UM5075/5079 Single Line ESD Protection Diode Array UM5075 SOD523 UM5079 DFN2/FBP2 1.0×0.6 General Description The UM5075/5079 ESD protection diode is designed to replace multilayer varistors (MLVs) in portable applications such as cell phones, notebook computers, and PDA’s. They feature large cross-sectional area junctions for conducting high transient currents, offer desirable electrical characteristics for board level protection, such as fast response time, lower operating voltage, lower clamping voltage and no device degradation when compared to MLVs. The UM5075/5079 ESD protection diode protects sensitive semiconductor components from damage or upset due to electrostatic discharge (ESD) and other voltage induced transient events. The UM5075 is available in SOD523 package and the UM5079 is available in DFN2/FBP2 1.0×0.6mm2 (compatible with SOD882/SOD923) package, both with working voltage of 7 volt. It gives designer the flexibility to protect one unidirectional line in applications where arrays are not practical. Additionally, it may be “sprinkled” around the board in applications where board space is at a premium. It may be used to meet the ESD immunity requirements of IEC 61000-4-2, Level 4 (±15kV air, ±8kV contact discharge). Applications Features Cell Phone Handsets and Accessories Personal Digital Assistants (PDA’s) Notebooks, Desktops and Servers Portable Instrumentation Cordless Phones Digital Cameras Peripherals MP3 Players Pin Configurations Transient Protection for Data Lines to IEC 61000-4-2 (ESD) ±15kV (Air), ±8kV (Contact) Small Package for Use in Portable Electronics Suitable Replacement for MLV’s in ESD Protection Applications Protect One I/O or Power Line Low Clamping Voltage Stand-off Voltage: 7V Low Leakage Current Solid-State Silicon-Avalanche Technology Top View UM5075 SOD523 UM5079 DFN2/FBP2 1.0×0.6 ________________________________________________________________________ http://www.union-ic.com Rev.02 Dec.2014 1/8 UM5075/5079 Ordering Information Part Number Working Voltage Packaging Type UM5075 UM5079 UM5079 Channel SOD523 7.0V DFN2 1.0×0.6 FBP2 1.0×0.6 Marking Code Shipping Qty 3000pcs/7 Inch Tape & Reel 5000pcs/7 Inch Tape & Reel ZB 1 E3 E3 Absolute Maximum Ratings Rating Symbol Value Units Peak Pulse Power (tp = 8/20μs) PPK 200 Watts Maximum Peak Pulse Current (t=8/20μs) Lead Soldering Temperature Operating Temperature Storage Temperature IPP TL TJ TSTG 12 260 (10 sec.) -55 to +125 -55 to +150 Amps °C °C °C Symbol Definition Parameter Maximum Reverse Peak Pulse Current Clamping Voltage @ Ipp Working Peak Reverse Voltage Maximum Reverse Leakage Current @ VRWM Breakdown Voltage @ It Test Current Forward Current Forward Voltage @ IF Peak Power Dissipation Max. Capacitance @ VR = 0V, f = 1MHz Symbol IPP VC VRWM IR VBR It IF VF PPK C ________________________________________________________________________ http://www.union-ic.com Rev.02 Dec.2014 2/8 UM5075/5079 Electrical Characteristics (T=25°C, Device for 7.0V Reverse Stand-off Voltage) Parameter Symbol Conditions Reverse Stand-Off VRWM Voltage Reverse Breakdown VBR It = 1mA Voltage Reverse Leakage IR VRWM = 7V, T=25°C Current IPP = 5A, tp = 8/20μs Clamping Voltage VC IPP =12A, tp = 8/20μs Min Typ Max Unit 7 V 7.6 8.0 V 0.005 1 μA 7.3 11.4 V 16.4 Forward Voltage VF IF = 10mA 0.8 Junction Capacitance Junction Capacitance CJ CJ VR = 0V, f = 1MHz VR = 2.5V, f = 1MHz 40 30 V 50 40 pF pF Typical Operating Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Clamping Voltage vs. Peak Pulse Current 10 17 Clamping Voltage - Vc(V) 15 1 0.1 14 13 12 11 Waveform parameters: tr=8uS td=20uS 10 9 8 0.01 0.1 1 10 100 0 1000 2 4 6 8 10 12 Peak Pulse Current - Ipp(A) Pulse Duration - tp(uS) Forward Voltage vs. Forward Current Junction Capacitance vs. Reverse Voltage 7 50 Junction Capacitance(pF) 6 Forward Voltage - Vf(V) Peak Pulse Power - Ppk(kW) 16 5 4 3 Waveform parameters: tr=8uS td=20uS 2 45 40 35 30 1 2 4 6 8 Forward Current - If(A) 10 12 0 1 2 3 4 5 Reverse Voltage (V) ________________________________________________________________________ http://www.union-ic.com Rev.02 Dec.2014 3/8 UM5075/5079 Applications Information Device Connection Options UM5075/5079 ESD protection diode is designed to protect one data, I/O, or power supply line. The device is unidirectional and may be used on lines where the signal polarity is above ground. The cathode band should be placed towards the line that is to be protected. Circuit Board Layout Recommendations for Suppression of ESD Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: 1. Place the TVS near the input terminals or connectors to restrict transient coupling. 2. Minimize the path length between the TVS and the protected line. 3. Minimize all conductive loops including power and ground loops. 4. The ESD transient return path to ground should be kept as short as possible. 5. Never run critical signals near board edges. 6. Use ground planes whenever possible. For multilayer printed-circuit boards, use ground vias. 7. Keep parallel signal paths to a minimum. 8. Avoid running protection conductors in parallel with unprotected conductor. 9. Minimize all printed-circuit board conductive loops including power and ground loops. 10. Avoid using shared transient return paths to a common ground point. ________________________________________________________________________ http://www.union-ic.com Rev.02 Dec.2014 4/8 UM5075/5079 Package Information UM5075 SOD523 Outline Drawing DIMENSIONS MILLIMETERS INCHES Symbol Min Max Min Max A 0.510 0.770 0.020 0.031 A1 0.500 0.700 0.020 0.028 b 0.250 0.350 0.010 0.014 c 0.080 0.150 0.003 0.006 D 0.750 0.850 0.030 0.033 E 1.100 1.300 0.043 0.051 E1 1.500 1.700 0.059 0.067 E2 0.200REF 0.008REF L 0.010 0.070 0.001 0.003 θ 7°REF 7°REF Land Pattern NOTES: 1. Compound dimension: 1.20×0.80; 2. Unit: mm; 3. General tolerance ±0.05mm unless otherwise specified; 4. The layout is just for reference. Tape and Reel Orientation ________________________________________________________________________ http://www.union-ic.com Rev.02 Dec.2014 5/8 UM5075/5079 UM5079 DFN2 1.0×0.6 Outline Drawing Symbol A A1 b D E E1 e R DIMENSIONS MILLIMETERS INCHES Min Max Min Max 0.470 0.530 0.019 0.021 0.000 0.050 0.000 0.002 0.200 0.300 0.008 0.012 0.950 1.075 0.037 0.042 0.550 0.675 0.022 0.027 0.450 0.550 0.018 0.022 0.400 0.016 0.050 0.150 0.002 0.006 Land Pattern NOTES: 1. Compound dimension: 1.00×0.60; 2. Unit: mm; 3. General tolerance ±0.025mm unless otherwise specified; 4. The layout is just for reference. Tape and Reel Specification ________________________________________________________________________ http://www.union-ic.com Rev.02 Dec.2014 6/8 UM5075/5079 UM5079 FBP2 1.0×0.6 Outline Drawing DIMENSIONS MILLIMETERS INCHES Symbol Min Max Min Max A 0.550 0.021 A1 0.010 0.070 0.000 0.003 b 0.275 0.325 0.011 0.013 D 0.950 1.050 0.037 0.041 D1 0.275 0.325 0.011 0.013 E 0.400REF 0.016REF E1 0.550 0.650 0.022 0.026 L 0.450REF 0.018REF Land Pattern NOTES: 1. Compound dimension: 1.00×0.60; 2. Unit: mm; 3. General tolerance ±0.05mm unless otherwise specified; 4. The layout is just for reference. Tape and Reel Specification ________________________________________________________________________ http://www.union-ic.com Rev.02 Dec.2014 7/8 UM5075/5079 IMPORTANT NOTICE The information in this document has been carefully reviewed and is believed to be accurate. Nonetheless, this document is subject to change without notice. Union assumes no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update or to keep current the contained information, or to notify a person or organization of any update. Union reserves the right to make changes, at any time, in order to improve reliability, function or design and to attempt to supply the best product possible. Union Semiconductor, Inc Add: Unit 606, No.570 Shengxia Road, Shanghai 201210 Tel: 021-51093966 Fax: 021-51026018 Website: www.union-ic.com ________________________________________________________________________ http://www.union-ic.com Rev.02 Dec.2014 8/8