2DEA/2DEB Integrated ESD Protection Diode Array

IA
NT
Features
S
oH
■
02
*R
■
0
DEA
24Q
CO
M
PL
■
6
003
■
Lead free
RoHS compliant*
Supports 15 KV IEC 61000-4-2 ESD
equipment specification*
Single device protects as many as 20 lines
on exposed pins, communications ports
■
■
Incorporates 40 bi-directional PN
junction diodes
Small form factor replaces 20 SOT23
packages
Thin Film on Silicon 2DEA Integrated ESD Protection Diode Array
General Information
Package Schematic
The Model 2DEA Series is well-suited for space constrained
designs where the requirements of international ESD standard
specification IEC 61000-4-2 must be met.
VDD
24 23
22
21 20
VSS
19 18 17 16 15 14 13
These highly integrated PN junction diode arrays are especially effective for use in PC notebooks and motherboards,
engineering workstations and portable battery-powered
devices such as PDAs and cellular phones.
Space savings, as compared to popular BA V99 SOT23
based implementations, can yield a 75 % reduction in
utilized board area. In addition, significant assembly cost
reductions and manufacturing integrity improvements can
be realized.
E
T
E
L
O
S
B
O
1
2
3
4
5
6 7
VSS
8
9
10 11
12
VDD
Two package options are available. Model 2DEA consists of
20 bi-directional diode pairs in a miniature 24-pin JEDEC
QSOP package. The 2DEB consists of 17 bi-directional
diode pairs in a traditional wide-body SOIC JEDEC package.
Electrical & Environmental Characteristics
Electrical Characteristics
Supply Voltage
Voltage @ any Channel
Channel Clamp Current (continuous)
Forward Voltage:
@If = 1 mA
@If = 12 mA
Leakage Current @ VSS<Vin<VDD = 12 V
Diode Capacitance
Symbol
Minimum
VDD - VSS
Vin
IC
-0.3
-0.3
Vf
Nominal
Maximum
Unit
12
VDD + 0.5
±15
V
V
mA
0.9
1.5
10
5
V
V
µA
pF
+125
+150
20
°C
°C
mW/diode
±9
±16
kV
kV
0.8
0.1
Environmental Characteristics
Operating Temperature
Storage Temperature
Diode Power Rating
ESD Performance Withstand*:
Contact Discharge
Air Discharge
TJ
Tstg
-55
-65
±8
±15
* Note: IEC 61000-4-2 ESD test performance is measured at the systems level and system designs, enclosure shielding and other conventional ESD control measures usually influence
the results of these tests. Testing on the component level serves as an indicator that the system passes a specific compliance step, but does not ensure that the system passes at that
level. The Model 2DEA/DEB device, therefore, can support successful implementation of the IEC 61000-4-2 system level ESD standard.
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Applications
■
■
■
Parallel printer ports, communication ports
Hot-swappable designs
IC protection
Thin Film on Silicon 2DEA Integrated ESD Protection Diode Array
Mechanical Characteristics
QSOP Package Dimensions
Wide-Body SOIC Package Dimensions
12.66 - 12.86
(.496 - .505)
1.27
TYP.
(0.50)
A
.635
TYP.
(.025)
3.81 - 3.99
(.150 - .157)
0.66
(.026)
REF
7.40 - 7.60
(.291 - .299)
E
T
E
L
O
S
B
O
0.38 - 0.48
(.014 - .016)
PIN 1
.21 - .31
(.008 - .012)
PIN 1
1.35 - 1.75
(.053 - .069)
2.44 - 2.64
(.096 - .104)
0.10 - 0.30
(.004 - .012)
.10 - .25
(.004 - .010)
.19 - .25
(.007 - .010)
0-8 °
.41 - 1.27
(.016 - .050)
5.80 - 6.20
(.228 - .244)
Model
2QSP24
0-8°
0.23 - 0.32
(.0091 - .0125)
10.11 - 10.51
(.398 - .414)
Governing dimensions are in mm. Dimensions in
parentheses are in inches and are approximate.
JEDEC Reference Number MS-013.
A
8.56 - 8.74 (.337 - .344)
Governing dimensions are in mm. Dimensions in
parentheses are in inches and are approximate.
JEDEC Reference Number MO-137.
QSOP Package Power Temperature Derating Curve
1.0
1.25
2QSP24
WATTS
WATTS
1.25
Wide-Body SOIC Package Power Temperature Derating Curve
.75
.50
.25
0
1.0
WBSOIC20
.75
.50
.25
25
50
75
100
125
150
AMBIENT TEMPERATURE ( ° C )
0
Standard Part Numbers
Part Number
(Tape & Reel)
2DEA-2-Q24R
Part Number
(Tubes)
2DEA-2-Q24T
2DEB-2-W20R
2DEB-2-W20T
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
25
50
75
100
125
150
AMBIENT TEMPERATURE ( ° C )
Thin Film on Silicon 2DEA Integrated ESD Protection Diode Array
Dispensing
For large quantities, the product will be dispensed in Tape and Reel (see diagram below).
A0
DIMENSIONS = MM (INCHES)
E
T
E
L
O
S
B
O
B0
Package
QSOP
24 Pin
WBSOIC
20 Pin
How To Order
K0
No. of Pieces No. of Pieces
per 13 reel
per tube
A0
B0
K0
Width
Pitch
6.5 (0.256)
9.0 (0.354)
2.1 (0.083)
16 (0.630)
8 (0.315)
3,500
56
13 (0.519)
10.8 (0.425)
2.8 (0.110)
24 (0.945)
8 (0.315)
3,500
37
2 DEA - 2 - Q 24 R LF
Product Class
Thin-Film-on-Silicon
Product Function
ESD Protection Diode Array
DEA = 20 Lines
DEB = 17 Lines
Standard
Standard Package Style
Q=
QSOP
W = Wide-Body SOIC
Pin Count
Q = 24
W = 20
Dispensing
R = Reel
T = Tube
Terminations
LF = 100 % Sn (lead free)
Typical Part Marking
Represents total content. Layout may vary.
Asia-Pacific:
Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
Europe:
Tel: +41-41 768 5555 • Fax: +41-41 768 5510
The Americas:
Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
PRODUCT
FUNCTION
PIN COUNT
DEA002
24Q
YYWW
PIN 1 INDICATOR
(MOLDED INDENT)
PACKAGE STYLE
DATE CODE
MANUFACTURER'S
TRADEMARK
04/07
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
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