UM5204 Quad Channel Low Capacitance ESD Protection Array UM5204EECD SOT23-6 UM5204EECE SOT23-6 General Description UM5204EECD/EECE is surge rated diode arrays designed to protect high speed data interfaces. This series has been specifically designed to protect sensitive components which are connected to data and transmission lines from over-voltage caused by ESD (electrostatic discharge), electrical fast transients (EFT) and lighting. The unique design incorporates surge rated, low capacitance steering diodes and a TVS diode in a single package. During transient conditions, the steering diodes direct the transient to either the positive side of the power supply line or to ground. The internal TVS diode prevents over-voltage on the power line, protecting any downstream components. UM5204EECD/EECE has a low typical capacitance of 1pF and operates with virtually no insertion loss to 2GHz. This makes the device ideal for protection of high-speed data line such as USB2.0, Firewire, DVI and gigabit Ethernet interface. The low capacitance array configuration allows the user to protect four high-speed data or transmission lines. The low inductance construction minimizes voltage overshoot during high current surges. This device is optimized for ESD protection of portable electronics. They may be used to meet the ESD immunity requirements of IEC 61000-4-2, Level 4 (±15kV air, ±8kV contact discharge). Applications Features USB 2.0 USB OTG 10/100/1000Mbit Ethernet Monitors and Flat Panel Displays Digital Visual Interface (DVI) High-Definition Multimedia Interface (HDMI) SIM Ports IEEE 1394 Firewire Ports Transient Protection for High-Speed Data Lines to IEC 61000-4-2 (ESD) ±20kV (Air), ±12kV (Contact) IEC 61000-4-4 (EFT) 40A (5/50ns) IEC 61000-4-5 (Lighting) 10A (8/20µs) Array of Surge Rated Diodes with Internal TVS Diode Protects up to Four I/O Lines & Power Line Low Capacitance (<1pF) for High-Speed Interfaces, No Insertion Loss to 2.0GHz Low Leakage Current and Clamping Voltage Low Operating Voltage: 5.0V ________________________________________________________________________ http://www.union-ic.com Rev.04 Mar.2016 1/11 UM5204 Top View I/O 1 1 6 I/O 2 GND 2 5 VCC I/O 3 3 4 I/O 4 UCF XX Pin Configurations I/O 1 1 6 I/O 2 VCC 2 5 GND I/O 3 3 4 I/O 4 UCC XX XX: Week Code UM5204EECD SOT23-6 XX: Week Code UM5204EECE SOT23-6 Ordering Information Part Number Working Voltage Packaging Type Channel Marking Code Shipping Qty UM5204EECD 5.0V SOT23-6 4 UCF 3000pcs/7 Inch Tape & Reel UM5204EECE 5.0V SOT23-6 4 UCC 3000pcs/7 Inch Tape & Reel Absolute Maximum Ratings Rating Symbol Value Unit Peak Pulse Power (tP=8/20µs) Ppk 200 Watts Peak Pulse Current (tP=8/20µs) IPP 10 A Peak Pulse Current (tP=5/50ns) ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact) Operating Temperature IPP A VESD kV TJ 40 ±20 ±12 -55 to +125 Storage Temperature TSTG -55 to +150 °C °C ________________________________________________________________________ http://www.union-ic.com Rev.04 Mar.2016 2/11 UM5204 Electrical Characteristics (Note 1) Parameter Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Leakage Current Symbol Test Conditions VRWM VCC to GND VBR IR Clamping Voltage VC Clamping Voltage VC Junction Capacitance Reverse Recovery Time Cj Trr IT=1mA, VCC to GND VRWM=5V, VCC to GND IPP=1A, 8/20µs Any I/O Pin to GND IPP=5A, 8/20µs Any I/O Pin to GND VR=0V, f=1MHz Any I/O Pin to GND VR=0V, f=1MHz , Between I/O Pins VR=0V, f=1MHz VCC to GND VR=2.5V, f=1MHz VCC to GND Any I/O Pin to VCC Min Typ Max Unit 5.0 V 6.0 V 2 µA 8 10 V 12 15 V 2 pF 1 pF 60 pF 40 pF 130 ns GND to VCC 300 ns GND to any I/O Pin 400 ns Note 1: I/O pins are pin 1, 3, 4, and 6 ________________________________________________________________________ http://www.union-ic.com Rev.04 Mar.2016 3/11 UM5204 Typical Operating Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve 110 100 90 % of Rated Power or Ipp Peak Pulse Power – PPK (kW) 10 1 0.1 80 70 60 50 40 30 20 10 0.01 0.1 0 10 1 100 1000 0 50 75 100 125 150 Ambient Temperature - TA(°C) Pulse Waveform Clamping Voltage vs. Peak Pulse Current 110 16 90 80 Clamping Voltage – Vc (V) Waveform Parameters: tr=8µs td=20µs 100 Percent of Ipp 25 Pulse Duration – tp (µs) e-t 70 60 50 td=IPP/2 40 30 20 14 Any I/O Pin to GND 12 VCC to GND 10 Waveform Parameters: tr=8µs td=20µs 8 10 6 0 0 5 10 15 20 25 0 30 2 Time (µ s) 4 6 8 10 Peak Pulse Current – Ipp (A) Forward Voltage vs. Forward Current Junction Capacitance vs. Reverse Voltage 4 3 3 Capacitance – Cj (pF) Forward Voltage – VF (V) f=1MHz 2.5 2 Waveform Parameters: tr=8µs td=20µs 1 0 2 Any I/O Pin to GND 1.5 1 0.5 0 0 2 4 6 Forward Current – IF (A) 8 10 0 1 2 3 4 Reverse Voltage – VR (V) ________________________________________________________________________ http://www.union-ic.com Rev.04 Mar.2016 4/11 5 UM5204 Typical Operating Characteristics (Continued) Single End Bandwidth Differential Bandwidth Crosstalk ________________________________________________________________________ http://www.union-ic.com Rev.04 Mar.2016 5/11 UM5204 Applications Information Device Connection Options for Protection of Four High-Speed Data Lines This device is designed to protect four data lines by clamping them to a fixed reference. When the voltage on the protected line exceeds the reference voltage the steering diodes are forward biased, conducting the transient current away from the sensitive circuitry. Data lines are connected at I/O pins. GND pin should be connected directly to a ground plane. The path length is kept as short as possible to minimize parasitic inductance. The positive reference is connected at VCC pin. The options for connecting the positive reference are as follows: 1. To protect data lines and the power line, connect VCC pin directly to the positive supply rail (VCC). In this configuration the data lines are referenced to the supply voltage. The internal TVS diode prevents over-voltage on the supply rail. See Figure 1. 2. In applications where the supply rail does not exit the system, the internal TVS may be used as the reference. In this case, VCC pin is not connected. The steering diodes will begin to conduct when the voltage on the protected line exceeds the working voltage of the TVS (plus one diode drop). 3. In applications where complete supply isolation is desired, the internal TVS is again used as the reference and VCC is connected to one of the I/O inputs. An example of this configuration is the protection of a SIM port. The Clock, Reset, I/O, and VCC lines are connected at I/O pins. GND pin is connected to ground and VCC pin is not connected. See Figure 2. Protection of Four Data Lines and Power Supply Line To Protected IC I/O 1 I/O 2 1 Protection of Four Data Lines Using Internal TVS Diode as Reference To Protected IC I/O 1 I/O 2 6 1 VCC GND 6 GND NC VCC 3 3 4 To Protected IC I/O 3 I/O 4 Figure 1 4 To Protected IC I/O 3 I/O 4 Figure 2 Universal Serial Bus ESD Protection The UM5204EECD/EECE may also be used to protect the USB ports on monitors, computers, peripherals or portable systems. Each device will protect up to two USB ports (Figure 3). When the voltage on the data lines exceed the bus voltage (plus one diode drop), the internal rectifiers are forward biased conducting the transient current away from the protected controller chip. The TVS diode directs the surge to ground. The TVS diode also acts to suppress ESD strikes directly on the voltage bus. Thus, both power and data pins are protected with a single device. ________________________________________________________________________ http://www.union-ic.com Rev.04 Mar.2016 6/11 UM5204 VBUS VBUS D+ RT RT USB PORT DVBUS CT GND CT USB Controller VBUS UM5204EECD VBUS RT D+ USB PORT RT DGND CT CT Figure 3 Dual USB Port Protection Figure 4 USB Eye Diagram Note: Figure 4 is tested by the MSO9254A oscilloscope of Agilent including E2678 probe, 1169 differential probe and E2645B-66401 fixture, when the chip is linked into the data line. 10/100 Ethernet Protection Ethernet ICs are vulnerable to damage from electrostatic discharge (ESD). The internal protection in the PHY chip, if any, often is not enough due to the high energy of the discharges specified by IEC61000-4-2. If the discharge is catastrophic, it will destroy the protected IC. If it is less severe, it will cause latent failures that are very difficult to find. 10/100 Ethernet operates at 125MHz clock over a twisted pair interface. In a typical system, the twisted pair interface for each port consists of two differential signal pairs: one for the transmitter and one for the receiver, with the transmitter input being the most sensitive to damage. The fatal discharge occurs differentially across the transmitter or receiver line pair and is capacitively coupled through the transformer to the Ethernet chip. Figure 5 shows how to design the UM5204EECD/EECE on the line side of a 10/100 ethernet port to provide differential mode protection. The common mode isolation of the transformer will provide common mode protection to the rating of the transformer isolation which is usually >1.5kV. If more common mode protection is needed, figure 6 shows how to design the UM5204EECD/EECE on the IC side of the 10/100 Ethernet circuit to provide differential and common mode protection. The UM5204EECD/EECE can not be grounded on the line side because the hi-pot test requires the line side not to be grounded. ________________________________________________________________________ http://www.union-ic.com Rev.04 Mar.2016 7/11 UM5204 RJ45 TX+ UNUSED 10/100 ETHERNET PHY To Twisted-Pair Network UNUSED TX+ TX- TX- 1 6 2 5 3 4 RX+ UM5204EECD RX- RX+ UNUSED UNUSED 75Ω 75Ω 75Ω 75Ω RXVCC VCC GND Figure 5 10/100 Ethernet Differential Protection RJ45 8 75Ω 100Ω 1% 50Ω 50Ω 7 6 ETHERNET TRANCEIVER 50Ω 1 6 2 5 3 4 5 75Ω 50Ω 50Ω UM5204EECD 4 3 50Ω 1% 2 To Twisted-Pair Network 50Ω 1 50Ω 1% 0.01μF 0.01μF 0.001μF, 2kV Figure 6 10/100 Ethernet Differential and Common Mode Protection Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. ________________________________________________________________________ http://www.union-ic.com Rev.04 Mar.2016 8/11 UM5204 Package Information UM5204EECD SOT23-6 Outline Drawing θ D b L Symbol 5 1 2 4 E E1 6 3 e1 c Top View End View A1 A2 A e Side View A A1 A2 b c D E E1 e e1 L θ DIMENSIONS MILLIMETERS INCHES Min Typ Max Min Typ Max 1.013 1.15 1.40 0.040 0.045 0.055 0.00 0.05 0.10 0.000 0.002 0.004 1.00 1.10 1.30 0.039 0.043 0.051 0.30 0.50 0.012 0.020 0.10 0.15 0.20 0.004 0.006 0.008 2.82 3.10 0.111 0.122 1.50 1.60 1.70 0.059 0.063 0.067 2.60 2.80 3.00 0.102 0.110 0.118 0.95REF 0.037REF 1.90REF 0.075REF 0.30 0.60 0.012 0.024 0° 8° 0° 8° Land Pattern 2.35 0.56 1.20 NOTES: 1. Compound dimension: 2.92×1.60； 2. Unit: mm; 3. General tolerance ±0.05mm unless otherwise specified; 4. The layout is just for reference. 0.95 0.95 UCF XX Tape and Reel Orientation ________________________________________________________________________ http://www.union-ic.com Rev.04 Mar.2016 9/11 UM5204 UM5204EECE SOT23-6 Outline Drawing θ D b L Symbol 5 1 2 4 E E1 6 3 e1 c Top View End View A1 A2 A e Side View A A1 A2 b c D E E1 e e1 L θ DIMENSIONS MILLIMETERS INCHES Min Typ Max Min Typ Max 1.013 1.15 1.40 0.040 0.045 0.055 0.00 0.05 0.10 0.000 0.002 0.004 1.00 1.10 1.30 0.039 0.043 0.051 0.30 0.50 0.012 0.020 0.10 0.15 0.20 0.004 0.006 0.008 2.82 3.10 0.111 0.122 1.50 1.60 1.70 0.059 0.063 0.067 2.60 2.80 3.00 0.102 0.110 0.118 0.95REF 0.037REF 1.90REF 0.075REF 0.30 0.60 0.012 0.024 0° 8° 0° 8° Land Pattern 2.35 0.56 1.20 NOTES: 1. Compound dimension: 2.92×1.60； 2. Unit: mm; 3. General tolerance ±0.05mm unless otherwise specified; 4. The layout is just for reference. 0.95 0.95 UCC XX Tape and Reel Orientation ________________________________________________________________________ http://www.union-ic.com Rev.04 Mar.2016 10/11 UM5204 GREEN COMPLIANCE Union Semiconductor is committed to environmental excellence in all aspects of its operations including meeting or exceeding regulatory requirements with respect to the use of hazardous substances. Numerous successful programs have been implemented to reduce the use of hazardous substances and/or emissions. All Union components are compliant with the RoHS directive, which helps to support customers in their compliance with environmental directives. For more green compliance information, please visit: http://www.union-ic.com/index.aspx?cat_code=RoHSDeclaration IMPORTANT NOTICE The information in this document has been carefully reviewed and is believed to be accurate. Nonetheless, this document is subject to change without notice. Union assumes no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update or to keep current the contained information, or to notify a person or organization of any update. Union reserves the right to make changes, at any time, in order to improve reliability, function or design and to attempt to supply the best product possible. Union Semiconductor, Inc Add: Unit 606, No.570 Shengxia Road, Shanghai 201210 Tel: 021-51093966 Fax: 021-51026018 Website: www.union-ic.com ________________________________________________________________________ http://www.union-ic.com Rev.04 Mar.2016 11/11