TISP 8-pin SOP Packages

TISP® THYRISTOR SURGE PROTECTORS
Bourns Manufacturers Representatives
Corporate Distributor Product Managers
Americas Sales Team
Asia Sales Team
Europe Sales Team
FAE Team
November, 2011 - Revised March, 2014
Additional Assembly/Test Location
for TISP® Thyristor Surge Protector 8-pin SOP Packages
In order to support our fast growing demand, secure continuity of supply and provide maximum flexibility to our
customers, Bourns, Inc. is adding an additional Assembly/Test Location in India for the assembly/test of 8-pin SOP
(150 mil) packages (MS012, JEDEC 95) for TISP® Thyristor Surge Protector products.
Below are the affected Bourns® part numbers using an 8-pin SOP (150 mil) package (MS012, JEDEC 95):
Part Number
R1W065DR-S
R3589DR-S
R3601DR-S
R3602CDR-S
R3602DR-S
R3604-1DR-S
R3604-2DR-S
R3604-4DR-S
R3620DR-S
R3653-3DR-S
R3653-4DR-S
R3653DR-S
R3661DR-S
R7W080DR-S
R7W120DR-S
R7W200DR-S
R3604-3DR-S
R3679DR-S
R3680DR-S
Part Number
TISP1072F3DR-S
TISP1082F3DR-S
TISP2082F3DR-S
TISP2125F3DR-S
TISP2150F3DR-S
TISP2180F3DR-S
TISP2240F3DR-S
TISP2260F3DR-S
TISP2290F3DR-S
TISP2320F3DR-S
TISP2380F3DR-S
TISP3072F3DR-S
TISP3082F3DR-S
TISP3125F3DR-S
TISP3150F3DR-S
TISP3180F3DR-S
TISP3290F3DR-S
TISP61511DR-S
TISP61521DR-S
Part Number
TISP3380F3DR-S
TISP4072F3DR-S
TISP4150F3DR-S
TISP4180F3DR-S
TISP4290F3DR-S
TISP4380F3DR-S
TISP61060DR-S
TISP61089ASDR-S
TISP61089DR-S
TISP61089SDR-S
TISP6L7591DR-S
TISP6NTP2ADR-S
TISP6NTP2BDR-S
TISP6NTP2CDR-S
TISP7015DR-S
TISP7015L1DR-S
TISP7038DR-S
TISP61089ADR-S
TISP61089BDR-S
Part Number
TISP7072F3DR-S
TISP7082F3DR-S
TISP7125F3DR-S
TISP7150F3DR-S
TISP7180F3DR-S
TISP7240F3DR-S
TISP7260F3DR-S
TISP7290F3DR-S
TISP7320F3DR-S
TISP7350F3DR-S
TISP7380F3DR-S
TISP7038L1DR-S
TISP8210MDR-S
TISP8211MDR-S
TISP8250DR-S
TISPA79R241DR-S
TISPL758LF3DR-S
TISP8200MDR-S
TISP8201MDR-S
TISP83121DR-S
TSP1120REV
Additional Assembly/Test Location for TISP® Thyristor Surge Protector 8-pin SOP Packages
November, 2011 - Revised March, 2014
Page 2 of 3
Qualification:
Below are the Qualification Information & Results using an 8-pin SOP (150 mil) package (MS012, JEDEC 95) at the
new assembly/test location. Qualification by similarity will apply to the part numbers listed above.
Qualification Information:
All Products
Thyristor Overvoltage Protector
See row 1 in Qualification Results table
See row 2 in Qualification Results table
Al
AlNiAu
India
8/SOIC
Sumitomo G600
Sumitomo CRM1076NS
Multiple 2 Mil Cu
Copper
Laser
Matte Sn (Pb Free)
Die Technology
Product Name
Die Name
Top Metal
Back Metal
Assembly Site
Pins/Package
Mold Compound
Die Attach
Bond Wire
L/F Material
Marking
Termination Finish
Qualification Results:
Test Plan
Stress Test
Conditions
Moisture Induced Stress Sensitivity
HTRB,
150 °C,1000 h
85 °C / 85 % RH,
THB
1000 h
65 / +150 °C,
T Cycle
200 cs
Solderability
8 h Steam
Lead Fatigue
Lead Pull
Lead Adhesion
Dimensions
Data Sheet
Flammability
3 mm
W/Bond Pull
Strength
Die Shear
X-Ray
-
Standard
J-STD-020
MIL STD 750
Method
1048
SS/Acc
Level1
129/1
Lot 1
R3604D-S
TT380TQ
SS/fail
6/0
45/0
Lot 2
TISP61089D-S
TG605TQ
SS/fail
6/0
45/0
Lot 3
TISP6NTP2CD-S
TG435TQ
SS/fail
6/0
45/0
J-STD-22
A101
129/1
45/0
45/0
45/0
MIL STD 883
2031
129/1
45/0
45/0
45/0
MIL STD 883
MIL STD 883
MIL STD 883
MIL STD 883
MIL STD 883
UL94-VO
2003
2004
2004
2025
2025
32/0
22/0
22/0
15/0
5/0
11/0
8/0
8/0
8/0
11/0
8/0
8/0
8/0
5
Manufacturer’s Data Sheet
11/0
8/0
8/0
8/0
MIL STD 883
2011
76/0
76/0
76/0
76/0
MIL STD 883
MIL STD 883
2019
2012
5/0
5/0
5/0
5/0
5/0
5/0
5/0
5/0
Samples subjected to HTRB, THB and T Cycle are preconditioned according to JESD22-A113 (260 °C).
Additional Assembly/Test Location for TISP® Thyristor Surge Protector 8-pin SOP Packages
November, 2011 - Revised March, 2014
Page 3 of 3
Product Labeling:
The product marking is unchanged except for the country code information. The labels will show the country of origin
code.
Identification of the Changed Product:
Bourns maintains traceability back to source wafer lots and assembly sites for all products.
First Date Code from New Site:
1205
Impact on Form, Fit, Function and Reliability:
The package outline dimensions will continue to meet MS012, JEDEC 95 and the current Bourns data sheet specifications.
Materials specified for packaging are unchanged. Product ratings and electrical characteristics are unaffected by the
change. There is no impact on form, fit, function or reliability.
Last Date of Manufacture of Existing Product:
Bourns has no plans to discontinue assembly & test of products at its existing sites.
Implementation Date:
Assembly of product at the India location will begin in November 2011.
Deliveries of such products to customers may occur from 90 days after the date of this notice onwards.
If you have any questions, please contact our customer service teams in your region.