MCP7382X Evaluation Kit User's Guide

MCP7382X
Evaluation Kit
User’s Guide
© 2006 Microchip Technology Inc.
DS51267B
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© 2006, Microchip Technology Incorporated, Printed in the
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Printed on recycled paper.
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DS51267B-page ii
© 2006 Microchip Technology Inc.
MCP7382X EVALUATION KIT
USER’S GUIDE
Table of Contents
Preface ........................................................................................................................... 1
Chapter 1. Product Overview ....................................................................................... 5
1.1 Introduction ..................................................................................................... 5
1.2 What the MCP7382X Evaluation Kit Is ........................................................... 5
1.3 MCP7382X Evaluation Kit Components ......................................................... 5
Chapter 2. Installation and Operation ......................................................................... 7
2.1 Description ..................................................................................................... 7
2.2 Features ......................................................................................................... 7
2.3 Getting Started ............................................................................................... 8
2.4 Detailed Description ....................................................................................... 9
Appendix A. Schematic and Board Layouts.............................................................. 11
A.1 Introduction .................................................................................................. 11
A.2 Highlights ..................................................................................................... 11
A.3 Board Schematic ........................................................................................ 12
A.4 Board Layout - Top Assembly .................................................................... 13
A.5 Board Layout - Top Layer .......................................................................... 14
A.6 Board Layout - Bottom Layer ..................................................................... 15
Appendix B. Bill Of Materials (BOM) .......................................................................... 17
Worldwide Sales and Service .................................................................................... 18
© 2006 Microchip Technology Inc.
DS51267B-page iii
MCP7382X Evaluation Kit User’s Guide
NOTES:
DS51267B-page iv
© 2006 Microchip Technology Inc.
MCP7382X EVALUATION KIT
USER’S GUIDE
Preface
NOTICE TO CUSTOMERS
All documentation becomes dated, and this manual is no exception. Microchip tools and
documentation are constantly evolving to meet customer needs, so some actual dialogs
and/or tool descriptions may differ from those in this document. Please refer to our web site
(www.microchip.com) to obtain the latest documentation available.
Documents are identified with a “DS” number. This number is located on the bottom of each
page, in front of the page number. The numbering convention for the DS number is
“DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the
document.
INTRODUCTION
This chapter contains general information that will be useful to know before using the
MCP7382X Evaluation Kit. Items discussed in this chapter include:
•
•
•
•
•
•
Document Layout
Conventions Used in this Guide
Recommended Reading
The Microchip Web Site
Customer Support
Document Revision History
DOCUMENT LAYOUT
This document describes how to use the MCP7382X Evaluation Kit as a development
tool. The manual layout is as follows:
• Chapter 1. “Product Overview” – Important information on how to use the
MCP7382X Evaluation Board.
• Chapter 2. “Installation and Operation” – For users evaluating the MCP73826,
MCP73827, or MCP73828 devices, this chapter describes how to use the various
features of the hardware.
• Appendix A. “Schematic and Board Layouts” – shows the schematic and layout diagrams for the MCP7382X Evaluation Kit.
• Appendix B. “Bill Of Materials (BOM)” – lists the parts used to build the
MCP7382X Evaluation Kit.
© 2006 Microchip Technology Inc.
DS51267B-page 1
MCP7382X Evaluation Kit User’s Guide
CONVENTIONS USED IN THIS GUIDE
This manual uses the following documentation conventions:
DOCUMENTATION CONVENTIONS
Description
Arial font:
Italic characters
Represents
Examples
Referenced books
Emphasized text
A window
A dialog
A menu selection
A field name in a window or
dialog
A menu path
MPLAB® IDE User’s Guide
...is the only compiler...
the Output window
the Settings dialog
select Enable Programmer
“Save project before build”
A dialog button
A tab
A number in verilog format,
where N is the total number of
digits, R is the radix and n is a
digit.
A key on the keyboard
Click OK
Click the Power tab
4‘b0010, 2‘hF1
Italic Courier New
Sample source code
Filenames
File paths
Keywords
Command-line options
Bit values
Constants
A variable argument
Square brackets [ ]
Optional arguments
Curly brackets and pipe
character: { | }
Choice of mutually exclusive
arguments; an OR selection
#define START
autoexec.bat
c:\mcc18\h
_asm, _endasm, static
-Opa+, -Opa0, 1
0xFF, ‘A’
file.o, where file can be
any valid filename
mcc18 [options] file
[options]
errorlevel {0|1}
Initial caps
Quotes
Underlined, italic text with
right angle bracket
Bold characters
N‘Rnnnn
Text in angle brackets < >
Courier New font:
Plain Courier New
File>Save
Press <Enter>, <F1>
RECOMMENDED READING
This user's guide describes how to use MCP7382X Evaluation Kit. For more
information regarding the MCP7382X devices, the following are recommended
reading.
MCP7382X Data Sheets
These data sheets provide detailed information regarding the MCP7382X Single Cell
Lithium-Ion Charge Management Controllers:
• MCP73826 Data Sheet (DS21705)
• MCP73827 Data Sheet (DS21704)
• MCP73828 Data Sheet (DS21706)
DS51267B-page 2
© 2006 Microchip Technology Inc.
Preface
THE MICROCHIP WEB SITE
Microchip provides online support via our web site at www.microchip.com. This web
site is used as a means to make files and information easily available to customers.
Accessible by using your favorite Internet browser, the web site contains the following
information:
• Product Support – Data sheets and errata, application notes and sample
programs, design resources, user’s guides and hardware support documents,
latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQs), technical
support requests, online discussion groups, Microchip consultant program
member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip
press releases, listing of seminars and events, listings of Microchip sales offices,
distributors and factory representatives
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
•
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Development Systems Information Line
Customers should contact their distributor, representative or field application engineer
for support. Local sales offices are also available to help customers. A listing of sales
offices and locations is included in the back of this document.
Technical support is available through the web site at: http://support.microchip.com
DOCUMENT REVISION HISTORY
Revision B (July 2006)
• Add disclaimer to Bill of Materials regarding RoHS-Compliant part numbers.
Revision A (January 2002)
• Initial Release of this Document.
© 2006 Microchip Technology Inc.
DS51267B-page 3
MCP7382X Evaluation Kit User’s Guide
NOTES:
DS51267B-page 4
© 2006 Microchip Technology Inc.
MCP7382X EVALUATION KIT
USER’S GUIDE
Chapter 1. Product Overview
1.1
INTRODUCTION
This chapter provides an overview of the MCP7382X Evaluation Kit, and instructions
on how to connect the system components.
This chapter covers the following topics:
• What the MCP7382X Evaluation Kit Is
• MCP7382X Evaluation Kit Components
1.2
WHAT THE MCP7382X EVALUATION KIT IS
The MCP7382X Evaluation Kit is an evaluation and demonstration tool for Microchip
Technology’s MCP7382X Single Cell Lithium-Ion Charge Management Controllers.
The design provides for dynamic versatility while being able to handle accurate
measurements.
When connected, this evaluation board allows for the evaluation of the MCP7382X
devices in a variety of applications.
1.3
MCP7382X EVALUATION KIT COMPONENTS
The MCP7382X Evaluation Kit contains:
• MCP7382X Evaluation Board (102-00017)
• MCP73826-4.2VCH, MCP73827-4.2VUA, and MCP73828-4.2VUA Devices
installed
• Analog and Interface Products Demonstration Boards CD-ROM (DS21912)
- MCP7382X Evaluation Kit User’s Guide
© 2006 Microchip Technology Inc.
DS51267B-page 5
MCP7382X Evaluation Kit User’s Guide
NOTES:
DS51267B-page 6
© 2006 Microchip Technology Inc.
MCP7382X EVALUATION KIT
USER’S GUIDE
Chapter 2. Installation and Operation
2.1
DESCRIPTION
The MCP7382X Evaluation Kit is an evaluation kit designed to support Microchip’s
MCP73826, MCP73827, and MCP73828 single-cell Li-Ion charge management
devices. The evaluation kit is fully assembled and tested. The kit is useful for evaluating
simple stand-alone operation or for evaluating applications interfaced with a
microcontroller.
2.2
FEATURES
The MCP7382X Evaluation Board has the following features:
•
•
•
•
•
•
Evaluation of MCP73827/28 in 8-pin MSOP packages
Evaluation of MCP73826 in 6-pin SOT-23 package
Simple Stand-Alone Operation or Microcontroller Compatible
Powered from external bench supply or voltage regulated wall cube
Surface-Mount Design
Fully Assembled and Tested
© 2006 Microchip Technology Inc.
DS51267B-page 7
MCP7382X Evaluation Kit User’s Guide
2.3
GETTING STARTED
The MCP7382X Evaluation Board is a fully functional, assembled, and tested surface
mount board for evaluation of Microchip’s MCP73826/27/28 single-cell Li-Ion battery
charger devices. The following steps provide simple stand-alone operation. Refer to
the set-up configuration diagram below. Note: Do not turn on the input power until all
other set-up steps are complete.
1. Place a jumper on JP4 to select the appropriate device for evaluation.
2. Place a jumper on JP5 to enable the appropriate device for evaluation.
3. Connect an external bench supply or voltage regulated wall cube to JP1.
Observe correct polarity of connection.
4. Connect a single cell Li-Ion battery pack to JP2. Observe correct polarity of
connection.
5. For MCP73828 evaluation, connect external battery pack thermistor to JP3.
6. Turn-on bench supply or plug-in wall cube.
7. For MCP73827 evaluation, LED D3 shall be turned off when the charge cycle
transitions from controlled current mode to constant voltage mode charge.
8. For MCP73828 evaluation, LED D2 shall illuminate when the battery pack is at
full charge.
PACK+
+
VOLTAGE
REGULATED
WALL CUBE
-
PACK-
Optional Thermistor
Connection for
MCP73828 Evaluation
TEMP
BATTERY
PACK
FIGURE 2-1:
DS51267B-page 8
Set-Up Configuration Diagram
© 2006 Microchip Technology Inc.
Installation and Operation
2.4
DETAILED DESCRIPTION
The MCP7382X Evaluation Board is set-up to evaluate simple, stand-alone, linear
charging of single cell Li-Ion battery packs. Each of the three Li-Ion battery chargers
can be evaluated independently. The chargers provide controlled current charging followed by constant voltage charging. The MCP73826, U1, is provided in a 6-pin SOT23
package and is equipped with shutdown control. The MCP73827, U2, is provided in an
8-pin MSOP package. In addition to shutdown control, the MCP73827 signals when the
charge cycle transitions from controlled current mode to constant voltage mode. An
LED, D3, is illuminated during the controlled current mode. A voltage representation of
the charge current, IMON, is provided for a host microcontroller to monitor the charge
profile. The MCP73828, U3, is also provided in an 8-pin MSOP package. In addition to
shutdown control, the MCP73828 signals when the charge current has diminished
below ten percent of the peak charge current. An LED, D2, is illuminated indicating full
charge. A thermistor input is provided to inhibit charging when the cell temperature is
outside a pre-defined window. Refer to the appropriate data sheets for details on the
individual device features.
2.4.1
Input Source
The MCP7382X Evaluation Board is designed to provide an output current of 1A, typical. A 5V ±10%, 6W input source should be utilized to power the evaluation kit. JP1
terminal 1 is the positive input source connection. JP1 terminal 2 is the negative input
source connection.
Higher or lower output currents can be obtained by adjusting the value of the sense
resistor, R1. A corresponding higher or lower power input source may need to be utilized. Care should be taken not to over stress the pass transistor, Q1, with excessive
power dissipation when higher output currents are desired.
2.4.2
Reverse Blocking Protection
The MCP7382X Evaluation Board is designed to provide reverse blocking protection in
the event a reversed polarity input source is connected to JP1. The reverse blocking
protection diode, D1, also ensures that a faulted or shorted input source will not
adversely effect the battery pack.
2.4.3
Battery Headers
Two headers, JP2 and JP3 are used to connect to an external Li-Ion battery pack and
optional protection thermistor. JP2 terminal 1 is the battery pack positive connection,
JP2 terminal 2 is the negative battery pack connection. JP3 terminal 1 is for connection
to a 10 k ohm NTC thermistor situated in the battery pack for temperature sensing. JP3
terminal 2 is the negative reference for the thermistor.
Note:
© 2006 Microchip Technology Inc.
Improper connection of the battery may result in damage to the
battery and the possibility of personal injury. It is also important to
avoid shorting the battery terminals together.
DS51267B-page 9
MCP7382X Evaluation Kit User’s Guide
2.4.4
Device Support Options
The MCP7382X Evaluation Board provides evaluation of three Li-Ion battery chargers:
MCP73826, MCP73827, or MCP73828. Device selection is performed by placing
shunts on JP4 and JP5 as indicated in the table below. JP4 determines which device
is controlling the pass transistor. JP5 is used to enable the appropriate device.
TABLE 2-1:
2.4.5
SHUNT JUMPERS
Device Type
JP4 Shunt Location
JP5 Shunt Location
MCP73826
5, 6
1, 2
MCP73827
3, 4
3, 4
MCP73828
1, 2
5, 6
Microcontroller Option
JP6 provides an easily accessible location for interface to a host microcontroller. The
host microcontroller can be used to disable the charger, monitor charge status, monitor
the charge profile, or terminate a charge.
A proto-typing area is provided for generation of a self-contained microcontroller solution.
2.4.6
Output Voltage Options
The MCP7382X Evaluation Board is provided with a constant voltage mode output
voltage of 4.2V. Evaluation with a constant voltage mode output voltage of 4.1V can be
achieved by replacing U1, U2, or U3 with the appropriate device. Refer to the
appropriate data sheets for device ordering information.
JP4
Short across for MCP73828
Short across for MCP73827
Short across for MCP73826
JP5
Short across for MCP73826
Short across for MCP73827
Short across for MCP73828
FIGURE 2-2:
DS51267B-page 10
Jumper Locations on the MCP7382X Evaluation Board.
© 2006 Microchip Technology Inc.
MCP7382X EVALUATION KIT
USER’S GUIDE
Appendix A. Schematic and Board Layouts
A.1
INTRODUCTION
This appendix contains the schematic and board layouts for the MCP7382X Evaluation
Kit.
A.2
HIGHLIGHTS
Diagrams included in this appendix:
•
•
•
•
Board Schematic
Board Layout - Top Assembly
Board Layout - Top Layer
Board Layout - Bottom Layer
© 2006 Microchip Technology Inc.
DS51267B-page 11
JP3
1
2
1
2
R7
DNP
R9
332
VIN
VSUPPLY
0
R8
C4
0.1uF
D2
CD10
D3
MODE
R10
332
R5
100k
R4
100k
JP5
SHDN
R2
22.1k
5
3
1
6
4
2
DS51267B-page 12
R3
100k
R6
100k
THERM
CD10
MODE
IMON
1
2
3
4
1
2
3
4
1
2
MA2Q705
D1
MCP73828
SHDN
VSS
THERM
CD10
U3
MCP73827
SHDN
VSS
MODE
IMON
U2
MCP73826
SHDN
VSS
U1
+
VIN
VSNS
VDRV
VBAT
VIN
VSNS
VDRV
VBAT
VIN
VSNS
VDRV
VBAT
C1
0.1uF
8
7
6
5
8
7
6
5
5
6
4
3
C2
10uF
VDRV
JP4
Q1
NDS8434
* VOUT is directly connected to the VBAT pin of the DUT
VOUT*
VIN
VSNS
274k
R11
50milliohm
R1
5
3
1
+
CD10
VIN
VSNS
SHDN
VDRV
MODE
VOUT
IMON
THERM
C3
10uF
1
2
3
4
5
6
7
8
9
10
JP6
1
2
JP2
A.3
6
4
2
JP1
MCP7382X Evaluation Kit User’s Guide
BOARD SCHEMATIC
© 2006 Microchip Technology Inc.
Schematic and Board Layouts
A.4
BOARD LAYOUT - TOP ASSEMBLY
Note:
The VOUT connected on JP6 is directly connected to the VBAT pin of the DUT
© 2006 Microchip Technology Inc.
DS51267B-page 13
MCP7382X Evaluation Kit User’s Guide
A.5
BOARD LAYOUT - TOP LAYER
DS51267B-page 14
© 2006 Microchip Technology Inc.
Schematic and Board Layouts
A.6
BOARD LAYOUT - BOTTOM LAYER
© 2006 Microchip Technology Inc.
DS51267B-page 15
MCP7382X Evaluation Kit User’s Guide
NOTES:
DS51267B-page 16
© 2006 Microchip Technology Inc.
MCP7382X EVALUATION KIT
USER’S GUIDE
Appendix B. Bill Of Materials (BOM)
TABLE B-1:
Qty
BILL OF MATERIALS (BOM)
Reference
Description
Manufacturer
Part Number
2
C1, C4
0.1 µF, 25V, Y5U Ceramic, 0805
Panasonic
ECJ-2VF1E104Z
2
C2, C3
10 µF, 25V, Tantalum, SMC, Input/Output
Panasonic
ECS-T1EC106R
1
D1
1.5 A Shottky Diode, Reverse Protection
Panasonic
MA2Q705
2
D2, D3
Red LED, Surface Mount
Lumex
SML-LX2832GC
3
JP1, JP2,
JP3
Screw Header
Weidmuller
171602
1
JP4, JP5
Dual In-Line Header, “0.100, 3x2 Position
Sullins
PTC36DAAN(1)
1
JP6
Single In-Line Header, “0.100, 10x1 Position
Sullins
PTC36SYAN(2)
1
Q1
P-channel MOSFET, SOIC8
Fairchild
NDS8434
1
R1
50 milliohm sense resistor
Panasonic
ERJ-L1WKF50MU
1
R2
22.1 kohm, 1/10W, 1%, Thick Film Chip, 0805
Panasonic
ERJ-6ENF2212V
4
R3, R4, R5,
R6
22.1 kohm, 1/10W, 1%, Thick Film Chip, 0805
Panasonic
ERJ-6ENF2212V
0
R7
Not populated, 0805
1
R8
0.0 ohm Jumper, 0805
Phycomp
9C08052A0R00JLH
2
R9, R10
332 ohm, 1/10W, 1%, Thick Film Chip, 0805
Panasonic
ERJ-6ENF3320V
1
R11
274 kohm, 1/10W, 1%, Thick Film Chip, 0805
Panasonic
ERJ-6ENF2743V
1
U1
Lithium-Ion Battery Charger, SOT23-6
Microchip
MCP73826-4.2VCH
1
U2
Lithium-Ion Battery Charger, MSOP8
Microchip
MCP73827-4.2VUA
1
U3
Lithium-Ion Battery Charger, MSOP8
Microchip
MCP73828-4.2VUA
2
—
Header Shunts
Sullins
STC02STAN
—
Bumpons - Protective Products
3M
SJ5003-0
4
Note 1:
2:
3:
JP4, JP5 are ordered as a 36x2 strip header. Cut to fit. One for every 5 boards built.
JP6 is ordered as a 36x1 strip header. Cut to fit. One for every 3 boards built.
The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM
used in manufacturing uses all RoHS-compliant components.
© 2006 Microchip Technology Inc.
DS51267B-page 17
WORLDWIDE SALES AND SERVICE
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Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-572-9526
Fax: 886-3-572-6459
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
China - Shunde
Tel: 86-757-2839-5507
Fax: 86-757-2839-5571
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xian
Tel: 86-29-8833-7250
Fax: 86-29-8833-7256
07/21/06
DS51267B-page 18
© 2006 Microchip Technology Inc.