Data Sheet

HEF4081B-Q100
Quad 2-input AND gate
Rev. 1 — 13 November 2013
Product data sheet
1. General description
The HEF4081B-Q100 is a quad 2-input AND gate. The outputs are fully buffered for
highest noise immunity and pattern insensitivity to output impedance variations.
It operates over a recommended VDD power supply range of 3 V to 15 V referenced to VSS
(usually ground). Unused inputs must be connected to VDD, VSS, or another input.
This product has been qualified to the Automotive Electronics Council (AEC) standard
Q100 (Grade 1) and is suitable for use in automotive applications.
2. Features and benefits
 Automotive product qualification in accordance with AEC-Q100 (Grade 1)
 Specified from 40 C to +85 C and from 40 C to +125 C
 Fully static operation
 5 V, 10 V, and 15 V parametric ratings
 Standardized symmetrical output characteristics
 Inputs and outputs are protected against electrostatic effects
 ESD protection:
 MIL-STD-883, method 3015 exceeds 2000 V
 HBM JESD22-A114F exceeds 2000 V
 MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 )
 Complies with JEDEC standard JESD 13-B
3. Ordering information
Table 1.
Ordering information
All types operate from 40 C to +125 C.
Type number
HEF4081BT-Q100
Package
Name
Description
Version
SO14
plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
HEF4081B-Q100
NXP Semiconductors
Quad 2-input AND gate
4. Functional diagram
1
2
1A
1B
5
2A
6
2B
8
3A
9
3B
12
4A
13
4B
1Y
3
2Y
4
3Y
10
4Y
11
nA
nB
001aag180
001aai139
Fig 1.
nY
Functional diagram
Fig 2.
Logic diagram (one gate)
5. Pinning information
5.1 Pinning
+()%4
$
9''
%
%
<
$
<
<
$
<
%
%
966
$
DDD
Fig 3.
Pin configuration
5.2 Pin description
Table 2.
Pin description
Symbol
Pin
Description
1A to 4A
1, 5, 8, 12
input
1B to 4B
2, 6, 9, 13
input
1Y to 4Y
3, 4, 10, 11
output
VSS
7
ground (0 V)
VDD
14
supply voltage
HEF4081B_Q100
Product data sheet
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Rev. 1 — 13 November 2013
© NXP B.V. 2013. All rights reserved.
2 of 11
HEF4081B-Q100
NXP Semiconductors
Quad 2-input AND gate
6. Functional description
Table 3.
Function table[1]
Input
Output
nA
nB
nY
L
L
L
L
H
L
H
L
L
H
H
H
[1]
H = HIGH voltage level; L = LOW voltage level.
7. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to VSS = 0 V (ground).
Symbol
Parameter
VDD
supply voltage
IIK
input clamping current
VI
input voltage
IOK
output clamping current
Conditions
Min
VI < 0.5 V or VI > VDD + 0.5 V
VO < 0.5 V or VO > VDD + 0.5 V
Max
Unit
0.5
+18
V
-
10
mA
0.5
VDD + 0.5
V
-
10
mA
II/O
input/output current
-
10
mA
IDD
supply current
-
50
mA
Tstg
storage temperature
65
+150
C
Tamb
ambient temperature
40
+125
C
-
500
mW
-
100
mW
Ptot
total power dissipation
Tamb = 40 C to + 125 C
P
power dissipation
per output
[1]
[1]
For SO14 packages: above Tamb = 70 C, Ptot derates linearly with 8 mW/K.
8. Recommended operating conditions
Table 5.
Recommended operating conditions
Symbol
Parameter
VDD
VI
Conditions
Min
Max
Unit
supply voltage
3
15
V
input voltage
0
VDD
V
Tamb
ambient temperature
in free air
40
+125
C
t/V
input transition rise and fall rate
VDD = 5 V
-
3.75
s/V
VDD = 10 V
-
0.5
s/V
VDD = 15 V
-
0.08
s/V
HEF4081B_Q100
Product data sheet
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Rev. 1 — 13 November 2013
© NXP B.V. 2013. All rights reserved.
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HEF4081B-Q100
NXP Semiconductors
Quad 2-input AND gate
9. Static characteristics
Table 6.
Static characteristics
VSS = 0 V; VI = VSS or VDD; unless otherwise specified.
Symbol Parameter
Conditions
VDD
Tamb = 40 C Tamb = +25 C Tamb = +85 C Tamb = +125 C Unit
Min
VIH
VIL
VOH
VOL
IOH
IOL
HIGH-level
input voltage
LOW-level
input voltage
IDD
supply current
input
capacitance
HEF4081B_Q100
Product data sheet
Max
Min
Max
3.5
-
3.5
-
3.5
-
3.5
-
V
-
7.0
-
7.0
-
7.0
-
V
15 V
11.0
-
11.0
-
11.0
-
11.0
-
V
5V
-
1.5
-
1.5
-
1.5
-
1.5
V
10 V
-
3.0
-
3.0
-
3.0
-
3.0
V
15 V
-
4.0
-
4.0
-
4.0
-
4.0
V
5V
4.95
-
4.95
-
4.95
-
4.95
-
V
10 V
9.95
-
9.95
-
9.95
-
9.95
-
V
15 V
14.95
-
14.95
-
14.95
-
14.95
-
V
5V
-
0.05
-
0.05
-
0.05
-
0.05
V
10 V
-
0.05
-
0.05
-
0.05
-
0.05
V
15 V
-
0.05
-
0.05
-
0.05
-
0.05
V
VO = 2.5 V
5V
-
1.7
-
1.4
-
1.1
-
1.1
mA
VO = 4.6 V
5V
-
0.64
-
0.5
-
0.36
-
0.36
mA
VO = 9.5 V
10 V
-
1.6
-
1.3
-
0.9
-
0.9
mA
VO = 13.5 V
15 V
-
4.2
-
3.4
-
2.4
-
2.4
mA
VO = 0.4 V
5V
0.64
-
0.5
-
0.36
-
0.36
-
mA
VO = 0.5 V
10 V
1.6
-
1.3
-
0.9
-
0.9
-
mA
VO = 1.5 V
15 V
4.2
-
3.4
-
2.4
-
2.4
-
mA
15 V
-
0.1
-
0.1
-
1.0
-
1.0
A
5V
all valid input
combinations; 10 V
IO = 0 A
15 V
-
0.25
-
0.25
-
7.5
-
7.5
A
-
0.5
-
0.5
-
15.0
-
15.0
A
-
1.0
-
1.0
-
30.0
-
30.0
A
-
-
-
7.5
-
-
-
-
pF
IO < 1 A
IO < 1 A
input leakage
current
Min
7.0
LOW-level
output voltage
LOW-level
output current
Max
5V
IO < 1 A
HIGH-level
output current
Min
10 V
HIGH-level
output voltage
II
CI
IO < 1 A
Max
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Rev. 1 — 13 November 2013
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HEF4081B-Q100
NXP Semiconductors
Quad 2-input AND gate
10. Dynamic characteristics
Table 7.
Dynamic characteristics
Tamb = 25 C; for waveforms see Figure 4; for test circuit, see Figure 5; unless otherwise specified. [1]
Symbol Parameter
HIGH to LOW
propagation delay
tPHL
LOW to HIGH
propagation delay
tPLH
Conditions
VDD
nA or nB to nY
nA or nB to nY
Extrapolation formula
Min
Typ
Max
Unit
5V
28 ns + (0.55 ns/pF)CL
-
55
110
ns
10 V
15 V
14 ns + (0.23 ns/pF)CL
-
25
50
ns
12 ns + (0.16 ns/pF)CL
-
20
40
ns
5V
18 ns + (0.55 ns/pF)CL
-
45
90
ns
10 V
9 ns + (0.23 ns/pF)CL
-
20
40
ns
7 ns + (0.16 ns/pF)CL
-
15
30
ns
-
60
120
ns
15 V
HIGH to LOW output
transition time
tTHL
LOW to HIGH output
transition time
tTLH
[1]
5V
10 ns + (1.0 ns/pF)CL
10 V
9 ns + (0.42 ns/pF)CL
-
30
60
ns
15 V
6 ns + (0.28 ns/pF)CL
-
20
40
ns
5V
10 ns + (1.00 ns/pF)CL
-
60
120
ns
10 V
9 ns + (0.42 ns/pF)CL
-
30
60
ns
15 V
6 ns + (0.28 ns/pF)CL
-
20
40
ns
The typical value of the propagation delay and output transition time can be calculated with the extrapolation formula (CL in pF).
Table 8.
Dynamic power dissipation
VSS = 0 V; tr = tf  20 ns; Tamb = 25 C.
Symbol Parameter
PD
dynamic power dissipation
VDD
Typical formula
where:
5 V PD = 450  fi + (fo  CL)  VDD (W)
2
fi = input frequency in MHz;
10 V PD = 2900  fi + (fo  CL)  VDD2 (W) fo = output frequency in MHz;
15 V PD = 11700  fi + (fo  CL)  VDD2 (W) CL = output load capacitance in pF;
(fo  CL) = sum of the outputs;
VDD = supply voltage in V.
HEF4081B_Q100
Product data sheet
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Rev. 1 — 13 November 2013
© NXP B.V. 2013. All rights reserved.
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HEF4081B-Q100
NXP Semiconductors
Quad 2-input AND gate
11. Waveforms
tr
VI
tf
90 %
nA, nB input
VM
0V
10 %
tPLH
VOH
tPHL
90 %
nY output
VM
VOL
10 %
tTLH
tTHL
001aai140
Measurement points are given in Table 9.
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Fig 4.
Input to output propagation delay and output transition times
Table 9.
Measurement points
Supply voltage
Input
Output
VDD
VM
VM
5 V to 15 V
0.5VDD
0.5VDD
VDD
VI
VO
G
DUT
CL
RT
001aag182
Test data is given in Table 10.
Definitions for test circuit:
DUT = Device Under Test.
CL = load capacitance including jig and probe capacitance.
RT = termination resistance should be equal to the output impedance Zo of the pulse generator.
Fig 5.
Test circuit
Table 10.
Test data
Supply voltage
Input
VDD
VI
tr, tf
CL
5 V to 15 V
VSS or VDD
 20 ns
50 pF
HEF4081B_Q100
Product data sheet
Load
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Rev. 1 — 13 November 2013
© NXP B.V. 2013. All rights reserved.
6 of 11
HEF4081B-Q100
NXP Semiconductors
Quad 2-input AND gate
12. Package outline
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
D
E
A
X
c
y
HE
v M A
Z
8
14
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
7
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.01
0.019 0.0100 0.35
0.014 0.0075 0.34
0.16
0.15
0.010 0.057
inches 0.069
0.004 0.049
0.05
0.244
0.039
0.041
0.228
0.016
0.028
0.024
0.01
0.01
0.028
0.004
0.012
θ
8o
o
0
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
Fig 6.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT108-1
076E06
MS-012
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Package outline SOT108-1 (SO14)
HEF4081B_Q100
Product data sheet
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Rev. 1 — 13 November 2013
© NXP B.V. 2013. All rights reserved.
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13. Abbreviations
Table 11.
Abbreviations
Acronym
Description
HBM
Human Body Model
ESD
ElectroStatic Discharge
MM
Machine Model
MIL
Military
14. Revision history
Table 12.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
HEF4081B_Q100 v.1
20131113
Product data sheet
-
-
HEF4081B_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 13 November 2013
© NXP B.V. 2013. All rights reserved.
8 of 11
HEF4081B-Q100
NXP Semiconductors
Quad 2-input AND gate
15. Legal information
15.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
15.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
HEF4081B_Q100
Product data sheet
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 13 November 2013
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Quad 2-input AND gate
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
HEF4081B_Q100
Product data sheet
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17. Contents
1
2
3
4
5
5.1
5.2
6
7
8
9
10
11
12
13
14
15
15.1
15.2
15.3
15.4
16
17
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 1
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional description . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Recommended operating conditions. . . . . . . . 3
Static characteristics. . . . . . . . . . . . . . . . . . . . . 4
Dynamic characteristics . . . . . . . . . . . . . . . . . . 5
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Contact information. . . . . . . . . . . . . . . . . . . . . 10
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 13 November 2013
Document identifier: HEF4081B_Q100