PL IA N T Features CO M ■ Superior circuit protection *R oH S ■ Overcurrent & overvoltage protection The Model TBU-PK Series is obsolete and not recommended for new designs. The Model TBU-PL Series is the recommended alternative. ■ Blocks surges up to rated limits ■ High-speed performance K C955901 ■ Small SMT package ■ RoHS compliant* ■ Agency recognition: TBU-PK Series - TBU® High-Speed Protectors General Information Vdd The TBU-PK Series of Bourns® TBU® products are low capacitance dual bidirectional high-speed protection components, constructed using MOSFET semiconductor technology, and designed to protect against faults caused by short circuits, AC power cross, induction and lightning surges. Line 1 SLIC Line 1 Line 2 SLIC Line 2 In addition to overcurrent protection, an added feature is the voltage monitoring on the two lines. If the voltage on the line drops below Vss then the voltage will trigger the device to switch to the blocking state. Vss The TBU® high-speed protector placed in the system circuit will monitor the current with the MOSFET detection circuit triggering to provide an effective barrier behind which sensitive electronics will not be exposed to large voltages or currents during surge events. The TBU® device is provided in a surface mount DFN package and meets industry standard requirements such as RoHS and Pb Free solder reflow profiles. Agency Approval UL Description File Number: E315805 TBU ® Device E T E L O S B O Industry Standards (in Conjunction with OVP Device) Solutions available for GR-1089-CORE, ITU-T and a combination of both. Absolute Maximum Ratings (@ TA = 25 °C Unless Otherwise Noted) Symbol Parameter Vimp Peak impulse voltage withstand with duration less than 10 ms Vrms Continuous A.C. RMS voltage Top Tstg Tjmax ESD Operating temperature range Storage temperature range Maximum junction temperature HBM ESD protection per IEC 61000-4-2 on line pads Part Number TBU-PK050-100-WH TBU-PK060-100-WH TBU-PK075-100-WH TBU-PK085-100-WH TBU-PK050-100-WH TBU-PK060-100-WH TBU-PK075-100-WH TBU-PK085-100-WH Value 500 600 750 850 300 350 400 425 -55 to +125 -65 to +150 +125 ±2 Unit V V °C °C °C kV Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted) Symbol Itrigger Rdevice Rmatch tblock IQ Iss Parameter Current required for the device to go from operating state to protected state Series resistance of the TBU® device Package resistance matching of the TBU® device #1 - TBU® device #2 Time taken for the device to go into current limiting Current through the triggered TBU® device with 50 Vdc circuit voltage Operating current with Vss = -50 V Min. 100 65 Typ. 150 80 ±0.5 Vreset Voltage below which the triggered TBU® device will transition to normal operating state Vto Vss Rth(j-l) Rth(j-l) Rth(j-l) Rth(j-l) Voltage threshold offset with 60 Hz applied voltage, with Vss -50 V (Vss - VlineSLIC) Operating voltage range relative to Vdd One side junction to package pads - FR4 using minimum recommended pad layout Both sides junction to package pads - FR4 using minimum recommended pad layout One side junction to package pads - FR4 using heat sink on board (6 cm2) (0.5 in.2) Both sides junction to package pads - FR4 using heat sink on board (6 cm2) (0.5 in.2) Max. 200 90 ±1.6 1 1.50 0.25 0.70 100 Forward Mode 12 15 22 Reverse Mode 10 13 20 Unit mA Ω Ω µs mA µA V -1.0 -180 0.2 -20 110 65 70 40 *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. V V °C/W °C/W °C/W °C/W Applications ■ SLIC protection ■ Cable & DSL ■ MDU/MTU modems ■ ONT ■ Voice/DSL line cards TBU-PK Series - TBU® High-Speed Protectors Functional Block Diagram HIGH VOLTAGE SWITCH Line 1 SLIC Line 1 CURRENT SENSE Vdd + VOLTAGE COMPARATOR Vss E T E L O S B O Vdd Vss Vdd VOLTAGE COMPARATOR Vss + CURRENT SENSE HIGH VOLTAGE SWITCH Line 2 SLIC Reference Application Basic TBU Operation The TBU-PK Series are high-speed protectors used in voice/ VolP SLIC applications. The maximum voltage rating of the TBU® device should never be exceeded. Where necessary, an OVP device should be employed to limit the maximum voltage. A costeffective protection solution combines Bourns® TBU® protection devices with a pair of Bourns® MOVs. For bandwidth sensitive applications, a Bourns® GDT may be substituted for the MOV. If EN55024 EMC compliance is required, the TBU® device may require capacitors to be fitted between the Tip and Ring connections and ground. GND Vdd Line 1 Line 1 SLIC Vss The TBU® device, constructed using MOSFET semiconductor technology, placed in the system circuit will monitor the current with the MOSFET detection circuit triggering to provide an effective barrier behind which sensitive electronics are not exposed to large voltages or currents during surge events. The TBU® device operates in approximately 1 µs - once line current exceeds the TBU® device’s trigger current Itrigger. When operated, the TBU® device restricts line current to less than 1 mA typically. When operated, the TBU® device will block all system voltages and any other voltages including the surge in each case up to rated limits. When the voltage on the SLIC output is driven below (Vbat – Vto) the TBU-PK series device switches to the blocking state, regardless of output current in the device. After the surge, the TBU® device resets when the voltage across the TBU® device falls to the Vreset level. The TBU® device will automatically reset on lines which have no DC bias or have DC bias below Vreset (such as unpowered signal lines). MOV TBU® Device Line 2 SLIC Line 2 MOV Line 2 If the line has a normal DC bias above Vreset, the voltage across the TBU® device may not fall below Vreset after the surge. In such cases, special care needs to be taken to ensure that the TBU® device will reset, with software monitoring as one method used to accomplish this. Bourns application engineers can provide further assistance. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. TBU-PK Series - TBU® High-Speed Protectors Bourns® TBU® Device Solutions Industry Standard Telcordia GR-1089-CORE Intra-building Port Type 4 Telcordia GR-1089-CORE Intra-building Port Type 4a Non-GR-1089-CORE Intra-building Specifications ITU-T Basic K.20, K.21, K.45 Surge & AC Withstand TBU® Device P/N 1500 V, 100 A 2/10 µs 120 Vrms, 25 A, 900 s TBU-PK050-100-WH 1 MOV-07D201K 2 1000 V, 100 A 10/1000 µs 120 Vrms, 25 A, 900 s TBU-PK060-100-WH 1 MOV-10D201K 2 TBU-PK085-100-WH 1 MOV-10D361K 2 TBU-PK085-100-WH 1 MOV-10D431K 2 5000 V, 500 A 2/10 µs 230 Vrms, 25 A, 900 s 1500 V, 100 A 2/10 µs 275 Vrms, 25 A, 900 s 4000 V, 40 Ω 10/700 µs 230 Vrms 10 Ω - 1000 Ω, 900 s 600 Vrms 600 Ω, 0.2 s 4000 V, 40 Ω 10/700 µs 230 Vrms 10 Ω -1000 Ω, 900 s 600 Vrms 600 Ω, 0.1 s 6000 V, 40 Ω 10/700 µs 240 Vrms 10 Ω - 1000 Ω, 900 s 600 Vrms 600 Ω, 0.2 s 600 Vrms 600 Ω, 1 s* 1500 Vrms, 200 Ω, 2 s* 6000 V, 40 Ω 10/700 µs 240 Vrms 10 Ω - 1000 Ω, 900 s 600 Vrms 600 Ω, 1 s 1500 Vrms, 200 Ω, 2 s Qty. E T E L O S B O ITU-T Enhanced K.20, K.21, K.45 OVP Device P/N Qty. TBU-PK075-100-WH 1 MOV-10D361K 2 TBU-PK060-100-WH 1 TISP4400M3BJ 2 TBU-PK085-100-WH 1 MOV-10D391K 2 TBU-PK060-100-WH 1 TISP4500H3BJ 2 * GDT Special Test Protector with DC breakdown (DCBD) of less than 330 V. Notes: 1) The Le9500, Le9520 and Le9530 (VE950 series) require a 200 mA Itrigger TBU® device for normal operation. Other SLIC types should use the 100 mA device. 2) The MOV maximum continuous rms voltage rating should not be exceeded. The exception is where the data sheet highlights withstand capability such as the 600 Vrms, 1 A for 0.2 s, for example. 3) If EN55024 EMC compliance is required, the TBU® device may require capacitors to be fitted between the Tip and Ring connections and ground (i.e. in parallel with the MOV device). The capacitance value can be chosen to meet levels as follows: • 10 nF for EN55024 Level 1 • 20 nF for EN55024 Level 2 • 47 nF for EN55024 Level 3 Selection of capacitor voltage rating depends upon TBU® part number selection. Recommendations include: • TBU-PK050 & TBU-PK060 Series: 120 VAC, 500 V Peak Surge Rated • TBU-PK075 & TBU-PK085 Series: 240 VAC, 750 V Peak Surge Rated Depending upon the SLIC type, it is usually possible to remove any EMI capacitors present between the output of the SLIC and ground when using capacitors C1 and C2 in parallel with the MOVs. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. TBU-PK Series - TBU® High-Speed Protectors Performance Graphs Typical Trigger Current vs. Temperature Typical V-I Characteristics (TBU-PK085-100-WH) Normalized Trigger Current (A) 1.8 ITRIP CURRENT (50 mA/div) VRESET VOLTAGE (5 V/div) 1.6 1.4 1.2 1.0 0.8 0.6 E T E L O S B O 0.4 0.2 0.0 -75 -50 -25 0 25 50 75 100 125 Junction Temperature (°C) Typical Resistance vs. Temperature Tracking Voltage Characteristics 2.2 Vbat range of -25 V to -150 V Normalized Resistance (Ω) 100 Resistance ( ) 90 80 70 60 50 40 -4 -3 -2 -1 0 1 2 3 4 Voltage threshold offset (V) 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -75 -50 -25 0 25 50 75 100 125 Junction Temperature (°C) Typical Surge Response Power Derating Curve 3.0 2.5 Total Max. Power (W) Voltage: 100 V/div One Side, No PCB Cu One Side, 0.5 sq. in. PCB Cu Two Sides, No PCB Cu Two Sides, 0.5 sq. in. PCB Cu 2.0 Time: 250 ns/div 1.5 Current: 100 mA/div 1.0 0.5 0.0 20 40 60 80 100 Junction Temperature (°C) 120 140 (TBU-PK050-100-WH with MOV-07D201K Using 1800 V 1.2/50 ms Surge Pulse) Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. TBU-PK Series - TBU® High-Speed Protectors Product Dimensions 0.70 (.028) 0.725 (.029) 0.825 (.032) 0.40 (.016) 0.825 (.032) 0.85 ± 0.05 (.033 ± .002) 6.50 ± 0.10 (.256 ± .004) 0.30 (.012) 1.335 (.053) 1.15 (.045) 1.275 (.050) 0.30 (.012) 1.35 (.053) 1.20 (.047) 4.00 ± 0.10 (.157 ± .004) 1.35 (.053) 1.275 (.050) 0.85 (.033) 0.85 (.033) 0.73 (.029) 1.20 (.047) E T E L O S B O 0.85 (.033) PIN 1 & BACKSIDE CHAMFER 0.90 (.035) 0.85 (.033) 0.85 (.033) 0.80 - 0.95 (.031 - .037) 1.335 (.053) 0.75 (.030) 0.75 (.030) 0.40 (.016) 0.00 - 0.05 (.000 - .002) TBU® High-Speed Protectors have a 100 % matte-tin termination finish. For improved thermal dissipation, the recommended layout uses PCB copper areas which extend beyond the exposed solder pad. The exposed solder pads should be defined by a solder mask which matches the pad layout of the TBU® device in size and spacing. It is recommended that they should be the same dimension as the TBU® pads but if smaller solder pads are used, they should be centered on the TBU® package terminal pads and not more than 0.10-0.12 mm (0.004-0.005 in.) smaller in overall width or length. Solder pad areas should not be larger than the TBU® pad sizes to ensure adequate clearance is maintained. The recommended MM (INCHES) 1.275 (.050) 0.25 C PIN 1 (.010) 1.30 (.051) 0.70 (.028) DIMENSIONS: Recommended Pad Layout 1.25 (.049) 0.85 (.033) 0.75 (.030) stencil thickness is 0.10-0.12 mm (0.004-0.005 in.) with a stencil opening size 0.025 mm (0.0010 in.) less than the solder pad size. Extended copper areas beyond the solder pad significantly improve the junction to ambient thermal resistance, resulting in operation at lower junction temperatures with a corresponding benefit of reliability. All pads should soldered to the PCB, including pads marked as NC or NU but no electrical connection should be made to these pads. For minimum parasitic capacitance, it is recommended that signal, ground or power signals are not routed beneath any pad. Thermal Resistance vs Additional PCB Cu Area 120 1 7 2 6 3 5 4 Dark grey areas show added PCB copper area for better thermal resistance. Thermal Resistance (°C/W) 8 Power in One Side of TBU® Device Total Power in Both Sides of TBU® Device 100 80 60 40 20 0 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 Added Cu Area (Sq. In.) 1.6 1.8 2.0 ® 3312Series - 2 mm SMD Trimming Potentiometer TBU-PK - TBU High-Speed Protectors Reflow Profile Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Preheat - Temperature Min. (Tsmin) - Temperature Max. (Tsmax) - Time (tsmin to tsmax) Time maintained above: - Temperature (TL) - Time (tL) Peak/Classification Temperature (Tp) Time within 5 °C of Actual Peak Temp. (tp) Ramp-Down Rate Time 25 °C to Peak Temperature Pb-Free Assembly 3 °C/sec. max. 150 °C 200 °C 60-180 sec. 217 °C 60-150 sec. 260 °C 20-40 sec. 6 °C/sec. max. 8 min. max. E T E L O S B O How to Order Typical Part Marking TBU - PK 085 - 100 - WH TBU® Product Series PK = Dual Bidirectional Series MANUFACTURER’S TRADEMARK PRODUCT CODE - 1ST DIGIT INDICATES PRODUCT FAMILY: K = TBU-PK SERIES - 2ND & 3RD DIGITS INDICATE IMPULSE VOLTAGE: 50 = 500 V 60 = 600 V 75 = 750 V 85 = 850 V - 4TH DIGIT INDICATES TRIGGER CURRENT: 1 = 100 mA Impulse Voltage Rating 050 = 500 V 060 = 600 V 075 = 750 V 085 = 850 V PIN 1 MANUFACTURING DATE CODE - 1ST DIGIT INDICATES THE YEAR’S 6-MONTH PERIOD. - 2ND DIGIT INDICATES THE WEEK NUMBER IN THE 6-MONTH PERIOD. - 3RD & 4TH DIGITS INDICATE SPECIFIC LOT FOR THE WEEK. Trigger Current 100 = 100 mA Hold to Trip Ratio Suffix W = Hold to Trip Ratio 6-MONTH PERIOD CODES: A = JAN-JUN 2009 C = JAN-JUN 2010 B = JUL-DEC 2009 D = JUL-DEC 2010 Package Suffix H = DFN Package E = JAN-JUN 2011 F = JUL-DEC 2011 Device Pin Out Pad Designation 5 8 4 1 2 Pad # 1 2 3 4 5 6 7 8 Pin Out Line 1 Vdd (SLIC Ground or 0 V) Not Used Line 1 SLIC Line 2 SLIC Vss (SLIC Negative Supply or -Vbat) Not Used Line 2 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. 3312 - Series 2 mm SMD Potentiometer TBU-PK - TBU®Trimming High-Speed Protectors Packaging Specifications P0 E D t B P2 TOP COVER TAPE A N F W C D B0 K0 E T E L O S B O CENTER LINES OF CAVITY A0 P D1 EMBOSSMENT G (MEASURED AT HUB) USER DIRECTION OF FEED QUANTITY: 3000 PIECES PER REEL A Min. 326 (12.835) B Max. 330 (13.002) Min. 1.5 (.059) A0 Min. 4.30 (.169) Max. 2.5 (.098) B0 Max. 4.50 (.177) Min. 6.70 (.264) K0 Min. 1.0 (.039) C Min. 7.9 (.311) D Max. 13.5 (.531) D Max. 6.90 (.272) Min. 1.5 (.059) P Max. 1.2 (.047) Min. 12.8 (.504) Min. 3.9 (.159) Max. - D1 Max. 1.6 (.063) Min. 1.5 (.059) P0 Max. 8.1 (.319) Min. 20.2 (.795) E Max. - Min. 1.65 (.065) P2 Max. 4.1 (.161) Min. 1.9 (.075) G Ref. 16.5 (.650) F Max. 1.85 (.073) Min. 7.4 (.291) Max. 0.35 (.014) Min. 15.7 (.618) t Max. 2.1 (.083) Min. 0.25 (.010) Asia-Pacific: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116 EMEA: Tel: +36 88 520 390 • Fax: +36 88 520 211 The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700 www.bourns.com REV. 04/15 “TBU” is a registered trademark of Bourns, Inc. in the United States and other countries. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. N Ref. 102 (4.016) max. 7.6 (.299) W DIMENSIONS: Max. 16.3 (.642) MM (INCHES)