Datasheet UM5062 Rev03

UM5062
Dual Line ESD Protection Diode Array
UM5062 QFN3 1.4×1.1
General Description
The UM5062 ESD protection diode is designed to replace multilayer varistors (MLVs) in portable
applications such as cell phones, notebook computers, and PDA’s. It features large cross-sectional
area junctions for conducting high transient currents, offers desirable electrical characteristics for
board level protection, such as fast response time, lower operating voltage, lower clamping voltage
and no device degradation when compared to MLVs.
The UM5062 ESD protection diode protects sensitive semiconductor components from damage or
upset due to electrostatic discharge (ESD) and other voltage induced transient events. The UM5062 is
available in a QFN3 1.4mm×1.1mm package with working voltages of 5 volt.
It gives designer the flexibility to protect one or two unidirectional line in applications where arrays
are not practical. Additionally, it may be “sprinkled” around the board in applications where board
space is at a premium. It may be used to meet the ESD immunity requirements of IEC 61000-4-2,
Level 4 (±15kV air, ±8kV contact discharge).
Applications
Features









Cell Phone Handsets and Accessories
Microprocessor Based Equipment
Personal Digital Assistants (PDA’s)
Notebooks, Desktops and Servers
Portable Instrumentation
Cordless Phones
Digital Cameras
Peripherals
MP3 Players
Pin Configurations







Transient Protection for Data & Power Lines
to IEC 61000-4-2 (ESD) ±15kV (Air), ±8kV
(Contact)
Small Package for Use in Portable Electronics
Suitable Replacement for MLV’s in ESD
Protection Applications
Protect One or Two I/O Lines
Low Clamping Voltage
Stand-off Voltages: 5V
Low Leakage Current
Solid-State Silicon-Avalanche Technology
Top View
(Bottom View)
XX: Week Code
UM5062
QFN3 1.4×1.1
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UM5062
Ordering Information
Part Number
Working Voltage
UM5062
5.0V
Packaging Type Channel Marking Code
QFN3 1.4×1.1
2
AD
Shipping Qty
3000pcs/7 Inch
Tape & Reel
Absolute Maximum Ratings
Rating
Peak Pulse Power (tP=8/20μs)
Maximum Peak Pulse Current (tP=8/20μs)
Lead Soldering Temperature
Operating Temperature
Storage Temperature
Symbol
PPK
IPP
TL
TJ
TSTG
Value
140
11
260 (10 sec.)
-55 to +125
-55 to +150
Unit
Watts
Amps
°C
°C
°C
-
Symbol Definition
Parameter
Maximum Reverse Peak Pulse Current
Clamping Voltage @ IPP
Working Peak Reverse Voltage
Maximum Reverse Leakage Current @ VRWM
Breakdown Voltage @ IT
Test Current
Forward Current
Forward Voltage @ IF
Peak Power Dissipation
Max. Capacitance @ VR=0V, f=1MHz
Symbol
IPP
VC
VRWM
IR
VBR
It
IF
VF
PPK
C
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UM5062
Electrical Characteristics
(T=25°C, Device for 5.0V Reverse Stand-off Voltage)
Parameter
Symbol
Conditions
Reverse Stand-Off Voltage
Reverse Breakdown
Voltage
Reverse Leakage Current
Min
Typ
Max
Unit
5
V
7.2
V
μA
VRWM
VBR
IT=1mA
6
6.8
IR
VRWM=5V, T=25°C
0.1
IPP=5A, tP=8/20μs
9.1
IPP=11A, tP=8/20μs
13
Clamping Voltage
VC
V
Forward Voltage
VF
IF=10mA
0.8
Junction Capacitance
CJ
VR=0V, f=1MHz
40
55
pF
Junction Capacitance
CJ
VR=2.5V, f=1MHz
30
40
pF
V
Typical Operating Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
Clamping Voltage vs. Peak Pulse Current
1
Peak Pulse Power - Ppk(kW)
13
Clamping Voltage - Vc(V)
12
0.1
11
10
9
8
Waveform
parameters:
tr=8uS
td=20uS
7
0.02
0.04
0.1
1
10
100
1000
6
0
Pulse Duration - tp(uS)
2
4
6
8
10
Peak Pulse Current - Ipp(A)
Forward Voltage vs. Forward Current
Junction Capacitance vs. Reverse Voltage
50
5
4
3
Waveform
parameters:
tr=8uS
td=20uS
2
Junction Capacitance(pF)
Forward Voltage - Vf(V)
6
45
40
35
30
1
2
4
6
8
Forward Current - If(A)
10
0
1
2
3
4
5
Reverse Voltage (V)
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UM5062
Applications Information
Device Connection Options
UM5062 ESD protection diode is designed to protect one or two I/O lines. The device is
unidirectional and may be used on lines where the signal polarity is above ground. The cathode band
should be placed towards the line that is to be protected.
Circuit Board Layout Recommendations for Suppression of ESD
Good circuit board layout is critical for the suppression of ESD induced transients. The following
guidelines are recommended:
1. Place the TVS near the input terminals or connectors to restrict transient coupling.
2. Minimize the path length between the TVS and the protected line.
3. Minimize all conductive loops including power and ground loops.
4. The ESD transient return path to ground should be kept as short as possible.
5. Never run critical signals near board edges.
6. Use ground planes whenever possible. For multilayer printed-circuit boards, use ground vias.
7. Keep parallel signal paths to a minimum.
8. Avoid running protection conductors in parallel with unprotected conductor.
9. Minimize all printed-circuit board conductive loops including power and ground loops.
10. Avoid using shared transient return paths to a common ground point.
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin
finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small
compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile
will be determined by the requirements of the solder paste. Therefore, these devices are compatible
with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions,
matte tin does not have any added alloys that can cause degradation of the solder joint.
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UM5062
Package Information
UM5062 QFN3 1.4×1.1
Outline Drawing
D
D2
e
E
E2
b
Symbol
0.20
Top View
L
Pin #1 ID
A1
A
Bottom View
Side View
A
A1
b
D
D2
E
E2
e
L
DIMENSIONS
MILLIMETERS
INCHES
Min
Typ
Max Min
Typ
Max
0.47
0.50
0.53 0.019 0.020 0.021
0.00
0.02
0.05 0.000 0.0008 0.002
0.25
0.30
0.35 0.010 0.012 0.014
1.35
1.40 1.475 0.053 0.055 0.058
0.65
0.75
0.85 0.026 0.030 0.033
1.05
1.10 1.175 0.041 0.043 0.046
0.65
0.75
0.85 0.026 0.030 0.033
0.55TYP
0.022TYP
0.225 0.275 0.325 0.009 0.011 0.013
Land Pattern
1.40
0.95
0.55
0.95
1.10
0.30
0.10
0.20
0.425
NOTES:
1. Compound dimension: 1.40×1.10:
2. Unit: mm;
3. General tolerance ±0.05mm unless otherwise
specified;
4. The layout is just for reference.
Tape and Reel Orientation
AD
XX
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UM5062
GREEN COMPLIANCE
Union Semiconductor is committed to environmental excellence in all aspects of its
operations including meeting or exceeding regulatory requirements with respect to the use of
hazardous substances. Numerous successful programs have been implemented to reduce the
use of hazardous substances and/or emissions.
All Union components are compliant with the RoHS directive, which helps to support
customers in their compliance with environmental directives. For more green compliance
information, please visit:
http://www.union-ic.com/index.aspx?cat_code=RoHSDeclaration
IMPORTANT NOTICE
The information in this document has been carefully reviewed and is believed to be accurate.
Nonetheless, this document is subject to change without notice. Union assumes no
responsibility for any inaccuracies that may be contained in this document, and makes no
commitment to update or to keep current the contained information, or to notify a person or
organization of any update. Union reserves the right to make changes, at any time, in order to
improve reliability, function or design and to attempt to supply the best product possible.
Union Semiconductor, Inc
Add: Unit 606, No.570 Shengxia Road, Shanghai 201210
Tel: 021-51093966
Fax: 021-51026018
Website: www.union-ic.com
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