Voltage (V)
Outputs
• S = Single
0.64
(0.025)
5.62
(0.2210)
Output Voltage (V)*
• A = Adjustable
Optional Positive On/Off Logic
*Fixed output voltage parts and optional features available; contact factory.
Derating Output Current vs. Local Ambient Temp & Airflow
(Vin = 12 Vdc, Vo = 3.3 Vdc)
7
Output Current (A)
6
2.0 m/s
(400 LFM)
NC (0 LFM)
5
1.5 m/s
(300 LFM)
4
1.0 m/s
(200 LFM)
0.5 m/s
(100 LFM)
3
2
1
0
25
30
35
40
45
50
55
60
65
Ambient Temperature (°C)
70
75
80
85
Asia-Pacific:
Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
Europe:
Tel: +41-41 768 5555 • Fax: +41-41 768 5510
The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
REV. B 08/06
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.