AWF0000CE2

Chip Bead Cores
Chip Bead Cores
Type:
EXCCL
EXCML
EXC3B
Discontinued
■ Features
■ Recommended Applications
● Effective noise suppression for power lines and high
speed signal lines
● Easy pattern layout on PC Board
● RoHS compliant
● Digital equipment such as PCs, word processors,
printers, HDD, PCC, CD-ROMs, DVD-ROMs.
● Digital audio and video equipment such as VCRs,
DVC, CD Players, DVD Players.
● AC adapters, and switching power supplies.
● Electronic musical instruments, and other digital
equipment.
Type: EXCCL, EXCML
● Low D C Resistance 3 to 8 m Ω t ypical: Rated
current (3 and 4 Amperes) (type: EXCML)
● Low impedance
Type: EXC3B
● High impedance for high speed signal line noise
● Increased attenuation
● 60 Ω-1 A, 120 Ω-0.5 A are achieved by using 1608
size (type: EXC3BP)
■ Type: EXCCL
● Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
&
9
$
$
-
6
Type
Part kind
Size
Bead core
Code Dimensions (mm)
Product Code
Noise Filter
Chip type
4532
3225
3216
4.5L3.2L1.8
3.2L2.5L1.6
3.2L1.6L1.6
Form
12
Suffix
Code
Packing
U
Embossed Carrier Taping
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
02 Nov. 2012
Chip Bead Cores
■ Construction
Discontinued
H
■ Dimensions in mm (not to scale)
A
A
W
L
Ferrite core
Dimensions (mm)
W
H
Type
(inch size)
Electrode
L
A
EXCCL4532 4.5±0.4 3.2±0.3 1.8±0.2 0.5±0.2
(1812)
EXCCL3225 3.2±0.3 2.5±0.3 1.6±0.3 0.5±0.3
(1210)
EXCCL3216 3.2±0.3 1.6±0.3 1.6±0.3 0.5±0.3
(1206)
Mass
(Weight)
[mg/pc.]
125.8
60.5
37
■ Type: EXCML
● Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
12
&
9
$
.
-
"
6
Type
Part kind
Product Code
Molded
Chip type
Noise Filter
Bead core
Material
Code Dimensions (mm)
45
32
20
16
■ Construction
Size
4.5L1.6 L1.1
3.2L1.6 L0.9
2.0L1.25L0.9
1.6L0.8 L0.8
Nominal Impedance
The first two digits are
significant figure of
impedance value and the
third one denotes the
number of zeros following
Form
Code
Packing
U
Embossed Carrier Taping
(EXCML16 to 32)
Embossed Carrier Taping
(EXCML45)
H
■ Dimensions in mm (not to scale)
T
e
Type
(inch size)
Conductor
Electrode
W
L
Ferrite core
EXCML16
(0603)
EXCML20
(0805)
EXCML32
(1206)
EXCML45
(1806)
L
1.6±0.2
Dimensions (mm)
W
T
0.8±0.2
e
Mass
(Weight)
[mg/pc.]
0.8±0.2
(0.4)
4.5
2.0±0.2 1.25±0.20 0.9±0.2
(0.5)
10.5
3.2±0.3
1.6±0.3
0.9±0.2
(0.6)
21.5
4.5±0.3
1.6±0.3
1.1±0.2
(0.6)
36.0
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
02 Nov. 2012
Chip Bead Cores
■ Type: EXC3B
Discontinued
● Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
&
9
$
#
#
)
Product Code
Noise Filter
Size
Code Dimensions (mm)
3
1.6L0.8L0.8
Type Characteristics
Multilayer
Chip type
Bead Core
B
P
Nominal Impedance
High frequency
High attenuation
for signal Lines
High frequency
High attenuation
for Power Lines
■ Construction
11
Form
The first two digits are
significant figure of
impedance value and the
third one denotes the
number of zeros following
12
Suffix
Code
Packing
H
Embossed Carrier Taping
■ Dimensions in mm (not to scale)
T
e
Ferrite core
W
L
Inner Conductor
Electrode
Type
(inch size)
EXC3BB
(0603)
EXC3BP
(0603)
L
Dimensions (mm)
W
T
Mass
(Weight)
[mg/pc.]
e
1.6±0.2 0.8±0.2 0.8±0.2 0.3±0.2
4.5
1.6±0.2 0.8±0.2 0.8±0.2 0.3±0.2
4.5
■ Ratings
Impedance
Rated Current
(mA DC)
DC Resistance
(Ω) max.
Type
Part Number
4532
EXCCL4532U1
115
2000
0.1
3225
EXCCL3225U1
45
2000
0.05
3216
EXCCL3216U1
25
2000
0.05
4516
EXCML45A910H
91
3000
0.016
3216
EXCML32A680U
68
3000
0.012
2012
EXCML20A390U
39
4000
0.008
1608
EXCML16A270U
27
4000
0.006
EXC3BP600H
60
1000
0.07
EXC3BP121H
120
500
0.1
EXC3BB221H
220
200
0.3
EXC3BB601H
600
100
0.8
EXC3BB102H
1000
50
1608
(Ω) at 100 MHz
tol.(%)
±25
1
● Category Temperature Range –25 °C to +85 °C
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
02 Nov. 2012
Chip Bead Cores
■ Impedance Characteristics (Reference Data)
Discontinued
1Z1, R, X(?)
1Z1, R, X(?)
Z
R
X
1
10
R : Resistance
1000
100
140
120
100
80
60
40
20
0
Z
1
10000
10
Frequency(MHz)
Z
R
X
1
10
1000
100
R
X
10
1Z1, R, X(?)
1Z1, R, X(?)
100
1000
Frequency(MHz)
10000
LEXCML32A680U (3216)
Z
R
X
10
10000
Z
1
10000
LEXCCL3216U1 (3216)
1
X
100
1000
Frequency(MHz)
140
120
100
80
60
40
20
0
Frequency(MHz)
140
120
100
80
60
40
20
0
R
LEXCML20A390U (2012)
1Z1, R, X(?)
1Z1, R, X(?)
LEXCCL3225U1 (3225)
140
120
100
80
60
40
20
0
X : Reactance
LEXCML16A270U (1608)
LEXCCL4532U1 (4532)
140
120
100
80
60
40
20
0
Measured by HP4291A
∣Z∣ : Impedance
100
1000
140
120
100
80
60
40
20
0
Z
R
X
1
10000
10
Frequency(MHz)
100
1000
Frequency(MHz)
10000
LEXCML45A910H (4516)
1Z1, R, X(?)
180
160
140
120
100
80
60
40
20
0
Z
R
X
1
10
100
1000
Frequency(MHz)
10000
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
02 Nov. 2012
Chip Bead Cores
■ Impedance Characteristics (Reference Data)
Discontinued
Measured by HP4291A
∣Z∣ : Impedance
1400
1200
1000
800
600
400
200
0
200
Z
1
R
X
100
10
1000
Z
150
R
100
X
50
0
1
10000
10
LEXC3BB601H (1608)
1000
10000
LEXC3BP600H (1608)
200
R
1Z1, R, X(?)
1400
1200
1000
800
600
400
200
0
100
Frequency(MHz)
Frequency(MHz)
1Z1, R, X(?)
X : Reactance
LEXC3BP121H (1608)
1Z1, R, X(?)
1Z1, R, X(?)
LEXC3BB221H (1608)
R : Resistance
Z
X
1
10
100
150
Z
100
R
50
X
0
1000
10000
1
10
100
1000
10000
Frequency(MHz)
Frequency(MHz)
1Z1, R, X(?)
LEXC3BB102H (1608)
1400
1200
1000
800
600
400
200
0
Z
R
X
1
10
100
1000
10000
Frequency(MHz)
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
02 Nov. 2012
Chip Bead Cores
■ Packaging Methods (Taping)
Discontinued
● Standard Quantity
Part Number
Kind of Taping
EXCCL4532U1
Pitch (P1)
Quantity
8 mm
1000 pcs./reel
EXCCL3225U1
2000 pcs./reel
EXCCL3216U1
EXCML45A910H
Embossed Carrier Taping
EXCML32A680U
3000 pcs./reel
4 mm
EXCML20A390U
EXCML16A270U
4000 pcs./reel
EXC3B□□□□H
● Embossed Carrier Taping
● Taping Reel
T
Sprocket hole
Compartment
fD0
fC
fB
B
F
W
A
fD
P1
t2
Chip component
P2
E
P0
Tape running direction
fA
W
Embossed Carrier Dimensions (mm)
Part Number
A
B
W
F
P1
EXCCL4532U1
3.6±0.2
4.9±0.2
12.0±0.2
5.5±0.1
8.0±0.1
EXCCL3225U1
2.9±0.2
3.6±0.2
EXCCL3216U1
2.0±0.2
3.6±0.2
8.0±0.2
3.5±0.1
EXCML45A910H
1.9±0.2
4.8±0.2
12.0±0.2
5.5±0.1
EXCML32A680U
1.9±0.2
3.5±0.2
EXCML20A390U
1.5±0.2
2.3±0.2
EXCML16A270U
1.0±0.2
1.8±0.2
8.0±0.2
3.5±0.1
EXC3B□□□□H
1.0±0.1
1.8±0.1
P2
0D0
P0
t2
2.4 max.
2.1 max.
4.0±0.1
2.0±0.1
4.0±0.1
1.5±0.1
1.8 max.
1.6 max.
Standard Reel Dimensions (mm)
Part Number
0A
0B
0C
0D
E
EXCCL4532U1
EXCCL3225U1
EXCCL3216U1
EXCML45A910H
0
180.0–3.0
60.0±1.0
13.0±0.5
21.0±0.8
2.0±0.5
W
T
13.0±0.3
16.5 max.
09.0±0.3
13 max.
13.0±0.3
16.5 max.
09.0±0.3
13 max.
EXCML32A680U
EXCML20A390U
EXCML16A270U
EXC3B□□□□H
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
02 Nov. 2012
Chip Bead Cores
■ Recommended Land Pattern Dimensions in mm (not to scale)
Discontinued
(mm)
A
B
C
Part Number
A
B
C
EXCCL4532U1
3
5.4
2.8
EXCCL3225U1
1.7
4.1
2.1
EXCCL3216U1
1.7
4.1
1.2
EXCML45A910H
2.6 to 3
5.5 to 6.5
1.2 to 1.6
EXCML32A680U
1.6 to 2
4 to 5
1.2 to 1.6
EXCML20A390U
0.8 to 1.2
3 to 4
1 to 1.2
EXCML16A270U
0.6 to 1
2 to 3
0.8 to 1
EXC3B□□□□H
0.8 to 1
2 to 2.6
0.8 to 1
■ Recommended Soldering Conditions
Recommendations and precautions are described below.
● Recommended soldering conditions for reflow
· Reflow soldering shall be performed a maximum of
two times.
· Please contact us for additional information when
used in conditions other than those specified.
· Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability before actual use.
Temperature
Peak
Preheating
Heating
For soldering (Example : Sn-37Pb)
Preheating
Main heating
Peak
Temperature
140 °C to 160 °C
Above 200 °C
235 ± 10 °C
Time
60 s to 120 s
30 s to 40 s
max. 10 s
For lead-free soldering (Example : Sn/3Ag/0.5Cu)
Temperature
Time
Preheating
150 °C to 170 °C
60 s to 120 s
Main heating
Above 230 °C
30 s to 40 s
Peak
max. 260 °C
max. 10 s
Time
● Flow soldering
· Flow soldering may cause this product to come off because the adhesiveness of the product element is low.
Please consult our sales representative in advance about flow soldering.
<Repair with hand soldering>
● Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less. Solder
each electrode for 3 seconds or less.
● Never touch this product with the tip of a soldering iron.
Safety Precautions
The following are precautions for individual products. Please also refer to the common precautions for Noise Suppression
Device shown on this catalog.
1. Use rosin-based flux or halogen-free flux.
2. For cleaning, use an alcohol-based cleaning agent. Before using any other type, consult with our sales person
in advance.
3. Do not apply shock to Chip Bead Cores (hereafter called the bead cores) or pinch them with a hard tool (e.g.
pliers and tweezers). Otherwise, their bodies may be chipped, affecting their performance.
Excessive mechanical stress may damage the bead cores. Handle with care.
4. Store the bead cores in a location with a temperature ranging from -5 °C to +40 °C and a relative humidity of
40 % to 60 %, where there are no rapid changes in temperature or humidity.
5. Use the bead cores within a year (EXC3B Type: within half a year) after the date of the outgoing inspection
indicated on the packages.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
02 Nov. 2012
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