SC70-6 and SOT23-6/8 to DIP-8
Evaluation Board
User’s Guide
© 2009 Microchip Technology Inc.
DS51874A
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
rfPIC and UNI/O are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified
logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, PIC32 logo, REAL ICE, rfLAB, Select Mode, Total
Endurance, TSHARC, UniWinDriver, WiperLock and ZENA
are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2009, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS51874A-page 2
© 2009 Microchip Technology Inc.
SC70-6 AND SOT-23-6/8 TO DIP-8
EVALUATION BOARD USER’S GUIDE
Table of Contents
Preface ........................................................................................................................... 5
Chapter 1. Product Overview
1.1 Introduction ..................................................................................................... 9
1.2 What is the SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board? ................. 9
1.3 What the SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board Kit Includes . 10
Chapter 2. Installation and Operation
2.1 Introduction ................................................................................................... 11
2.2 Features ....................................................................................................... 11
2.3 Getting Started ............................................................................................. 12
2.4 SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board Description ................. 15
Appendix A. Schematic and Layouts
A.1 Introduction .................................................................................................. 23
A.2 Schematics and PCB Layout ....................................................................... 23
Appendix B. Bill of Materials (BOM)
Appendix C. Board Revision 1 Errata
C.1 Issue ............................................................................................................ 33
C.2 Solution ........................................................................................................ 33
C.3 How to Determine pCB Revision ................................................................. 33
C.4 Schematics and PCB Layout of Revision 1 ................................................. 33
Worldwide Sales and Service .................................................................................... 42
© 2009 Microchip Technology Inc.
DS51874A-page 3
SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board User’s Guide
NOTES:
DS51874A-page 4
© 2009 Microchip Technology Inc.
SC70-6 AND SOT-23-6/8 TO DIP-8
EVALUATION BOARD USER’S GUIDE
Preface
NOTICE TO CUSTOMERS
All documentation becomes dated, and this manual is no exception. Microchip tools and
documentation are constantly evolving to meet customer needs, so some actual dialogs
and/or tool descriptions may differ from those in this document. Please refer to our web site
(www.microchip.com) to obtain the latest documentation available.
Documents are identified with a “DS” number. This number is located on the bottom of each
page, in front of the page number. The numbering convention for the DS number is
“DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the
document.
For the most up-to-date information on development tools, see the MPLAB® IDE on-line help.
Select the Help menu, and then Topics to open a list of available on-line help files.
INTRODUCTION
This chapter contains general information that will be useful to know before using the
SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board. Items discussed in this chapter
include:
•
•
•
•
•
•
Document Layout
Conventions Used in this Guide
The Microchip Web Site
The Microchip Web Site
Customer Support
Document Revision History
DOCUMENT LAYOUT
This document describes how to use the SC70-6 and SOT-23-6/8 to DIP-8 Evaluation
Board as a development tool to emulate and debug firmware on a target board. The
manual layout is as follows:
• Chapter 1. “Product Overview” – Important information about the SC70-6 and
SOT-23-6/8 to DIP-8 Evaluation Board.
• Chapter 2. “Installation and Operation” – Includes instructions on how to get
started with this evaluation board.
• Appendix A. “Schematic and Layouts” – Shows the schematic and layout
diagrams for the SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board.
• Appendix B. “Bill of Materials (BOM)” – Lists the parts used to build the SC70-6
and SOT-23-6/8 to DIP-8 Evaluation Board.
© 2009 Microchip Technology Inc.
DS51874A-page 5
SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board User’s Guide
CONVENTIONS USED IN THIS GUIDE
This manual uses the following documentation conventions:
DOCUMENTATION CONVENTIONS
Description
Arial font:
Italic characters
Represents
Referenced books
Emphasized text
A window
A dialog
A menu selection
A field name in a window or
dialog
A menu path
MPLAB® IDE User’s Guide
...is the only compiler...
the Output window
the Settings dialog
select Enable Programmer
“Save project before build”
A dialog button
A tab
A number in verilog format,
where N is the total number of
digits, R is the radix and n is a
digit.
A key on the keyboard
Click OK
Click the Power tab
4‘b0010, 2‘hF1
Italic Courier New
Sample source code
Filenames
File paths
Keywords
Command-line options
Bit values
Constants
A variable argument
Square brackets [ ]
Optional arguments
Curly brackets and pipe
character: { | }
Ellipses...
Choice of mutually exclusive
arguments; an OR selection
Replaces repeated text
#define START
autoexec.bat
c:\mcc18\h
_asm, _endasm, static
-Opa+, -Opa0, 1
0xFF, ‘A’
file.o, where file can be
any valid filename
mcc18 [options] file
[options]
errorlevel {0|1}
Initial caps
Quotes
Underlined, italic text with
right angle bracket
Bold characters
N‘Rnnnn
Text in angle brackets < >
Courier New font:
Plain Courier New
Represents code supplied by
user
DS51874A-page 6
Examples
File>Save
Press <Enter>, <F1>
var_name [,
var_name...]
void main (void)
{ ...
}
© 2009 Microchip Technology Inc.
Preface
THE MICROCHIP WEB SITE
Microchip provides online support via our web site at www.microchip.com. This web
site is used as a means to make files and information easily available to customers.
Accessible by using your favorite Internet browser, the web site contains the following
information:
• Product Support – Data sheets and errata, application notes and sample
programs, design resources, user’s guides and hardware support documents,
latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQs), technical
support requests, online discussion groups, Microchip consultant program
member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip
press releases, listing of seminars and events, listings of Microchip sales offices,
distributors and factory representatives
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
•
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Development Systems Information Line
Customers should contact their distributor, representative or field application engineer
(FAE) for support. Local sales offices are also available to help customers. A listing of
sales offices and locations is included in the back of this document.
Technical support is available through the web site at: http://support.microchip.com
In addition, there is a Development Systems Information Line which lists the latest
versions of Microchip's development systems software products. This line also
provides information on how customers can receive currently available upgrade kits.
The Development Systems Information Line numbers are:
1-800-755-2345 – United States and most of Canada
1-480-792-7302 – Other International Locations
DOCUMENT REVISION HISTORY
Revision A (October 2009)
• Initial Release of this Document.
© 2009 Microchip Technology Inc.
DS51874A-page 7
SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board User’s Guide
NOTES:
DS51874A-page 8
© 2009 Microchip Technology Inc.
SC70-6 AND SOT-23-6/8 TO DIP-8
EVALUATION BOARD USER’S GUIDE
Chapter 1. Product Overview
1.1
INTRODUCTION
This chapter provides an overview of the SC70-6 and SOT-23-6/8 to DIP-8 Evaluation
Board and covers the following topics:
• What is the SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board?
• What the SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board kit includes
1.2
WHAT IS THE SC70-6 AND SOT-23-6/8 TO DIP-8 EVALUATION BOARD?
The SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board allows the system designer to
quickly evaluate the operation of Microchip Technology’s devices in any of the following
packages:
•
•
•
•
•
•
•
•
SC70-6
SC70-5
SC70-3
SOT-23-8
SOT-23-6
SOT-23-5
SOT-23-3
DIP-8
The board has a 6-pin header (PICkit Serial, ICSP, etc.) that can be easily jumpered to
the device’s desired pins to communicate with the device (using PICkit Serial) or in the
case of PIC microcontrollers or EEPROM, programmed (using ICSP).
Figure 1-1 shows the top view of the PCB. The board allows the devices to easily be
jumpered into a desired circuit. Also, the SC70 and SOT-23 packages could be
converted to a DIP footprint. Each pad has a passive component footprint that is
connected to the VDD plane (RxU) and a second passive component footprint that is
connected to the VSS plane (RxD).
FIGURE 1-1:
© 2009 Microchip Technology Inc.
PCB Top View.
DS51874A-page 9
SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board User’s Guide
Devices from the following Microchip product families can be installed into this PCB:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
1.3
A/D Converters (ADCs)
Battery Management
CAN
Comparators
D/A Converters (DACs)
DC-to-DC Converters
Digital Potentiometers (Digi-Pots)
EEPROM Serial Memory
Fan Controllers
IrDA
LIN
Linear Regulators
Operational Amplifiers (Op Amps)
Piezoelectric Horn Driver
Power MOSFET Drivers
Programmable Gain Amplifiers (PGAs)
Selectable Gain Amplifiers
Smoke Detection Front End
Switching Regulators
Temperature Sensors
Voltage References
Voltage Supervisors and Detectors
PICmicro® Microcontrollers
WHAT THE SC70-6 AND SOT-23-6/8 TO DIP-8 EVALUATION BOARD KIT
INCLUDES
This SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board kit includes:
• SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board, 102-00273
• Important Information Sheet
DS51874A-page 10
© 2009 Microchip Technology Inc.
SC70-6 AND SOT-23-6/8 TO DIP-8
EVALUATION BOARD USER’S GUIDE
Chapter 2. Installation and Operation
2.1
INTRODUCTION
The SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board allows the system designer to
quickly evaluate the operation of devices. This board is generic so that any device, of
the appropriate footprint, may be installed. Refer to the device data sheet, however, for
suitability of device evaluation (noise, lead length, signal integrity, etc).
As well as the device, other desired passive components (resistors and capacitors) and
connection posts may be installed. This allows the board to evaluate a minimum
configuration for the device. Also, this allows the device to be easily jumpered into an
existing system.
The board also has a 6-pin interface (PICkit Serial, ICSP, BFMP, etc.) whose signals
can easily be jumpered to any of the device’s pins.
2.2
FEATURES
The SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board has the following features:
• Connection terminals may be either through-hole or surface-mount
• Three package type footprints supported:
- SC70-6
- SC70-5
- SC70-3
- SOT-23-8
- SOT-23-6
- SOT-23-5
- SOT-23-3
- DIP-8 (300 millimeter spacing)
• Footprints for optional passive components (SMT 805 footprint) for:
- Power supply filtering (C1 and C2 footprints)
- Device bypass capacitor (RxD footprint for device pin connected to VDD)
- Output filtering (RxD footprint)
- Output pull-up resistor (RxU footprint)
- Output pull-down resistor (RxD footprint)
- Output loading resistor (RxD footprint)
• Silk-screen area to write specifics of implemented circuit (on back of PCB), such
as MCP4018 10 kΩ
• Can be used for SC70 or SOT-23 to DIP-8 converter
• PICkit Serial Analyzer / PICkit 2 Programming (ICSP) Header
© 2009 Microchip Technology Inc.
DS51874A-page 11
SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board User’s Guide
2.3
GETTING STARTED
The SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board is a blank PCB that allows the
user to configure the circuit to the exact requirements. The passive components use
the surface-mount 805 package layout.
This evaluation board supports the following Microchip product device families:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
A/D Converters (ADCs)
Battery Management
CAN
Comparators
D/A Converters (DACs)
DC-to-DC Converters
Digital Potentiometers (Digi-Pots)
EEPROM Serial Memory
Fan Controllers
IrDA
LIN
Linear Regulators
Operational Amplifiers (Op Amps)
Piezoelectric Horn Driver
Power MOSFET Drivers
Programmable Gain Amplifiers (PGAs)
Selectable Gain Amplifiers
Smoke Detection Front End
Switching Regulators
Temperature Sensors
Voltage References
Voltage Supervisors and Detectors
PICmicro® Microcontrollers
Figure 2-1 shows the evaluation board circuit. The pins on the 8-pin SOT-23-8 and DIP
devices are tied together (pin number to pin number). The pins of the6-pin SC70 and
SOT-23 devices are tied as if the DIP was a 6-pin DIP. This circuit allows each pin to
individually have any of the following: a pull-up resistor, a pull-down resistor (or a
loading/filtering capacitor). Power supply filtering capacitors are connected between
the VDD and VSS pads (C1 and C2).
The circuit has a 6-pin header that can be used for PICkit Serial communication as well
as PIC ICSP. The signals of this header would need to be jumpered to the appropriate
device signal.
DS51874A-page 12
© 2009 Microchip Technology Inc.
Installation and Operation
TP1
TP2
PICkit
Serial
Interface
H1
DIP-8 (1)
TP3
1
TP8
SC70-6 (1, 2)
8
TP7
NC
VDD
VSS
SDA
SCL
NC
7
2
TP6
3
1
6
2
5
3
4
6
TP5
5
4
SOT-23-8 (1, 2)
Requires blue
wire jumpering
to connect the
PICkit Interface
to the selected
device
TP4
1
8
2
7
3
6
4
5
R1U
TP1
R1D
R2U
TP2
R2D
VDD
C1
VSS
SOT-23-6 (1, 2)
C2
TP1
1
6
TP8
TP2
2
5
TP7
TP3
3
4
TP6
R7U
TP7
R7D
R8U
TP8
R8D
Note 1:
The SC70 VDD (SOT-23 VSS) signal is connected to the DIP-8 VDD/VSS signal, and the SC70 VSS
(SOT-23 VDD) signal is connected to the DIP-8 VSS/VDD signal.
2:
Only one of the SC70 or SOT-23 footprints may be populated at a give time.
3:
The SC70-6 and SOT-23-8 footprints will be superimposed on the PCB due to the similarity of the
package lead width and lead pitch dimensions.
FIGURE 2-1:
SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board Circuit.
© 2009 Microchip Technology Inc.
DS51874A-page 13
SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board User’s Guide
2.3.1
The Hardware
Figure 2-2 shows the component layout of the SC70-6 and SOT-23-6/8 to DIP-8
Evaluation Board. This is a small four-layer board (1.43" x 1.255" (36.322 mm x
31.877 mm)). There are ten connection points/pads that can use either through-hole or
surface-mount connector posts.
The pad labeled VDD is connected to the PCB power plane, while the pad labeled VSS
is connected to the PCB ground plane. All the passive components that are connected
to VDD or VSS are connected to either the power plane or ground plane.
The eight remaining PCB pads correspond to the device pins (i.e.; pad 1 connects to
pin 1).
Each pad has two passive components associated with them: a pull-up resistor and a
pull-down resistor. The pull-up resistor is always RXU and the pull-down resistor is
RXD. The “X” is a numeric value that corresponds to a particular pad (1 to 8). As an
example, Pad 5’s pull-up resistor is R5U. Capacitor C1 and C2 are the power supply
filtering capacitors. For whichever pin is the device’s VDD, the RxD component
footprint can be used for the device’s bypass capacitor. Table 2-1 describes the
components.
A 6-pin header interface is available to support the PICkit Serial or the PICmicro
In-Circuit Serial Programming (ICSP) interface. For additional information, refer to
Section 2.4.5 “PICkit Serial or In-Circuit Serial Programming (ICSP) Interface
(Header J1)”.
FIGURE 2-2:
DS51874A-page 14
SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board Layout.
© 2009 Microchip Technology Inc.
Installation and Operation
TABLE 2-1:
OPTIONAL PASSIVE COMPONENTS (2)
Component
C1, C2
Power supply bypass capacitors
R1U, R2U, R3U, R4U, R5U, R6U, R7U, R8U
Pull-up resistor
R1D, R2D, R3D, R4D, R5D, R6D, R7D, R8D
Pull-down resistor (1)
Note 1:
2:
2.4
Comment
Whichever pin is the device’s VDD pin, that corresponding RXD footprint can be
used for the device’s bypass capacitor. So if Pin 8 is the device’s VDD pin, then
install the bypass capacitor in the R8D footprint.
All passive components use the surface mount 805 footprint
SC70-6 AND SOT-23-6/8 TO DIP-8 EVALUATION BOARD DESCRIPTION
The SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board PCB is designed to be flexible
in the type of device evaluation that can be implemented.
The following sections describe each element of this evaluation board in further detail.
Refer to Figure 2-3.
2.4.1
Power and Ground
The SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board has a VDD Pad and a VSS
pad. These pads can have connection posts installed that allows easy connection to
the power (VDD) and ground (VSS) planes. The layout allows either through-hole or
surface-mount connectors.
The power and ground planes are connected to the appropriate passive components
on the PCB (such as power plane to RXU and ground plane to RXD components).
2.4.2
PCB PADs
For each package pin (pins 1 to 8), there is a PCB pad (pads 1 to 8). The device will
have some power pins (VDD) and some ground pins (VSS). To ease connections on the
PCB, vias to the power and ground plane have been installed close to each PCB pad.
This allows any pad to be connected to the power or ground plane (see Figure 2-3). So
when power is connected to the VDD and VSS pads, the power is connected to the
appropriate device pin.
Jumpering to VSS
or
Jumpering to VDD
or
0Ω
0Ω
FIGURE 2-3:
© 2009 Microchip Technology Inc.
Connecting the PCB pad to either VDD or VSS.
DS51874A-page 15
SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board User’s Guide
2.4.3
Passive Components (RXU, RXD, C1, and C2)
The footprints for these components are present to allow maximum flexibility in the use
of this PCB to evaluate a wide range of devices. The purpose of these components may
vary depending on the device under evaluation and how it is to be used in the desired
circuit. Refer to the device data sheet for the recommended components that should
be used when evaluating that device.
• Component RXU allows a pull-up resistor to be installed for the device pin
• Component RXD allows a pull-down resistor or a a capacitive load/filter to be
installed for the device pin
• Component C1 and C2 allows power supply filtering capacitors to be installed
2.4.4
Device Footprints
This section describes the characteristics of the component footprints so that you are
better able to determine if the desired component(s) will be compatible with the board.
2.4.4.1
SC70-6 AND SOT-23-8
The 6-pin SC70 footprint has been superimposed on the 8-pin SOT-23 footprint.
Figure 2-4 shows how the SC70-6 and the SOT-23-8 footprint have been
superimposed. This was done since the pin pitch and width are identical for these two
packages. Only the body width is different (the SC70 is narrower).
The 6-pin SC70 and 8-pin SOT-23 footprint is laid out for packages that have a typical
pitch of 0.65 mm (BSC), a maximum lead width of 0.30 mm.
The 6-pin SC70 footprint has a molded package width of 1.25 mm (BSC), while the
8-pin SOT-23 footprint has a maximum molded package width of 1.75 mm.
Packages that meet these characteristics should be able to be used with this board.
SC70 Footprint
SOT-23-8 Footprint
FIGURE 2-4:
DS51874A-page 16
Superimposing of SC70-6 and SOT-23-8 Footprints.
© 2009 Microchip Technology Inc.
Installation and Operation
2.4.4.2
SOT-23-6
The 6-pin SOT-23 footprint is laid out for packages that have a typical pitch of 0.65 mm
(BSC), a maximum lead width of 0.45 mm, and a maximum molded package width of
1.75 mm. Six lead SOT-23 packages that meet these characteristics should be able to
be used with this board.
2.4.4.3
DIP-8
The 8-pin DIP footprint is laid out for packages that have a typical pitch of 100 mil
(BSC), a maximum lead width of 22 mil, and a molded package width of 300 mil. 8-lead
SOT-23 packages that meet these characteristics should be able to be used with this
board.
2.4.4.4
PASSIVE COMPONENTS
All passive components (RXU, RXD, and CX) use a surface mount 805 footprint. Any
component that has a compatible footprint could be used with this board.
2.4.4.5
HEADER (1X6)
The header has a typical pitch of 100 mil (BSC). This header is designed to be
compatible with the PICkit Serial Analyzer and PICkit 2 Programmer.
© 2009 Microchip Technology Inc.
DS51874A-page 17
SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board User’s Guide
2.4.5
PICkit Serial or In-Circuit Serial Programming (ICSP) Interface
(Header J1)
Figure 2-5 shows the interface connection of Header J1. The VDD and VSS signals are
connected to the appropriate power or ground plane. The other four signals are open
and can be easily jumpered to any of the eight P1 through P8 connection points.
Top-Layer Traces
Bottom-Layer Traces
Ground Plane
Note:
Silk Screen on Top Layer
indicates PICkit Serial I2C
signals, while Silk Screen on
Bottom Layer indicates
PICkit Serial SPI signals.
Power Plane
FIGURE 2-5:
DS51874A-page 18
PICkit Serial / ICSP Interface Connections.
© 2009 Microchip Technology Inc.
Installation and Operation
2.4.5.1
PICKIT SERIAL INTERFACE
Table 2-2 shows the pin number assignment for the different signals for each of the
supported interface protocols (SPI, I2C, etc.)
TABLE 2-2:
PICKIT SERIAL HEADER SIGNALS
PICkit Serial Header Signal
Pin
Number
SPI
I2C
USART
Microwire
LIN
1
CS
—
TX
CS
TX
2
VDD
VDD
VDD
VDD
—
3
VSS
VSS
VSS
VSS
VSS
4
SDI
SDA
—
SDI
CS/WAKE
5
SCK
SCL
—
SCK
FAULT/TXE
6
SDO
—
RX
SDO
RX
2.4.5.2
Comments
ICSP INTERFACE
The ICSP interface allows a PICmicro MCU device to be programmed with
programmers that support this interface, such as the PICkit 2 programmer (part number
PG164120). Table 2-3 shows the pin number assignment for the ICSP signals.
TABLE 2-3:
Pin
Number
ICSP HEADER SIGNALS
ICSP Signal
1
VPP
2
VDD
3
VSS
Comments
High Voltage Signal
4
DT
ICSP™ Data
5
CLK
ICSP™ Clock
6
—
© 2009 Microchip Technology Inc.
DS51874A-page 19
SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board User’s Guide
2.4.6
Evaluating the MCP4018 Device (A Digital Potentiometer with
I2C interface)
The MCP4018 is a Digital Potentiometer that is in a 6-lead SC70 package with an I2C
serial interface. This allows the device to be communicated to (Read and Write) by the
PICkit Serial Analyzer. For this to occur, the PICkit Serial Analyzer signals must be
connected to the correct MCP4018 signals. These connections are shown in
Figure 2-6.
Other Digital Potentiometers that are supported by this evaluation board are shown in
Table 2-4.
Required “Jumpers” for
PICkit Serial operation.
FIGURE 2-6:
PICkit Serial / ICSP Header and Example Connections
(for MCP4018 - I2C interface).
DS51874A-page 20
© 2009 Microchip Technology Inc.
Installation and Operation
2.4.7
Evaluating the MCP41X2 Device (A Digital Potentiometer with
SPI interface)
The MCP41X2 is a Digital Potentiometer that is in a 8-lead DIP package with an SPI
serial interface. This allows the device to be communicated to (Read and Write) by the
PICkit Serial Analyzer. For this to occur, the PICkit Serial Analyzer signals must be
connected to the correct MCP41X2 signals. These connections are shown in
Figure 2-7.
Other Digital Potentiometers that are supported by this evaluation board are shown in
Table 2-4.
Top Layer View
Bottom Layer View
Required “Jumpers” connections
for PICkit Serial operation.
FIGURE 2-7:
PICkit Serial / ICSP Header and Example Connections
(for MCP41X2 - SPI Interface).
© 2009 Microchip Technology Inc.
DS51874A-page 21
SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board User’s Guide
2.4.8
The PCB as a SC70, SOT-23 to DIP Socket Converter
There may be occasions when it is desirable to convert the footprint of the device to
that of a DIP package. This allows the device to be installed into an existing DIP socket.
Two 1x4 row pins need to be installed into the PCB’s DIP footprint (on the bottom) when
the device is installed into the appropriate package footprint.
This allows the PCB to convert the SC70 and SOT-23 footprints to a 300-mil DIP-8 footprint.
TABLE 2-4:
Device
DS51874A-page 22
SUPPORTED DIGITAL POTENTIOMETERS
SC70
SOT-23
DIP
Comment
MCP4012
—
Yes
—
SOT-23-6, uses Up/Down interface
MCP4013
—
Yes
—
SOT-23-6, uses Up/Down interface
MCP4014
—
Yes
—
SOT-23-5, uses Up/Down interface
MCP4017
Yes
—
—
MCP40D17
Yes
—
—
MCP4018
Yes
—
—
MCP40D18
Yes
—
—
MCP4019
Yes
—
—
MCP40D19
Yes
—
—
MCP4022
—
Yes
—
SOT-23-6, uses Up/Down interface
MCP4023
—
Yes
—
SOT-23-6, uses Up/Down interface
MCP4024
—
Yes
—
SOT-23-5, uses Up/Down interface
MCP4131
—
—
Yes
MCP4132
—
—
Yes
MCP4141
—
—
Yes
MCP4142
—
—
Yes
MCP4151
—
—
Yes
MCP4152
—
—
Yes
MCP4161
—
—
Yes
MCP4162
—
—
Yes
MCP41010
—
—
Yes
MCP41050
—
—
Yes
MCP41100
—
—
Yes
Has multiplexed SDI/SDO
Has multiplexed SDI/SDO
Has multiplexed SDI/SDO
Has multiplexed SDI/SDO
© 2009 Microchip Technology Inc.
SC70-6 AND SOT-23-6/8 TO DIP-8
EVALUATION BOARD USER’S GUIDE
Appendix A. Schematic and Layouts
A.1
INTRODUCTION
This appendix contains the schematics and layouts for the SC70-6 and SOT-23-6/8 to
DIP-8 Evaluation Board. Diagrams included in this appendix:
•
•
•
•
•
•
A.2
Board - Schematic
Board - Top Trace, Silk and Pads
Board - Bottom Trace & Pads
Board - Layer 2 Ground Plane
Board - Layer 3 Power Plane
Board - Bottom Silk, Trace and Pads
SCHEMATICS AND PCB LAYOUT
Board - Schematic shows the schematic of the SC70-6 and SOT-23-6/8 to DIP-8
Evaluation Board. The layer order is shown in Figure A-1.
Top Layer
Ground Layer
Power Layer
Bottom Layer
FIGURE A-1:
© 2009 Microchip Technology Inc.
Layer Order.
DS51874A-page 23
SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board User’s Guide
Board - Schematic
M
A.2.1
DS51874A-page 24
© 2009 Microchip Technology Inc.
Schematic and Layouts
A.2.2
Board - Top Trace, Silk and Pads
© 2009 Microchip Technology Inc.
DS51874A-page 25
SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board User’s Guide
A.2.3
Board - Bottom Trace & Pads
DS51874A-page 26
© 2009 Microchip Technology Inc.
Schematic and Layouts
A.2.4
Board - Layer 2 Ground Plane
© 2009 Microchip Technology Inc.
DS51874A-page 27
SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board User’s Guide
A.2.5
Board - Layer 3 Power Plane
DS51874A-page 28
© 2009 Microchip Technology Inc.
Schematic and Layouts
A.2.6
Board - Bottom Silk, Trace and Pads
© 2009 Microchip Technology Inc.
DS51874A-page 29
SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board User’s Guide
NOTES:
DS51874A-page 30
© 2009 Microchip Technology Inc.
SC70-6 AND SOT-23-6/8 TO DIP-8
EVALUATION BOARD USER’S GUIDE
Appendix B. Bill of Materials (BOM)
TABLE B-1:
Qty
BILL OF MATERIALS
Reference
1
PCB
0
C1, C2
0
J1
0
P1, P2, P3, P4,
P5, P6, P7, P8,
VDD, VSS
P1, P2, P3, P4,
P5, P6, P7, P8,
VDD, VSS
R1U, R2U, R3U,
R4U, R5U, R6U,
R7U, R8U
R3A, R3B, R3C,
R3D, R3E, R3F,
R3G, R3H
U1
0
0
Description
RoHS Compliant Bare PCB, SC70-6 andSOT-23-6/8 to DIP-8 Evaluation Board
Device Power Supply inltering Capacitor
Surface-mount (805 package)
(Optional - Application-dependent)
PICkit Serial or BFMP Header
(6-pin, 100 mil spacing)
Through-hole connector(s) for P1, P2, P3, P4,
P5, P6, P7, P8, VDD, VSS
Surface-mount connector(s) for P1, P2, P3, P4,
P5, P6, P7, P8, VDD, VSS
Manufacturer
Part Number
Microchip
Technology Inc.
—
104-00273
—
—
Keystone
Electronics®
5012
Keystone
Electronics®
5016
User-specified
Pin Pull-up resistor
—
User-specified
Surface-mount (805 package)
(Optional - Application-dependent)
—
User-specified
0
Pin Pull-down resistor (1)
Surface-mount (805 package)
(Optional - Application-dependent)
0
SC70-6 Device (supports SC70-5 and SC70-3
—
User-specified
devices)
0
U2
SOT23-8 Device
—
User-specified
0
U3
DIP-8 Device
—
User-specified
0
U4
SOT23-6 Device (Supports SOT23-5 and
—
User-specified
SOT23-3 devices)
Note 1: These footprints could be used for pin signal filtering by using a capacitor.
2: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM
used in manufacturing uses all RoHS-compliant components
© 2009 Microchip Technology Inc.
DS51874A-page 31
SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board User’s Guide
NOTES:
DS51874A-page 32
© 2009 Microchip Technology Inc.
SC70-6 AND SOT-23-6/8 TO DIP-8
EVALUATION BOARD USER’S GUIDE
Appendix C. Board Revision 1 Errata
C.1
ISSUE
The Revision 1 of this PCB has an issue when the PICkit Serial / ICSP Interface Header
(J1) pin 1 is incorrectly assigned to the PICkit Serials pin 6. This means that the
orientation marker on the PCB are incorrect for the PICkit Serial Analyzer.
C.2
SOLUTION
Orientate the PICkit Serial Analyzer pin 1 to the PCB pin 6. Revision 2 of the Schematic
and PCB addresses this issue.
C.3
HOW TO DETERMINE PCB REVISION
Look at the bottom layer of the board (see Figure C.4.5), in the bottom right corner. You
will see some text, 104-00273-R1. The R1 indicates that the PCB is Revision 1.
C.4
SCHEMATICS AND PCB LAYOUT OF REVISION 1
Board - Schematic - Revision 1 shows the schematic of the SC70-6 and SOT-23-6/8 to
DIP-8 Evaluation Board.
Board - Revision 1 - Top Layer and Silk shows the layout for the top layer of the SC70-6
and SOT-23-6/8 to DIP-8 Evaluation Board. The layer order is shown in Figure C-1.
Top Layer
Ground Layer
Power Layer
Bottom Layer
FIGURE C-1:
© 2009 Microchip Technology Inc.
Layer Order.
DS51874A-page 33
SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board User’s Guide
Board - Schematic - Revision 1
M
C.4.1
DS51874A-page 34
© 2009 Microchip Technology Inc.
Board Revision 1 Errata
C.4.2
Board - Revision 1 - Layout Components and Silk
© 2009 Microchip Technology Inc.
DS51874A-page 35
SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board User’s Guide
C.4.3
Board - Revision 1 - Top Layer and Silk
DS51874A-page 36
© 2009 Microchip Technology Inc.
Board Revision 1 Errata
C.4.4
Board - Revision 1 - Bottom Layer
© 2009 Microchip Technology Inc.
DS51874A-page 37
SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board User’s Guide
C.4.5
Board - Revision 1 - Power Plane
DS51874A-page 38
© 2009 Microchip Technology Inc.
Board Revision 1 Errata
C.4.6
Board - Revision 1 - Ground Plane
© 2009 Microchip Technology Inc.
DS51874A-page 39
SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board User’s Guide
C.4.7
Board - Revision 1 - Bottom
DS51874A-page 40
© 2009 Microchip Technology Inc.
Board Revision 1 Errata
NOTES:
© 2009 Microchip Technology Inc.
DS51874A-page 41
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03/26/09
DS51874A-page 42
© 2009 Microchip Technology Inc.