ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E, ISL31496E, ISL31498E The ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E, ISL31496E, ISL31498E are fault protected, 5V powered, differential transceivers that exceed the RS-485 and RS-422 standards for balanced communication. The RS-485 transceiver pins (driver outputs and receiver inputs) are protected against faults up to ±60V. Additionally, the extended common mode range allows these transceivers to operate in environments with common mode voltages up to ±25V (>2x the RS-485 requirement), making this RS-485 family one of the most robust on the market. Transmitters deliver an exceptional 2.5V (typical) differential output voltage into the RS-485 specified 54Ω load. This yields better noise immunity than standard RS-485 ICs, or allows up to six 120Ω terminations in star network topologies. Receiver (Rx) inputs feature a “Full Fail-Safe” design which ensures a logic high Rx output if Rx inputs are floating, shorted, or on a terminated but undriven (idle) bus. Rx outputs have high drive levels - typically 15mA @ VOL = 1V (for opto-coupled, isolated applications). Features • Fault Protected RS-485 Bus Pins. . . . . . Up to ±60V • Extended Common Mode Range . . . . . . . . . . . ±25V More than Twice the Range Required for RS-485 • 1/4 Unit Load for up to 128 Devices on the Bus • High Transient Overvoltage Tolerance . . . . . . . ±80V • Full Fail-safe (Open, Short, Terminated) RS-485 Receivers • High Rx IOL for Opto-Couplers in Isolated Designs • Hot Plug Circuitry - Tx and Rx Outputs Remain Three-State During Power-up/Power-down • Choice of RS-485 Data Rates . . . 250kbps to 15Mbps • Low Quiescent Supply Current . . . . . . . . . . 2.3mA • Ultra Low Shutdown Supply Current . . . . . . . . 10μA • Pb-Free (RoHS Compliant) Applications • Utility Meters/Automated Meter Reading Systems Half duplex (Rx inputs and Tx outputs multiplexed together) and full duplex pinouts are available. See Table 1 on page 2 for key features and configurations by device number. • High Node Count Systems For fault protected or wide common mode range devices with cable invert (polarity reversal) or logic supply (VL) pins, please see the ISL31480E data sheet. • Building Lighting and Environmental Control Systems Exceptional Rx Operates at >15Mbps Even with a ±25V Common Mode Voltage ISL3149xE Delivers Superior Common Mode Range vs Standard RS-485 Devices 30 • Security Camera Networks • Industrial/Process Control Networks 25 VID = ±1V B COMMON MODE RANGE VOLTAGE (V) 25 • PROFIBUS™ and Field Bus Networks, and Factory Automation A 20 15 10 5 RO 12 0 -7 -12 -20 0 -25 -5 TIME (20ns/ DIV) June 17, 2010 FN7637.0 1 STANDARD RS-485 CLOSEST TRANSCEIVER COMPETITOR ISL3149xE CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright © Intersil Americas Inc. 2010 All Rights Reserved All other trademarks mentioned are the property of their respective owners. ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E, ISL31496E, ISL31498E ±60V Fault Protected, 5V, RS-485/RS-422 Transceivers with ±25V Common Mode Range ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E, ISL31496E, TABLE 1. SUMMARY OF FEATURES HALF/FULL DUPLEX DATA RATE (Mbps) SLEW-RATE LIMITED? EN PINS? HOT PLUG? QUIESCENT ICC (mA) LOW POWER SHDN? PIN COUNT ISL31490E Full 0.25 Yes Yes Yes 2.3 Yes 10, 14 ISL31491E Full 0.25 Yes No Yes 2.3 No 8 ISL31492E Half 0.25 Yes Yes Yes 2.3 Yes 8 ISL31493E Full 1 Yes Yes Yes 2.3 Yes 10, 14 ISL31495E Half 1 Yes Yes Yes 2.3 Yes 8 ISL31496E Full 15 No Yes Yes 2.3 Yes 10, 14 ISL31498E Half 15 No Yes Yes 2.3 Yes 8 PART NUMBER Ordering Information PART NUMBER (Notes 3, 4) PART MARKING TEMP. RANGE (°C) PACKAGE (Pb-Free) PKG. DWG. # ISL31490EIBZ (Note 1) ISL31490 EIBZ -40 to +85 14 Ld SOIC M14.15 ISL31490EIUZ (Note 1) 1490E -40 to +85 10 Ld MSOP M10.118 ISL31490EIRTZ (Note 1) 490E -40 to +85 10 Ld TDFN L10.3x3A ISL31491EIBZ (Note 1) 31491 EIBZ -40 to +85 8 Ld SOIC M8.15 ISL31492EIBZ (Note 1) 31492 EIBZ -40 to +85 8 Ld SOIC M8.15 ISL31492EIUZ (Note 1) 1492E -40 to +85 8 Ld MSOP M8.118 ISL31492EIPZ (Note 2) 31492 EIPZ -40 to +85 8 Ld PDIP E8.3 ISL31492EIRTZ (Note 1) 492E -40 to +85 8 Ld TDFN L8.3x3A ISL31493EIBZ (Note 1) ISL31493 EIBZ -40 to +85 14 Ld SOIC M14.15 ISL31493EIUZ (Note 1) 1493E -40 to +85 10 Ld MSOP M10.118 ISL31495EIBZ (Note 1) 31495 EIBZ -40 to +85 8 Ld SOIC M8.15 ISL31495EIUZ (Note 1) 1495E -40 to +85 8 Ld MSOP M8.118 ISL31496EIBZ (Note 1) ISL31496 EIBZ -40 to +85 14 Ld SOIC M14.15 ISL31496EIUZ (Note 1) 1496E -40 to +85 10 Ld MSOP M10.118 ISL31498EIBZ (Note 1) 31498 EIBZ -40 to +85 8 Ld SOIC M8.15 ISL31498EIUZ (Note 1) 1498E -40 to +85 8 Ld MSOP M8.118 NOTES: 1. Add “-T” suffix for tape and reel. Please refer to TB347 for details on reel specifications. 2. Pb-free PDIPs can be used for through-hole wave solder processing only. They are not intended for use in Reflow solder processing applications. 3. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 4. For Moisture Sensitivity Level (MSL), please see device information pages for ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E, ISL31496E, ISL31498E. For more information on MSL please see techbrief TB363. 2 FN7637.0 June 17, 2010 ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E, ISL31496E, Pin Configurations ISL31492E, ISL31495E, ISL31498E (8 LD MSOP, 8 LD SOIC, 8 LD PDIP, 8 LD TDFN) TOP VIEW ISL31490E, ISL31493E, ISL31496E (10 LD MSOP, 10 LD TDFN) TOP VIEW RO 1 RO 1 8 VCC R RE 2 7 B/Z DE 3 6 A/Y DI 4 D NC 1 14 VCC RE 2 9 A RO 2 DE 3 8 B RE 3 12 A 7 Z DE 4 11 B 6 Y DI 5 D DI 4 5 GND 10 VCC R ISL31490E, ISL31493E, ISL31496E (14 LD SOIC) TOP VIEW GND 5 13 VCC R D 10 Z GND 6 9 Y GND 7 8 NC ISL31491E (8 LD SOIC) TOP VIEW VCC 1 8 A R 7 B RO 2 6 Z DI 3 GND 4 D 5 Y NOTE: Evaluate creepage and clearance requirements at your maximum fault voltage before using small pitch packages (e.g., MSOP and TDFN). Truth Tables TRANSMITTING RECEIVING INPUTS OUTPUTS INPUTS RE DE DI Z Y X 1 1 0 1 X 1 0 1 0 0 0 X High-Z High-Z 1 0 X High-Z* High-Z* NOTE: *Low Power Shutdown Mode (see Note 15 on page 11), except for ISL31491E. RE DE DE Half Duplex Full Duplex OUTPUT A-B RO 0 0 X ≥ -0.01V 1 0 0 X ≤ -0.2V 0 0 0 X Inputs Open/Shorted 1 1 0 0 X High-Z* 1 1 1 X High-Z NOTE: *Low Power Shutdown Mode (see Note 15 on page 11), except for ISL31491E. 3 FN7637.0 June 17, 2010 ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E, ISL31496E, Pin Descriptions 8 LD 8 LD PIN # PIN # PIN (EXCEPT (ISL31491E 10 LD 14 LD NAME ISL31491E) ONLY) PIN # PIN # FUNCTION RO 1 2 1 2 Receiver output: If A-B ≥ -10mV, RO is high; If A-B ≤ -200mV, RO is low; RO = High if A and B are unconnected (floating), shorted together, or connected to an undriven, terminated bus. RE 2 - 2 3 Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE is high. Internally pulled low. DE 3 - 3 4 Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high. They are high impedance when DE is low. Internally pulled high. DI 4 3 4 5 Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low. GND 5 4 5 6, 7 A/Y 6 - - - ±60V Fault Protected RS-485/RS-422 level, non-inverting receiver input and non inverting driver output. Pin is an input if DE = 0; pin is an output if DE = 1. B/Z 7 - - - ±60V Fault Protected RS-485/RS-422 level, inverting receiver input and inverting driver output. Pin is an input if DE = 0; pin is an output if DE = 1. A - 8 9 12 ±60V Fault Protected RS-485/RS-422 level, non-inverting receiver input. B - 7 8 11 ±60V Fault Protected RS-485/RS-422 level, inverting receiver input. Y - 5 6 9 Z - 6 7 10 VCC 8 1 10 PD - - TDFN ONLY - NC - - - 1, 8 4 Ground connection. This is also the potential of the TDFN EPAD. ±60V Fault Protected RS-485/RS-422 level, non-inverting driver output. ±60V Fault Protected RS-485/RS-422 level, inverting driver output. 13, 14 System power supply input (4.5V to 5.5V). TDFN exposed thermal pad (EPAD). Connect to GND. No Internal Connection. FN7637.0 June 17, 2010 ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E, ISL31496E, Typical Operating Circuits ISL31492E, ISL31495E, ISL31498E +5V 1 RO +5V + 0.1μF 8 VCC 8 VCC R D 2 RE B/Z 7 3 DE A/Y 6 4 DI + 0.1μF RT RT DI 4 7 B/Z DE 3 6 A/Y RE 2 R D GND GND 5 5 RO 1 ISL31490E, ISL31493E, ISL31496E (SOIC PIN NUMBERS SHOWN) +5V +5V + 0.1μF 13, 14 VCC 2 RO A 12 R + 0.1μF RT 13, 14 9 Y B 11 VCC 10 Z D 3 RE DE 4 4 DE 5 DI DI 5 RT Z 10 Y 9 D RE 3 11 B R 12 A GND RO 2 GND 6, 7 6, 7 ISL31491E +5V +5V + 0.1μF 1 VCC 2 RO 3 DI A 8 R + 0.1μF RT B 7 Z 6 Y 5 D 1 5 Y VCC D 6 Z RT 7 B R 8 A GND GND 4 4 5 DI 3 RO 2 FN7637.0 June 17, 2010 ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E, ISL31496E, Absolute Maximum Ratings Thermal Information VCC to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V Input Voltages DI, DE, RE . . . . . . . . . . . . . . . . . . -0.3V to (VCC + 0.3V) Input/Output Voltages A/Y, B/Z, A, B, Y, Z . . . . . . . . . . . . . . . . . . . . . . . . ±60V A/Y, B/Z, A, B, Y, Z (Transient Pulse Through 100Ω, (Note 19). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±80V RO . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (VCC +0.3V) Short Circuit Duration Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Indefinite ESD Rating . . . . . . . . . . . . . . . see Electrical Specifications Latch-up (Tested per JESD78, Level 2, Class A) . . . . +125°C Thermal Resistance (Typical) θJA (°C/W) θJC (°C/W) 8 Ld MSOP Package (Notes 5, 8) . . 140 40 8 Ld PDIP* Package (Note 6, 8) . . . 105 60 8 Ld SOIC Package (Note 5, 8) . . . 116 47 8 Ld TDFN Package (Note 7, 9) . . . 50 5 10 Ld MSOP Package (Note 5, 8) . . 135 50 10 Ld TDFN Package (Notes 7, 9). . 58 7 14 Ld SOIC Package (Note 5, 8). . . 88 38 Maximum Junction Temperature (Plastic Package) . . . +150°C Maximum Storage Temperature Range . . . . -65°C to +150°C Pb-free Reflow Profile . . . . . . . . . . . . . . . . *-see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp *Pb-free PDIPs can be used for through-hole wave solder processing only. They are not intended for use in Reflow solder processing applications. Recommended Operating Conditions Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . 5V Temperature Range . . . . . . . . . . . . . . . . . . -40°C to +85°C Bus Pin Common Mode Voltage Range . . . . . . -25V to +25V CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 5. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 6. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. 7. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379 for details. 8. For θJC, the “case temp” location is taken at the package top center. 9. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside. Electrical Specifications PARAMETER Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = +25°C (Note 10). Boldface limits apply over the operating temperature range, -40°C to +85°C. SYMBOL TEST CONDITIONS TEMP MIN (°C) (Note 18) TYP MAX (Note 18) UNITS DC CHARACTERISTICS Driver Differential VOUT (No load) VOD1 Driver Differential VOUT (Loaded, Figure 1A) VOD2 Full - - VCC V RL = 100Ω (RS-422) Full 2.4 3.2 - V RL = 54Ω (RS-485) Full 1.5 2.5 VCC V RL = 54Ω (PROFIBUS, VCC ≥ 5V) Full 2.0 2.5 RL = 21Ω (Six 120Ω terminations for Star Configurations, VCC ≥ 4.75V) Full 0.8 1.3 - V Change in Magnitude of Driver Differential VOUT for Complementary Output States ΔVOD RL = 54Ω or 100Ω (Figure 1A) Full - - 0.2 V Driver Differential VOUT with Common Mode Load (Figure 1B) VOD3 RL = 60Ω, -7V ≤ VCM ≤ 12V Full 1.5 2.1 VCC V RL = 60Ω, -25V ≤ VCM ≤ 25V (VCC ≥ 4.75V) Full 1.7 2.3 RL = 21Ω, -15V ≤ VCM ≤ 15V (VCC ≥ 4.75V) Full 0.8 1.1 - V RL = 54Ω or 100Ω Full -1 - 3 V RL = 60Ω or 100Ω, -20V ≤ VCM ≤ 20V Full -2.5 - 5 V Driver Common-Mode VOUT (Figure 1) VOC 6 FN7637.0 June 17, 2010 ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E, ISL31496E, Electrical Specifications Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = +25°C (Note 10). Boldface limits apply over the operating temperature range, -40°C to +85°C. (Continued) TEST CONDITIONS TEMP MIN (°C) (Note 18) TYP MAX (Note 18) UNITS PARAMETER SYMBOL Change in Magnitude of Driver Common-Mode VOUT for Complementary Output States ΔVOC RL = 54Ω or 100Ω (Figure 1A) Full - - 0.2 V Driver Short-Circuit Current IOSD DE = VCC, -25V ≤ VO ≤ 25V (Note 12) Full -250 - 250 mA IOSD1 At First Fold-back, 22V ≤ VO ≤ -22V Full -83 83 mA IOSD2 At Second Fold-back, 35V ≤ VO ≤ -35V Full -13 13 mA Logic Input High Voltage VIH DE, DI, RE Full 2.5 - - V Logic Input Low Voltage VIL DE, DI, RE Full - - 0.8 V Logic Input Current IIN1 DI Full -1 - 1 μA DE, RE Full -15 6 15 μA DE = 0V, VIN = 12V VCC = 0V or 5.5V VIN = -7V Full - 110 250 μA Full -200 -75 - μA VIN = ±25V Full -800 ±240 800 μA VIN = ±60V (Note 21) Full -6 ±0.5 6 mA VCC = 0V or 5.5V VIN = 12V Full - 90 125 μA VIN = -7V Full -100 -70 - μA VIN = ±25V Full -500 ±200 500 μA VIN = ±60V (Note 21) Full -3 ±0.4 3 mA Full - 20 200 μA Full -100 -5 - μA VIN = ±25V Full -500 ±40 500 μA VIN = ±60V (Note 21) Full -3 ±0.1 3 mA Input/Output Current (A/Y, B/Z) IIN2 Input Current (A, B) (Full Duplex Versions Only) Output Leakage Current (Y, Z) (Full Duplex Versions Only) IIN3 IOZD Receiver Differential Threshold Voltage RE = 0V, DE = 0V, VIN = 12V VCC = 0V or 5.5V VIN = -7V VTH -25V ≤ VCM ≤ 25V Full -200 -100 -10 mV Receiver Input Hysteresis ΔVTH -25V ≤ VCM ≤ 25V +25 - 25 - mV Receiver Output High Voltage VOH IO = -2mA, VID = -10mV Full VCC - 0.5 4.75 - V IO = -8mA, VID = -10mV Full 2.8 4.2 - V Receiver Output Low Voltage VOL IO = 6mA, VID = -200mV Full - 0.27 0.4 V Receiver Output Low Current IOL VO = 1V, VID = -200mV Full 15 22 - mA Three-State (High Impedance) Receiver Output Current IOZR 0V ≤ VO ≤ VCC Full -1 0.01 1 μA Receiver Short-Circuit Current IOSR 0V ≤ VO ≤ VCC Full ±12 - ±110 mA 7 FN7637.0 June 17, 2010 ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E, ISL31496E, Electrical Specifications PARAMETER Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = +25°C (Note 10). Boldface limits apply over the operating temperature range, -40°C to +85°C. (Continued) TEMP MIN (°C) (Note 18) TYP MAX (Note 18) UNITS SYMBOL TEST CONDITIONS ICC DE = VCC, RE = 0V or VCC, DI = 0V or VCC Full - 2.3 4.5 mA DE = 0V, RE = VCC, DI = 0V or VCC Full - 10 50 μA Human Body Model (Tested per JESD22-A114E) +25 - ±2 - kV Machine Model (Tested per JESD22-A115-A) +25 - ±700 - V SUPPLY CURRENT No-Load Supply Current (Note 11) Shutdown Supply Current ISHDN ESD PERFORMANCE All Pins DRIVER SWITCHING CHARACTERISTICS (250kbps Versions; ISL31490E through ISL31492E) Driver Differential Output Delay tPLH, tPHL RD = 54Ω, CD = 50pF (Figure 2) Driver Differential Output Skew tSKEW Driver Differential Rise or Fall Time tR, tF Maximum Data Rate fMAX No CM Load Full - 320 450 ns -25V ≤ VCM ≤ 25V Full - - 1000 ns RD = 54Ω, CD = 50pF (Figure 2) No CM Load Full - 6 30 ns -25V ≤ VCM ≤ 25V Full - - 50 ns RD = 54Ω, CD = 50pF (Figure 2) No CM Load Full 400 650 1200 ns -25V ≤ VCM ≤ 25V Full 300 - 1200 ns CD = 820pF (Figure 4) Full 0.25 1.5 - Mbps Driver Enable to Output High tZH SW = GND (Figure 3), (Notes 13, 20) Full - - 1200 ns Driver Enable to Output Low tZL SW = VCC (Figure 3), (Notes 13, 20) Full - - 1200 ns Driver Disable from Output Low tLZ SW = VCC (Figure 3) (Note 20) Full - - 120 ns Driver Disable from Output High tHZ SW = GND (Figure 3) (Note 20) Full - - 120 ns (Note 15) Full 60 160 600 ns Driver Enable from tZH(SHDN) SW = GND (Figure 3), (Notes 15, 16) Shutdown to Output High Full - - 2500 ns Driver Enable from Shutdown to Output Low Full - - 2500 ns Time to Shutdown tSHDN tZL(SHDN) SW = VCC (Figure 3), (Notes 15, 16) DRIVER SWITCHING CHARACTERISTICS (1Mbps Versions; ISL31493E, ISL31495E) Driver Differential Output Delay tPLH, tPHL RD = 54Ω, CD = 50pF (Figure 2) Driver Differential Output Skew tSKEW Driver Differential Rise or Fall Time tR, tF Maximum Data Rate fMAX 8 No CM Load Full - 70 125 ns -25V ≤ VCM ≤ 25V Full - - 350 ns RD = 54Ω, CD = 50pF (Figure 2) No CM Load Full - 3 15 ns -25V ≤ VCM ≤ 25V Full - - 25 ns RD = 54Ω, CD = 50pF (Figure 2) No CM Load Full 70 230 300 ns -25V ≤ VCM ≤ 25V Full 70 - 400 ns Full 1 4 - Mbps CD = 820pF (Figure 4) FN7637.0 June 17, 2010 ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E, ISL31496E, Electrical Specifications PARAMETER Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = +25°C (Note 10). Boldface limits apply over the operating temperature range, -40°C to +85°C. (Continued) SYMBOL TEST CONDITIONS TEMP MIN (°C) (Note 18) TYP MAX (Note 18) UNITS Driver Enable to Output High tZH SW = GND (Figure 3), (Note 13) Full - - 350 ns Driver Enable to Output Low tZL SW = VCC (Figure 3), (Note 13) Full - - 300 ns Driver Disable from Output Low tLZ SW = VCC (Figure 3) Full - - 120 ns Driver Disable from Output High tHZ SW = GND (Figure 3) Full - - 120 ns (Note 15) Full 60 160 600 ns Driver Enable from tZH(SHDN) SW = GND (Figure 3), (Notes 15, 16) Shutdown to Output High Full - - 2000 ns Driver Enable from Shutdown to Output Low Full - - 2000 ns Time to Shutdown tSHDN tZL(SHDN) SW = VCC (Figure 3), (Notes 15, 16) DRIVER SWITCHING CHARACTERISTICS (15Mbps Versions; ISL31496E, ISL31498E) Driver Differential Output Delay tPLH, tPHL RD = 54Ω, CD = 50pF (Figure 2) Driver Differential Output Skew tSKEW Driver Differential Rise or Fall Time tR, tF Maximum Data Rate fMAX No CM Load Full - 21 45 ns -25V ≤ VCM ≤ 25V Full - - 80 ns RD = 54Ω, CD = 50pF (Figure 2) No CM Load Full - 3 6 ns -25V ≤ VCM ≤ 25V Full - - 7 ns RD = 54Ω, CD = 50pF (Figure 2) No CM Load Full 5 17 30 ns -25V ≤ VCM ≤ 25V Full 5 - 30 ns CD = 470pF (Figure 4) Full 15 25 - Mbps Driver Enable to Output High tZH SW = GND (Figure 3), (Note 13) Full - - 100 ns Driver Enable to Output Low tZL SW = VCC (Figure 3), (Note 13) Full - - 100 ns Driver Disable from Output Low tLZ SW = VCC (Figure 3) Full - - 120 ns Driver Disable from Output High tHZ SW = GND (Figure 3) Full - - 120 ns (Note 15) Full 60 160 600 ns Driver Enable from tZH(SHDN) SW = GND (Figure 3), (Notes 15, 16) Shutdown to Output High Full - - 2000 ns Driver Enable from Shutdown to Output Low Full - - 2000 ns Time to Shutdown tSHDN tZL(SHDN) SW = VCC (Figure 3), (Notes 15, 16) RECEIVER SWITCHING CHARACTERISTICS (250kbps Versions; ISL31490E through ISL31492E) Maximum Data Rate Receiver Input to Output Delay Receiver Skew | tPLH - tPHL | fMAX -25V ≤ VCM ≤ 25V (Figure 5) Full 0.25 5 - Mbps tPLH, tPHL -25V ≤ VCM ≤ 25V (Figure 5) Full - 200 280 ns Full - 4 10 ns tSKD 9 (Figure 5) FN7637.0 June 17, 2010 ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E, ISL31496E, Electrical Specifications Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = +25°C (Note 10). Boldface limits apply over the operating temperature range, -40°C to +85°C. (Continued) Receiver Enable to Output Low tZL RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6), (Notes 14, 20) Full - - 50 ns Receiver Enable to Output High tZH RL = 1kΩ, CL = 15pF, SW = GND (Figure 6), (Notes 14, 20) Full - - 50 ns Receiver Disable from Output Low tLZ RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6) (Note 20) Full - - 50 ns Receiver Disable from Output High tHZ RL = 1kΩ, CL = 15pF, SW = GND (Figure 6) (Note 20) Full - - 50 ns (Notes 15) Full 60 160 600 ns Receiver Enable from tZH(SHDN) RL = 1kΩ, CL = 15pF, SW = GND Shutdown to Output High (Figure 6), (Notes 15, 17) Full - - 2000 ns Receiver Enable from Shutdown to Output Low Full - - 2000 ns tSHDN tZL(SHDN) RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6), (Notes 15, 17) TYP MAX (Note 18) UNITS SYMBOL Time to Shutdown TEST CONDITIONS TEMP MIN (°C) (Note 18) PARAMETER RECEIVER SWITCHING CHARACTERISTICS (1Mbps Versions; ISL31493E, ISL31495E) Maximum Data Rate Receiver Input to Output Delay Receiver Skew | tPLH - tPHL | fMAX -25V ≤ VCM ≤ 25V (Figure 5) Full 1 15 - Mbps tPLH, tPHL -25V ≤ VCM ≤ 25V (Figure 5) Full - 90 150 ns (Figure 5) Full - 4 10 ns tSKD Receiver Enable to Output Low tZL RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6), (Note 14) Full - - 50 ns Receiver Enable to Output High tZH RL = 1kΩ, CL = 15pF, SW = GND (Figure 6), (Note 14) Full - - 50 ns Receiver Disable from Output Low tLZ RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6) Full - - 50 ns Receiver Disable from Output High tHZ RL = 1kΩ, CL = 15pF, SW = GND (Figure 6) Full - - 50 ns (Note 15) Full 60 160 600 ns Receiver Enable from tZH(SHDN) RL = 1kΩ, CL = 15pF, SW = GND Shutdown to Output High (Figure 6), (Notes 15, 17) Full - - 2000 ns Receiver Enable from Shutdown to Output Low Full - - 2000 ns Time to Shutdown tSHDN tZL(SHDN) RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6), (Notes 15, 17) RECEIVER SWITCHING CHARACTERISTICS (15Mbps Versions; ISL31496E, ISL31498E) Maximum Data Rate Receiver Input to Output Delay Receiver Skew | tPLH - tPHL | fMAX -25V ≤ VCM ≤ 25V (Figure 5) Full 15 25 - Mbps tPLH, tPHL -25V ≤ VCM ≤ 25V (Figure 5) Full - 35 70 ns (Figure 5) Full - 4 10 ns tSKD Receiver Enable to Output Low tZL RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6), (Note 14) Full - - 50 ns Receiver Enable to Output High tZH RL = 1kΩ, CL = 15pF, SW = GND (Figure 6), (Note 14) Full - - 50 ns 10 FN7637.0 June 17, 2010 ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E, ISL31496E, Electrical Specifications PARAMETER Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = +25°C (Note 10). Boldface limits apply over the operating temperature range, -40°C to +85°C. (Continued) SYMBOL TEMP MIN (°C) (Note 18) TEST CONDITIONS TYP MAX (Note 18) UNITS Receiver Disable from Output Low tLZ RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6) Full - - 50 ns Receiver Disable from Output High tHZ RL = 1kΩ, CL = 15pF, SW = GND (Figure 6) Full - - 50 ns (Note 15) Full 60 160 600 ns Receiver Enable from tZH(SHDN) RL = 1kΩ, CL = 15pF, SW = GND Shutdown to Output High (Figure 6), (Notes 15, 17) Full - - 2000 ns Receiver Enable from Shutdown to Output Low Full - - 2000 ns Time to Shutdown tSHDN tZL(SHDN) RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6), (Notes 15, 17) NOTES: 10. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified. 11. Supply current specification is valid for loaded drivers when DE = 0V. 12. Applies to peak current. See “Typical Performance Curves” beginning on page 16 for more information. 13. Keep RE = 0 to prevent the device from entering SHDN. 14. The RE signal high time must be short enough (typically <100ns) to prevent the device from entering SHDN. 15. Transceivers (except on the ISL31491E) are put into shutdown by bringing RE high and DE low. If the inputs are in this state for less than 60ns, the parts are guaranteed not to enter shutdown. If the inputs are in this state for at least 600ns, the parts are guaranteed to have entered shutdown. See “Low Power Shutdown Mode” on page 16. 16. Keep RE = VCC, and set the DE signal low time >600ns to ensure that the device enters SHDN. 17. Set the RE signal high time >600ns to ensure that the device enters SHDN. 18. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not production tested. 19. Tested according to TIA/EIA-485-A, Section 4.2.6 (±80V for 15μs at a 1% duty cycle). 20. Does not apply to the ISL31491E. 21. See “Caution” statement below the “Recommended Operating Conditions” section on page 6. Test Circuits and Waveforms VCC RL/2 DE DI VCC Z DI VOD D Z Y FIGURE 1A. VOD AND VOC VCM VOD D Y RL/2 375Ω RL/2 DE VOC RL/2 VOC 375Ω FIGURE 1B. VOD AND VOC WITH COMMON MODE LOAD FIGURE 1. DC DRIVER TEST CIRCUITS 11 FN7637.0 June 17, 2010 ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E, ISL31496E, Test Circuits and Waveforms (Continued) 3V DI 1.5V 1.5V 0V tPLH 37Ω* DE VCC tPHL OUT (Z) VOH OUT (Y) VOL Z DI CD D Y RD 375Ω* SIGNAL GENERATOR VCM 90% DIFF OUT (Y - Z) 10% 10% tR *USED ONLY FOR COMMON MODE LOAD TESTS +VOD 90% -VOD tF SKEW = | tPLH - tPHL | FIGURE 2A. TEST CIRCUIT FIGURE 2B. MEASUREMENT POINTS FIGURE 2. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES DE Z DI 110Ω VCC D SIGNAL GENERATOR SW Y GND CL 3V DE (Note 15) PARAMETER OUTPUT RE DI SW CL (pF) tHZ Y/Z X 1/0 GND 50 tLZ Y/Z X 0/1 VCC 50 tZH Y/Z 0 (Note 13) 1/0 GND 100 tZL Y/Z 0 (Note 13) 0/1 VCC 100 tZH(SHDN) Y/Z 1 (Note 16) 1/0 GND 100 tZL(SHDN) Y/Z 1 (Note 16) 0/1 VCC 100 1.5V 1.5V 0V tZH, tZH(SHDN) tHZ OUTPUT HIGH (Note 15) VOH - 0.5V 2.3V OUT (Y, Z) VOH 0V tZL, tZL(SHDN) tLZ (Note 15) VCC OUT (Y, Z) 2.3V OUTPUT LOW FIGURE 3A. TEST CIRCUIT VOL + 0.5V V OL FIGURE 3B. MEASUREMENT POINTS FIGURE 3. DRIVER ENABLE AND DISABLE TIMES VCC DE 3V + Z DI 54Ω D CD Y VOD DI 0V - SIGNAL GENERATOR DIFF OUT (Y - Z) FIGURE 4A. TEST CIRCUIT +VOD -VOD 0V FIGURE 4B. MEASUREMENT POINTS FIGURE 4. DRIVER DATA RATE 12 FN7637.0 June 17, 2010 ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E, ISL31496E, Test Circuits and Waveforms (Continued) RE B B R A SIGNAL GENERATOR VCM + 750mV 15pF RO VCM VCM VCM - 750mV A tPLH SIGNAL GENERATOR tPHL VCC 50% RO 50% VCM 0V FIGURE 5A. TEST CIRCUIT FIGURE 5B. MEASUREMENT POINTS FIGURE 5. RECEIVER PROPAGATION DELAY AND DATA RATE RE B A R SIGNAL GENERATOR 1kΩ RO 15pF VCC SW (Note 15) GND RE 3V 1.5V 1.5V 0V PARAMETER DE A SW tZH, tZH(SHDN) tHZ 0 +1.5V GND (Note 15) VOH - 0.5V 1.5V RO tLZ 0 -1.5V VCC tZH (Note 14) 0 +1.5V GND tZL (Note 14) 0 -1.5V VCC (Note 15) tZH(SHDN) (Note 17) 0 +1.5V GND RO tZL(SHDN) (Note 17) 0 -1.5V VCC FIGURE 6A. TEST CIRCUIT tHZ OUTPUT HIGH VOH 0V tZL, tZL(SHDN) tLZ VCC 1.5V OUTPUT LOW VOL + 0.5V V OL FIGURE 6B. MEASUREMENT POINTS FIGURE 6. RECEIVER ENABLE AND DISABLE TIMES 13 FN7637.0 June 17, 2010 ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E, ISL31496E, Application Information RS-485 and RS-422 are differential (balanced) data transmission standards used for long haul or noisy environments. RS-422 is a subset of RS-485, so RS-485 transceivers are also RS-422 compliant. RS-422 is a point-to-multipoint (multidrop) standard, which allows only one driver and up to 10 (assuming one unit load devices) receivers on each bus. RS-485 is a true multipoint standard, which allows up to 32 one unit load devices (any combination of drivers and receivers) on each bus. To allow for multipoint operation, the RS-485 specification requires that drivers must handle bus contention without sustaining any damage. Another important advantage of RS-485 is the extended common mode range (CMR), which specifies that the driver outputs and receiver inputs withstand signals that range from +12V to -7V. RS-422 and RS-485 are intended for runs as long as 4000’, thus the wide CMR is necessary to handle ground potential differences, as well as voltages induced in the cable by external fields. The ISL3149xE is a family of ruggedized RS-485 transceivers that improves on the RS-485 basic requirements, and therefore increases system reliability. The CMR increases to ±25V, while the RS-485 bus pins (receiver inputs and driver outputs) include fault protection against voltages and transients up to ±60V. Additionally, larger than required differential output voltages (VOD) increase noise immunity. Receiver (Rx) Features These devices utilize a differential input receiver for maximum noise immunity and common mode rejection. Input sensitivity is better than ±200mV, as required by the RS-422 and RS-485 specifications. Receiver input (load) current surpasses the RS-422 specification of 3mA, and is four times lower than the RS-485 “Unit Load (UL)” requirement of 1mA maximum. Thus, these products are known as “one-quarter UL” transceivers, and there can be up to 128 of these devices on a network while still complying with the RS-485 loading specification. The Rx functions with common mode voltages as great as ±25V, making them ideal for industrial, or long networks where induced voltages are a realistic concern. All the receivers include a “full fail-safe” function that guarantees a high level receiver output if the receiver inputs are unconnected (floating), shorted together, or connected to a terminated bus with all the transmitters disabled (i.e., an idle bus). Rx outputs feature high drive levels (typically 22mA @ VOL = 1V) to ease the design of optically coupled isolated interfaces. Receivers easily meet the data rates supported by the corresponding driver, and all receiver outputs are three-statable via the active low RE input (except on the ISL31491E). 14 The Rx in the 250kbps and 1Mbps versions include noise filtering circuitry to reject high frequency signals. The 1Mbps version typically rejects pulses narrower than 50ns (equivalent to 20Mbps), while the 250kbps Rx rejects pulses below 150ns (6.7Mbps). Driver (Tx) Features The RS-485/RS-422 driver is a differential output device that delivers at least 1.5V across a 54Ω load (RS-485), and at least 2.4V across a 100Ω load (RS-422). The drivers feature low propagation delay skew to maximize bit width, and to minimize EMI, and all drivers are three-statable via the active high DE input. The 250kbps and 1Mbps driver outputs are slew rate limited to minimize EMI, and to minimize reflections in unterminated or improperly terminated networks. Outputs of the ISL31496E and ISL31498E drivers are not limited, thus faster output transition times allow data rates of at least 15Mbps. High Overvoltage (Fault) Protection Increases ruggedness Note: The available smaller pitch packages (e.g., MSOP and TDFN) may not meet the creepage and clearance (C&C) requirements for ±60V levels. The user is advised to determine his C&C requirements before selecting a package type. The ±60V (referenced to the IC GND) fault protection on the RS-485 pins, makes these transceivers some of the most rugged on the market. This level of protection makes the ISL3149xE perfect for applications where power (e.g., 24V and 48V supplies) must be routed in the conduit with the data lines, or for outdoor applications where large transients are likely to occur. When power is routed with the data lines, even a momentary short between the supply and data lines will destroy an unprotected device. The ±60V fault levels of this family are at least five times higher than the levels specified for standard RS-485 ICs. The ISL3149xE protection is active whether the Tx is enabled or disabled, and even if the IC is powered down. If transients or voltages (including overshoots and ringing) greater than ±60V are possible, then additional external protection is required. Widest Common Mode Voltage (CMV) Tolerance Improves Operating Range RS-485 networks operating in industrial complexes, or over long distances, are susceptible to large CMV variations. Either of these operating environments may suffer from large node-to-node ground potential differences, or CMV pickup from external electromagnetic sources, and devices with only the minimum required +12V to -7V CMR may malfunction. The ISL3149xE’s extended ±25V CMR is the widest available, allowing operation in environments that would overwhelm lesser transceivers. Additionally, the Rx will not phase invert (erroneously change state) even with CMVs of ±40V, or differential voltages as large as 40V. FN7637.0 June 17, 2010 ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E, ISL31496E, High VOD Improves Noise Immunity and Flexibility Data Rate, Cables, and Terminations The ISL3149xE driver design delivers larger differential output voltages (VOD) than the RS-485 standard requires, or than most RS-485 transmitters can deliver. The typical ±2.5V VOD provides more noise immunity than networks built using many other transceivers. Another advantage of the large VOD is the ability to drive more than two bus terminations, which allows for utilizing the ISL3149xE in “star” and other multi-terminated, nonstandard network topologies. Figure 8 details the transmitter’s VOD vs IOUT characteristic, and includes load lines for four (30Ω) and six (20Ω) 120Ω terminations. Figure 8 shows that the driver typically delivers ±1.3V into six terminations, and the “Electrical Specification” table guarantees a VOD of ±0.8V at 21Ω over the full temperature range. The RS-485 standard requires a minimum 1.5V VOD into two terminations, but the ISL3149xE deliver RS-485 voltage levels with 2x to 3x the number of terminations. Hot Plug Function When a piece of equipment powers up, there is a period of time where the processor or ASIC driving the RS-485 control lines (DE, RE) is unable to ensure that the RS-485 Tx and Rx outputs are kept disabled. If the equipment is connected to the bus, a driver activating prematurely during power-up may crash the bus. To avoid this scenario, the ISL3149xE devices incorporate a “Hot Plug” function. Circuitry monitoring VCC ensures that, during power-up and power-down, the Tx and Rx outputs remain disabled, regardless of the state of DE and RE, if VCC is less than ≈3.5V. This gives the processor/ASIC a chance to stabilize and drive the RS-485 control lines to the proper states. Figure 7 illustrates the power-up and power-down performance of the ISL3149xE compared to an RS-485 IC without the Hot Plug feature. RS-485/RS-422 are intended for network lengths up to 4000’, but the maximum system data rate decreases as the transmission length increases. Devices operating at 15Mbps may be used at lengths up to 150’ (46m), but the distance can be increased to 328’ (100m) by operating at 10Mbps. The 1Mbps versions can operate at full data rates with lengths up to 800’ (244m). Jitter is the limiting parameter at these faster data rates, so employing encoded data streams (e.g., Manchester coded or Return-to-Zero) may allow increased transmission distances. The slow versions can operate at 115kbps, or less, at the full 4000’ (1220m) distance, or at 250kbps for lengths up to 3000’ (915m). DC cable attenuation is the limiting parameter, so using better quality cables (e.g., 22 AWG) may allow increased transmission distance. Twisted pair is the cable of choice for RS-485/RS-422 networks. Twisted pair cables tend to pick up noise and other electromagnetically induced voltages as common mode signals, which are effectively rejected by the differential receivers in these ICs. Proper termination is imperative, when using the 15Mbps devices, to minimize reflections. Short networks using the 250kbps versions need not be terminated, however, terminations are recommended unless power dissipation is an overriding concern. In point-to-point, or point-to-multipoint (single driver on bus like RS-422) networks, the main cable should be terminated in its characteristic impedance (typically 120Ω) at the end farthest from the driver. In multi-receiver applications, stubs connecting receivers to the main cable should be kept as short as possible. Multipoint (multi-driver) systems require that the main cable be terminated in its characteristic impedance at both ends. Stubs connecting a transceiver to the main cable should be kept as short as possible. DE, DI = VCC RE = GND 2.8V 2.5 VCC 0 5.0 RL = 1kΩ 2.5 0 A/Y ISL3149xE ISL83088E RL = 1kΩ RO ISL3149xE 5.0 2.5 0 RECEIVER OUTPUT (V) DRIVER Y OUTPUT (V) 3.5V 5.0 VCC (V) Built-In Driver Overload Protection TIME (40μs/ DIV) FIGURE 7. HOT PLUG PERFORMANCE (ISL3149xE) vs ISL83088E WITHOUT HOT PLUG CIRCUITRY 15 As stated previously, the RS-485 specification requires that drivers survive worst case bus contentions undamaged. These transceivers meet this requirement via driver output short circuit current limits, and on-chip thermal shutdown circuitry. The driver output stages incorporate a double foldback short circuit current limiting scheme which ensures that the output current never exceeds the RS-485 specification, even at the common mode and fault condition voltage range extremes. The first foldback current level (≈70mA) is set to ensure that the driver never folds back when driving loads with common mode voltages up to ±25V. The very low second foldback current setting (≈9mA) minimizes power dissipation if the Tx is enabled when a fault occurs. In the event of a major short circuit condition, devices also include a thermal shutdown feature that disables the drivers whenever the die temperature becomes excessive. This eliminates the power dissipation, FN7637.0 June 17, 2010 ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E, ISL31496E, allowing the die to cool. The drivers automatically re-enable after the die temperature drops about +15°C. If the contention persists, the thermal shutdown/re-enable cycle repeats until the fault is cleared. Receivers stay operational during thermal shutdown. ICC to a 10μA trickle. These devices enter shutdown whenever the receiver and driver are simultaneously disabled (RE = VCC and DE = GND) for a period of at least 600ns. Disabling both the driver and the receiver for less than 60ns guarantees that the transceiver will not enter shutdown. Low Power Shutdown Mode Note that receiver and driver enable times increase when the transceiver enables from shutdown. Refer to Notes 13, 14, 15, 16 and 17, at the end of the “Electrical Specification” table on page 11, for more information. These CMOS transceivers all use a fraction of the power required by competitive devices, but they also include a shutdown feature that reduces the already low quiescent DRIVER OUTPUT CURRENT (mA) 90 RD = 20Ω 80 RD = 30Ω +25°C 70 60 RD = 54Ω +85°C 50 40 RD = 100Ω 30 20 10 0 0 1 2 3 4 DIFFERENTIAL OUTPUT VOLTAGE (V) 5 FIGURE 8. DRIVER OUTPUT CURRENT vs DIFFERENTIAL OUTPUT VOLTAGE 3.4 RD = 100Ω 3.2 3 2.8 2.6 RD = 54Ω 2.4 2.2 -40 -25 0 25 50 TEMPERATURE (°C) 75 85 70 RECEIVER OUTPUT CURRENT (mA) 2.40 DE = VCC, RE = X 2.35 2.30 ICC (mA) 3.6 FIGURE 9. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs TEMPERATURE 2.45 2.25 DE = GND, RE = GND 2.20 2.15 2.10 2.05 2.00 -40 DIFFERENTIAL OUTPUT VOLTAGE (V) Typical Performance Curves VCC = 5V, TA = +25°C; Unless Otherwise Specified. 60 VOL, +25°C 50 40 30 20 10 0 -10 VOH, +85°C -20 VOH, +25°C -30 -25 0 25 50 TEMPERATURE (°C) 75 85 FIGURE 10. SUPPLY CURRENT vs TEMPERATURE 16 VOL, +85°C 0 1 2 3 4 RECEIVER OUTPUT VOLTAGE (V) 5 FIGURE 11. RECEIVER OUTPUT CURRENT vs RECEIVER OUTPUT VOLTAGE FN7637.0 June 17, 2010 ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E, ISL31496E, Typical Performance Curves VCC = 5V, TA = +25°C; Unless Otherwise Specified. (Continued) 800 340 400 200 Y OR Z 0 -200 -400 A/Y OR B/Z -600 -70 -50 -30 -10 0 10 30 BUS PIN VOLTAGE (V) 50 8 PROPAGATION DELAY (ns) SKEW (ns) 4 3 2 1 315 tPHL 310 305 -25 25 0 50 TEMPERATURE (°C) 75 85 RD = 54Ω, CD = 50pF 80 75 70 tPLH 65 tPHL 60 55 | tPLH - tPHL| 0 -40 -25 0 50 25 TEMPERATURE (°C) 50 -40 75 85 FIGURE 14. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE (ISL31490E, ISL31491E, ISL31492E) 27 PROPAGATION DELAY (ns) 3.0 2.5 -25 25 0 50 TEMPERATURE (°C) 75 85 FIGURE 15. DRIVER DIFFERENTIAL PROPAGATION DELAY vs TEMPERATURE (ISL31493E, ISL31495E) RD = 54Ω, CD = 50pF 3.5 SKEW (ns) 320 85 7 5 tPLH 325 FIGURE 13. DRIVER DIFFERENTIAL PROPAGATION DELAY vs TEMPERATURE (ISL31490E, ISL31491E, ISL31492E) RD = 54Ω, CD = 50pF 6 330 300 -40 70 FIGURE 12. BUS PIN CURRENT vs BUS PIN VOLTAGE 4.0 RD = 54Ω, CD = 50pF 335 PROPAGATION DELAY (ns) BUS PIN CURRENT (μA) 600 RD = 54Ω, CD = 50pF 25 23 tPLH 21 19 tPHL 17 | tPLH - tPHL| 2.0 -40 -25 0 50 25 TEMPERATURE (°C) 75 85 FIGURE 16. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE (ISL31493E, ISL31495E) 17 15 -40 -25 0 50 25 TEMPERATURE (°C) 75 85 FIGURE 17. DRIVER DIFFERENTIAL PROPAGATION DELAY vs TEMPERATURE (ISL31496E, ISL31498E) FN7637.0 June 17, 2010 ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E, ISL31496E, Typical Performance Curves VCC = 5V, TA = +25°C; Unless Otherwise Specified. (Continued) 3.4 RD = 54Ω, CD = 50pF 3.2 SKEW (ns) 3.0 2.8 2.6 2.4 2.2 | tPLH - tPHL| 2.0 -40 -25 0 50 25 TEMPERATURE (°C) 75 85 5 0 -5 -10 -15 -20 -25 A B VID = ±1V RO RO A B A 25 20 15 10 5 0 B VID = ±1V RO 5 0 -5 -10 -15 -20 -25 RO A B TIME (400ns / DIV) TIME (1μs / DIV) 25 20 15 10 5 0 5 0 -5 -10 -15 -20 -25 A B VID = ±1V RO RO A B TIME (20ns / DIV) FIGURE 21. ±25V RECEIVER PERFORMANCE (ISL31496E, ISL31498E) 18 FIGURE 20. ±25V RECEIVER PERFORMANCE (ISL31493E, ISL31495E) DRIVER OUTPUT (V) RECEIVER OUTPUT (V) VOLTAGE (V) FIGURE 19. ±25V RECEIVER PERFORMANCE (ISL31490E, ISL31491E, ISL31492E) RD = 54Ω, CD = 50pF DI 5 0 3 2 1 0 -1 -2 -3 5 0 RO DRIVER INPUT (V) 25 20 15 10 5 0 VOLTAGE (V) VOLTAGE (V) FIGURE 18. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE (ISL31496E, ISL31498E) A/Y - B/Z TIME (1μs / DIV) FIGURE 22. DRIVER AND RECEIVER WAVEFORMS (ISL31490E, ISL31491E, ISL31492E) FN7637.0 June 17, 2010 ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E, ISL31496E, 0 3 2 1 0 -1 -2 -3 0 RO A/Y - B/Z TIME (400ns / DIV) FIGURE 23. DRIVER AND RECEIVER WAVEFORMS (ISL31493E, ISL31495E) RD = 54Ω, CD = 50pF DI 5 0 3 2 1 0 -1 -2 -3 5 0 RO DRIVER INPUT (V) 5 5 DRIVER OUTPUT (V) RECEIVER OUTPUT (V) RD = 54Ω, CD = 50pF DI DRIVER INPUT (V) DRIVER OUTPUT (V) RECEIVER OUTPUT (V) Typical Performance Curves VCC = 5V, TA = +25°C; Unless Otherwise Specified. (Continued) A/Y - B/Z TIME (20ns / DIV) FIGURE 24. DRIVER AND RECEIVER WAVEFORMS (ISL31496E, ISL31498E) Die Characteristics SUBSTRATE POTENTIAL (POWERED UP) AND TDFN EPAD: GND PROCESS: Si Gate BiCMOS 19 FN7637.0 June 17, 2010 ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E, ISL31496E, Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you have the latest Rev. DATE REVISION 6/17/10 FN7637.0 CHANGE Initial Release Products Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The Company's products address some of the industry's fastest growing markets, such as, flat panel displays, cell phones, handheld products, and notebooks. Intersil's product families address power management and analog signal processing functions. Go to www.intersil.com/products for a complete list of Intersil product families. *For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device information page on intersil.com: ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E, ISL31496E, ISL31498E To report errors or suggestions for this datasheet, please go to www.intersil.com/askourstaff FITs are available from our website at http://rel.intersil.com/reports/search.php For additional products, see www.intersil.com/product_tree Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted in the quality certifications found at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 20 FN7637.0 June 17, 2010 ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E, ISL31496E, Package Outline Drawing M8.118 8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE Rev 3, 3/10 5 3.0±0.05 A DETAIL "X" D 8 1.10 MAX SIDE VIEW 2 0.09 - 0.20 4.9±0.15 3.0±0.05 5 0.95 REF PIN# 1 ID 1 2 B 0.65 BSC GAUGE PLANE TOP VIEW 0.55 ± 0.15 0.25 3°±3° 0.85±010 H DETAIL "X" C SEATING PLANE 0.25 - 0.036 0.08 M C A-B D 0.10 ± 0.05 0.10 C SIDE VIEW 1 (5.80) NOTES: (4.40) (3.00) 1. Dimensions are in millimeters. (0.65) (0.40) (1.40) TYPICAL RECOMMENDED LAND PATTERN 21 2. Dimensioning and tolerancing conform to JEDEC MO-187-AA and AMSEY14.5m-1994. 3. Plastic or metal protrusions of 0.15mm max per side are not included. 4. Plastic interlead protrusions of 0.15mm max per side are not included. 5. Dimensions are measured at Datum Plane "H". 6. Dimensions in ( ) are for reference only. FN7637.0 June 17, 2010 ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E, ISL31496E, Mini Small Outline Plastic Packages (MSOP) N M10.118 (JEDEC MO-187BA) 10 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE E1 E INCHES SYMBOL -B- INDEX AREA 1 2 0.20 (0.008) A B C TOP VIEW 4X θ 0.25 (0.010) R1 R GAUGE PLANE A SEATING PLANE -C- A2 A1 b -He D 0.10 (0.004) 4X θ L SEATING PLANE C -A0.20 (0.008) C C a SIDE VIEW CL E1 0.20 (0.008) C D -B- END VIEW MILLIMETERS MAX MIN MAX NOTES A 0.037 0.043 0.94 1.10 - A1 0.002 0.006 0.05 0.15 - A2 0.030 0.037 0.75 0.95 - b 0.007 0.011 0.18 0.27 9 c 0.004 0.008 0.09 0.20 - D 0.116 0.120 2.95 3.05 3 E1 0.116 0.120 2.95 3.05 4 e L1 MIN 0.020 BSC 0.50 BSC - E 0.187 0.199 4.75 5.05 - L 0.016 0.028 0.40 0.70 6 L1 0.037 REF 0.95 REF - N 10 10 7 R 0.003 - 0.07 - - R1 0.003 - 0.07 - - θ 5o 15o 5o 15o - α 0o 6o 0o 6o Rev. 0 12/02 NOTES: 1. These package dimensions are within allowable dimensions of JEDEC MO-187BA. 2. Dimensioning and tolerancing per ANSI Y14.5M-1994. 3. Dimension“D”doesnotincludemoldflash,protrusionsorgate burrs and are measured at Datum Plane. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E1” does not include interlead flash or protrusions and are measured at Datum Plane. - H - Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. Formed leads shall be planar with respect to one another within 0.10mm (.004) at seating Plane. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of“b”dimensionatmaximummaterialcondition.Minimumspace between protrusion and adjacent lead is 0.07mm (0.0027 inch). 10. Datums -A - and - B - to be determined at Datum plane -H- . 11. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only 22 FN7637.0 June 17, 2010 ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E, ISL31496E, Package Outline Drawing L8.3x3A 8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE Rev 4, 2/10 ( 2.30) 3.00 ( 1.95) A B 3.00 ( 8X 0.50) 6 PIN 1 INDEX AREA (4X) (1.50) ( 2.90 ) 0.15 PIN 1 TOP VIEW (6x 0.65) ( 8 X 0.30) TYPICAL RECOMMENDED LAND PATTERN SEE DETAIL "X" 2X 1.950 PIN #1 INDEX AREA 0.10 C 0.75 ±0.05 6X 0.65 C 0.08 C 1 SIDE VIEW 6 1.50 ±0.10 8 8X 0.30 ±0.05 8X 0.30 ± 0.10 2.30 ±0.10 C 4 0.10 M C A B 0 . 2 REF 5 0 . 02 NOM. 0 . 05 MAX. DETAIL "X" BOTTOM VIEW NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Dimension applies to the metallized terminal and is measured between 0.15mm and 0.20mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 7. 23 Compliant to JEDEC MO-229 WEEC-2 except for the foot length. FN7637.0 June 17, 2010 ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E, ISL31496E, Package Outline Drawing L10.3x3A 10 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE Rev 5, 3/10 3.00 A 2.0 REF 6 PIN 1 INDEX AREA B 8X 0.50 BSC 1 6 PIN 1 INDEX AREA 5 10X 0 . 30 3.00 1.50 0.15 (4X) 10 0.10 M C A B 0.05 M C 5 4 10 X 0.25 TOP VIEW 2.30 ( 2.30 ) BOTTOM VIEW 0 .80 MAX SEE DETAIL "X" 0.10 C C (2.90) SEATING PLANE 0.08 C (1.50) SIDE VIEW (10 X 0.50) 0 . 2 REF 5 C ( 8X 0 .50 ) ( 10X 0.25 ) 0 . 00 MIN. 0 . 05 MAX. TYPICAL RECOMMENDED LAND PATTERN DETAIL "X" NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 Angular ±2.50° 4. Dimension applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 24 5. Tiebar shown (if present) is a non-functional feature. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 7. Compliant to JEDEC MO-229-WEED-3 except exposed pad length (2.30mm). FN7637.0 June 17, 2010 ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E, ISL31496E, Package Outline Drawing M14.15 14 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE Rev 1, 10/09 8.65 A 3 4 0.10 C A-B 2X 6 14 DETAIL"A" 8 0.22±0.03 D 6.0 3.9 4 0.10 C D 2X 0.20 C 2X 7 PIN NO.1 ID MARK 5 0.31-0.51 B 3 (0.35) x 45° 4° ± 4° 6 0.25 M C A-B D TOP VIEW 0.10 C 1.75 MAX H 1.25 MIN 0.25 GAUGE PLANE C SEATING PLANE 0.10 C 0.10-0.25 1.27 SIDE VIEW (1.27) DETAIL "A" (0.6) NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSEY14.5m-1994. 3. Datums A and B to be determined at Datum H. (5.40) 4. Dimension does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25mm per side. 5. The pin #1 indentifier may be either a mold or mark feature. (1.50) 6. Does not include dambar protrusion. Allowable dambar protrusion shall be 0.10mm total in excess of lead width at maximum condition. 7. Reference to JEDEC MS-012-AB. TYPICAL RECOMMENDED LAND PATTERN 25 FN7637.0 June 17, 2010 ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E, ISL31496E, Dual-In-Line Plastic Packages (PDIP) E8.3 (JEDEC MS-001-BA ISSUE D) N 8 LEAD DUAL-IN-LINE PLASTIC PACKAGE E1 INDEX AREA 1 2 3 INCHES N/2 -B- -AD E BASE PLANE -C- SEATING PLANE A2 A L D1 e B1 D1 A1 eC B 0.010 (0.25) M C A B S SYMBOL MIN MAX MIN MAX NOTES A - 0.210 - 5.33 4 A1 0.015 - 0.39 - 4 A2 0.115 0.195 2.93 4.95 - B 0.014 0.022 0.356 0.558 - C L B1 0.045 0.070 1.15 1.77 8, 10 eA C 0.008 0.014 0.204 C D 0.355 0.400 9.01 D1 0.005 - 0.13 - 5 E 0.300 0.325 7.62 8.25 6 E1 0.240 0.280 6.10 7.11 5 eB NOTES: 1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication No. 95. 4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. 5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and eA are measured with the leads constrained to be perpendicular to datum -C- . 7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater. 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm). 26 MILLIMETERS e 0.100 BSC eA 0.300 BSC eB - L 0.115 N 8 0.355 10.16 5 2.54 BSC - 7.62 BSC 6 0.430 - 0.150 2.93 8 10.92 7 3.81 4 9 Rev. 0 12/93 FN7637.0 June 17, 2010 ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E, ISL31496E, Small Outline Plastic Packages (SOIC) M8.15 (JEDEC MS-012-AA ISSUE C) 8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE N INDEX AREA H 0.25(0.010) M B M INCHES E SYMBOL -B1 2 3 L SEATING PLANE -A- A D h x 45° -C- e A1 B 0.25(0.010) M C 0.10(0.004) C A M MIN MAX MIN MAX NOTES A 0.0532 0.0688 1.35 1.75 - A1 0.0040 0.0098 0.10 0.25 - B 0.013 0.020 0.33 0.51 9 C 0.0075 0.0098 0.19 0.25 - D 0.1890 0.1968 4.80 5.00 3 E 0.1497 0.1574 3.80 4.00 4 e α B S 0.050 BSC 27 1.27 BSC - H 0.2284 0.2440 5.80 6.20 - h 0.0099 0.0196 0.25 0.50 5 L 0.016 0.050 0.40 1.27 6 N NOTES: 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. MILLIMETERS α 8 0° 8 8° 0° 7 8° Rev. 1 6/05 FN7637.0 June 17, 2010