AWF0000CE8

Chip RC Networks
Chip RC Networks
Type:
Discontinued
EZADLU
R2
R1
R1
R2
GND
GND
C
C
GND
GND
■ Recommended Applications
■ Features
● Information equipment and electronic games containing
USB interface
1. Smallest SMD R/C filter for USB interface
● Including 2 circuits of 앟 type R/C filter in a chip
(Chip size:3.2 mm ҂ 1.6 mm)
● Space saving and low placing cost
2. Excellent mountability using concave terminals
● Firm solder joint (2 times that of convex terminal)
● Self-aligning placement during reflow soldering
● RoHS compliant
<Example for using>
R2
C
D+
R1
R1
USB
Driver
USB
Connector
D–
C
R2
■ Explanation of Part Number
1
2
3
4
5
6
7
8
9
10
11
E
Z
A
D
L
U
0
1
A
A
J
Common Code
Thick Film Noise
Suppression and
Filtering
Components
Dimension and
Circuit Configuration
DLU 3.2 mm ҂1.6 mm
Design number
RC filtering circuit for USB interface
Design
Configuration
AA
Standard
12
Resistance Suffix for Special
Tolerance Requirement
J
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
±5 %
Feb. 2006
Discontinued
Chip RC Networks
■ Dimensions in mm(not to scale)
■ Construction
Protective coating
GND
Electrode
(Outer)
0.33±0.10
0.40±0.15
Electrode
(Outer)
10
8
R1
7
0.35±0.15
R2
1
6
3
4
5
0.65 +–0.20
0.10
0.35±0.10
C
C
2
2
0.40±0.15
R1
6
3.20±0.15
9
R2
7
0.45±0.15
10
8
1
0.635±0.100
■ Circuit Configuration
9
1.60±0.15
GND
Electrode
(Outer)
0.2±0.1
Alumina substrate
3
4
5
GND terminal
: 1,2,5,6
I/O terminal
: 3,4,8,9
Dummy terminal : 7,10
Size : 1206 inches
Mass (Weight) [1000 pcs.] : 11 g
■ Ratings
Item
Specification
10 액 to 100 k액
Standard R1:15 액, 27 액, R2:15 k액
Resistor
Resistance Values
Resistance Tolerance
±5%
±200 ҂10–6/°C(ppm/°C)
Temperature Coefficient of Resistance (T.C.R.)
0.063 W(<70 °C(1))
Rated Power
25 V(2)
Limiting Element Voltage (Maximum Rated Continuous Working Voltage)
Capacitor
Capacitance Values
(25 °C, 1 kHz(3), 1 V rms)
10 pF to 100 pF
Standard C:47 pF
Capacitance Tolerance
+30 %/–20 %
Capacitance Temperature Characteristics
E Characteristic: +20 %/–55 %(–25 °C to +85 °C)
Less than 3 %(25 °C, 1 kHz(3), 1 V rms)
Dissipation Factor
Rated Voltage
12 V
Category Temperature Range (Operating Temperature Range)
–25 °C to +85 °C
(1) For resistors operated in ambient temperature above 70 °C, rated power shall be derated.(“Power Derating Curve” is shown below)
(2) Rated Voltage for resistor shall be determined from 앀Rated Power҂Resistance Value, or Limiting Element Voltage (Max. Rated Continuous Working
Voltage) whichever less.
(3) In measuring at 1 MHz, Capacitance and Dissipation Factor are different.
70 °C
Rated Load (%)
Power Derating Curve
For resistors operated in ambient temperatures above
70 °C, power rating shall be derated in accordance
with the figure on the right.
100
80
60
40
85 °C
20
0
30
20
10
0
10 20 30 40 50 60 70 80 90
Ambient Temperature (°C)
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Discontinued
Chip RC Networks
■ Attenuation Characteristics
●EZADLU
Measurement Circuit
0
EZADLU
R1:27 액/R2:15 k액/C:47 pF
-5
Attenuation (dB)
-10
R2
C
-15
-20
R1
R1
50 액
-25
C
-30
R2
50 액
-35
-40
1
10
100
1000
3000
Frequency (MHz)
■ Packaging Methods (Taping)
● Standard Quantity
Type
Kind of Taping
Pitch (P1)
Quantity
EZADLU
Punched Carrier Taping
4 mm
5000 pcs./reel
● Punched Carrier Taping
● Taping Reel
T
Sprocket hole
fD0
Compartment
fC
E
t1
B
F
W
fB
A
t2
Chip component
P1
P2
P0
Tape running direction
fA
Type
A
B
W
F
E
P0
Dimensions EZADLU 2.00±0.20 3.60±0.20 8.00±0.20 3.50±0.05 1.75±0.10 4.00±0.10
(mm)
Type
P1
P2
fD0
t1
t2
Dimensions EZADLU 4.00±0.10 2.00±0.05 1.50+0.10 0.75±0.05 0.84±0.10
–0
(mm)
Type
Dimensions EZADLU
(mm)
Type
Dimensions EZADLU
(mm)
W
fA
fB
fC
180.0+0
–3.0
60 min.
13±1.0
W
T
9.0±1.0
11.4±1.0
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Discontinued
Chip RC Networks
■ Recommended Land Pattern Design
●EZADLU
b
P
f
a
d
Land pattern
a
Dimensions 0.9 to 1.1
(mm)
f
Dimensions 2.0 to 2.6
(mm)
c
g
b
c
d
0.2 to 0.3
2.6 to 2.8
0.3 to 0.4
g
P
3.6 to 4.2
0.635
● Design to make GND pattern as large as possible, because high
frequency noise is removed from GND terminals of chip RC network.
■ Recommended Soldering Conditions
Recommendations and precautions are described below.
● Recommended soldering conditions for reflow
·Reflow soldering shall be performed a maximum of
two times.
·Please contact us for additional information when
used in conditions other than those specified.
·Please measure the temperature of the terminals and
study every kind of solder and printed circuit board
for solderability before actual use.
Preheating
Main heating
Peak
Temperature
Time
140 °C to 160 °C
60 s to120 s
Above 200 °C
30 s to 40 s
235 ± 5 °C
max. 10 s
For lead-free soldering (Example : Sn/Ag/Cu)
Peak
Temperature
For soldering (Example : Sn/Pb)
Preheating
Preheating
Heating
Main heating
Peak
Temperature
Time
150 °C to 180 °C
60 s to 120 s
Above 230 °C
30 s to 40 s
max. 260 °C
max. 10 s
This product has circuits on both sides. Therefore, do not use
adhesives because they may impair the products characteristics.
Time
● Flow Soldering
We do not recommend flow soldering to the Chip RC Networks: EZADLU, because solder bridging may
occur due to the narrow 0.635 mm pitch.
Safety Precautions
The following are precautions for individual products. Please also refer to the precautions common to EMI Filters,
Fuses, and Sensors(MR Elements) shown on page EX2 of this catalog.
1. Take measures against mechanical stress during and after mounting of Chip RC Networks (hereafter called the RC networks)
so as not to damage their electrodes and protective coatings.
Be careful not to misplace the RC networks on the land patterns. Otherwise, solder bridging may occur.
2. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the RC networks' performance
and/or reliability.
3. Perform sufficient preheating so that the difference of the solder temperature and the RC networks chip surface
temperature becomes 100 °C or less. Maintain the temperature difference within 100 °C during rapid cooling by
immersion into solvent after soldering.
4. When soldering with a soldering iron, never touch the RC networks' bodies with the tip of the soldering iron. When
using a soldering iron with a high temperature tip, finish soldering as quickly as possible (within three seconds at
350 °C max.).
5. As the amount of applied solder becomes larger, the mechanical stress applied to the RC networks increases, causing
problems such as cracks and faulty characteristics. Avoid applying an excessive amounts of solder.
6. Do not apply shock to the RC networks or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the RC networks'
protective coatings and bodies may be chipped, affecting their performance.
7. Avoid excessive bending of printed circuit boards in order to protect the RC networks from abnormal stress.
8. The static capacitance may decrease by a few percent from the time of shipment due to the characteristics peculiar to
dielectric materials having a high dielectric constant.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Safety Precautions (Common precautions for EMI Filters, Fuses, and Sensors[MR Elements])
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifications with us in advance. The design and specifications in this catalog are subject
to change without prior notice.
• Do not use the products beyond the specifications described in this catalog.
• This catalog explains the quality and performance of the products as individual components. Before use, check
and evaluate their operations when installed in your products.
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment
where a defect in these products may cause the loss of human life or other significant damage, such as damage to
vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating
appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.
✽ Systems equipped with a protection circuit and a protection device
✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault
(1) Precautions for use
• These products are designed and manufactured for general and standard use in general electronic equipment
(e.g. AV equipment, home electric appliances, office equipment, information and communication equipment)
• These products are not intended for use in the following special conditions. Before using the products,
carefully check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent
2. In direct sunlight, outdoors, or in dust
3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
4. Electric Static Discharge (ESD) Environment
These components are sensitive to static electricity and can be damaged under static shock (ESD).
Please take measures to avoid any of these environments.
Smaller components are more sensitive to ESD environment.
5. Electromagnetic Environment
Avoid any environment where strong electromagnetic waves exist.
6. In an environment where these products cause dew condensation
7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with
resin or other materials
• These products generate Joule heat when energized. Carefully position these products so that their heat will
not affect the other components.
• Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating components. Do not mount or place heat-generating components
or inflammables, such as vinyl-coated wires, near these products (except Thermal Cutoffs).
• Note that non-cleaning solder, halogen-based highly active fl ux, or water-soluble flux may deteriorate the
performance or reliability of the products.
• Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance
or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water
residues. Otherwise, the insulation performance may be deteriorated.
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of arrival
at your company, provided that they remain packed as they were when delivered and stored at a temperature
of 5 °C to 35 °C and a relative humidity of 45 % to 85 %. (Micro Chip Fuses: Guaranteed for 6 months from the
date of arrival at your company)
The performance of EMI Filters is guaranteed for 6 months or a year from the outgoing inspection date indicated on
the packages, provided that they are stored at a temperature of -5 °C to +40 °C and a relative humidity of 40 %
to 60 %. Check the guarantee period in the specifications. The performance of Thermal Cutoffs is guaranteed for a
year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of
-10 °C to +40 °C and a relative humidity of 30 % to 75 %.
Even within the above guarantee periods, do not store these products in the following conditions. Otherwise,
their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping
materials) may be deformed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
2. In direct sunlight
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
Feb. 2006
– EX2 –
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