Datasheet UM5204EECD,UM5204EECE Rev04

UM5204
Quad Channel Low Capacitance ESD Protection Array
UM5204EECD SOT23-6
UM5204EECE SOT23-6
General Description
UM5204EECD/EECE is surge rated diode arrays designed to protect high speed data interfaces.
This series has been specifically designed to protect sensitive components which are connected to
data and transmission lines from over-voltage caused by ESD (electrostatic discharge), electrical
fast transients (EFT) and lighting.
The unique design incorporates surge rated, low capacitance steering diodes and a TVS diode in a
single package. During transient conditions, the steering diodes direct the transient to either the
positive side of the power supply line or to ground. The internal TVS diode prevents over-voltage
on the power line, protecting any downstream components.
UM5204EECD/EECE has a low typical capacitance of 1pF and operates with virtually no
insertion loss to 2GHz. This makes the device ideal for protection of high-speed data line such as
USB2.0, Firewire, DVI and gigabit Ethernet interface.
The low capacitance array configuration allows the user to protect four high-speed data or
transmission lines. The low inductance construction minimizes voltage overshoot during high
current surges. This device is optimized for ESD protection of portable electronics. They may be
used to meet the ESD immunity requirements of IEC 61000-4-2, Level 4 (±15kV air, ±8kV
contact discharge).
Applications
Features









USB 2.0
USB OTG
10/100/1000Mbit Ethernet
Monitors and Flat Panel Displays
Digital Visual Interface (DVI)
High-Definition Multimedia Interface
(HDMI)
SIM Ports
IEEE 1394 Firewire Ports





Transient Protection for High-Speed Data
Lines to
IEC 61000-4-2 (ESD) ±20kV (Air), ±12kV
(Contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
IEC 61000-4-5 (Lighting) 10A (8/20µs)
Array of Surge Rated Diodes with Internal
TVS Diode
Protects up to Four I/O Lines & Power Line
Low Capacitance (<1pF) for High-Speed
Interfaces, No Insertion Loss to 2.0GHz
Low Leakage Current and Clamping Voltage
Low Operating Voltage: 5.0V
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UM5204
Top View
I/O 1
1
6
I/O 2
GND
2
5
VCC
I/O 3
3
4
I/O 4
UCF
XX
Pin Configurations
I/O 1
1
6
I/O 2
VCC
2
5
GND
I/O 3
3
4
I/O 4
UCC
XX
XX: Week Code
UM5204EECD
SOT23-6
XX: Week Code
UM5204EECE
SOT23-6
Ordering Information
Part Number
Working
Voltage
Packaging Type
Channel
Marking
Code
Shipping Qty
UM5204EECD
5.0V
SOT23-6
4
UCF
3000pcs/7 Inch
Tape & Reel
UM5204EECE
5.0V
SOT23-6
4
UCC
3000pcs/7 Inch
Tape & Reel
Absolute Maximum Ratings
Rating
Symbol
Value
Unit
Peak Pulse Power (tP=8/20µs)
Ppk
200
Watts
Peak Pulse Current (tP=8/20µs)
IPP
10
A
Peak Pulse Current (tP=5/50ns)
ESD per IEC 61000-4-2 (Air)
ESD per IEC 61000-4-2 (Contact)
Operating Temperature
IPP
A
VESD
kV
TJ
40
±20
±12
-55 to +125
Storage Temperature
TSTG
-55 to +150
°C
°C
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UM5204
Electrical Characteristics (Note 1)
Parameter
Reverse Stand-Off
Voltage
Reverse Breakdown
Voltage
Reverse Leakage
Current
Symbol
Test Conditions
VRWM
VCC to GND
VBR
IR
Clamping Voltage
VC
Clamping Voltage
VC
Junction
Capacitance
Reverse Recovery
Time
Cj
Trr
IT=1mA,
VCC to GND
VRWM=5V,
VCC to GND
IPP=1A, 8/20µs
Any I/O Pin to GND
IPP=5A, 8/20µs
Any I/O Pin to GND
VR=0V, f=1MHz
Any I/O Pin to GND
VR=0V, f=1MHz ,
Between I/O Pins
VR=0V, f=1MHz
VCC to GND
VR=2.5V, f=1MHz
VCC to GND
Any I/O Pin to VCC
Min
Typ
Max
Unit
5.0
V
6.0
V
2
µA
8
10
V
12
15
V
2
pF
1
pF
60
pF
40
pF
130
ns
GND to VCC
300
ns
GND to any I/O Pin
400
ns
Note 1: I/O pins are pin 1, 3, 4, and 6
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UM5204
Typical Operating Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
Power Derating Curve
110
100
90
% of Rated Power or Ipp
Peak Pulse Power – PPK (kW)
10
1
0.1
80
70
60
50
40
30
20
10
0.01
0.1
0
10
1
100
1000
0
50
75
100
125
150
Ambient Temperature - TA(°C)
Pulse Waveform
Clamping Voltage vs. Peak Pulse Current
110
16
90
80
Clamping Voltage – Vc (V)
Waveform
Parameters:
tr=8µs
td=20µs
100
Percent of Ipp
25
Pulse Duration – tp (µs)
e-t
70
60
50
td=IPP/2
40
30
20
14
Any I/O Pin to GND
12
VCC to GND
10
Waveform
Parameters:
tr=8µs
td=20µs
8
10
6
0
0
5
10
15
20
25
0
30
2
Time (µ s)
4
6
8
10
Peak Pulse Current – Ipp (A)
Forward Voltage vs. Forward Current
Junction Capacitance vs. Reverse Voltage
4
3
3
Capacitance – Cj (pF)
Forward Voltage – VF (V)
f=1MHz
2.5
2
Waveform
Parameters:
tr=8µs
td=20µs
1
0
2
Any I/O Pin to GND
1.5
1
0.5
0
0
2
4
6
Forward Current – IF (A)
8
10
0
1
2
3
4
Reverse Voltage – VR (V)
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5
UM5204
Typical Operating Characteristics (Continued)
Single End Bandwidth
Differential Bandwidth
Crosstalk
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UM5204
Applications Information
Device Connection Options for Protection of Four High-Speed Data Lines
This device is designed to protect four data lines by clamping them to a fixed reference. When the
voltage on the protected line exceeds the reference voltage the steering diodes are forward biased,
conducting the transient current away from the sensitive circuitry. Data lines are connected at I/O
pins. GND pin should be connected directly to a ground plane. The path length is kept as short as
possible to minimize parasitic inductance. The positive reference is connected at VCC pin. The
options for connecting the positive reference are as follows:
1. To protect data lines and the power line, connect VCC pin directly to the positive supply rail
(VCC). In this configuration the data lines are referenced to the supply voltage. The internal TVS
diode prevents over-voltage on the supply rail. See Figure 1.
2. In applications where the supply rail does not exit the system, the internal TVS may be used as
the reference. In this case, VCC pin is not connected. The steering diodes will begin to conduct
when the voltage on the protected line exceeds the working voltage of the TVS (plus one diode
drop).
3. In applications where complete supply isolation is desired, the internal TVS is again used as the
reference and VCC is connected to one of the I/O inputs. An example of this configuration is the
protection of a SIM port. The Clock, Reset, I/O, and VCC lines are connected at I/O pins. GND
pin is connected to ground and VCC pin is not connected. See Figure 2.
Protection of Four Data Lines and Power
Supply Line
To
Protected
IC
I/O 1
I/O 2
1
Protection of Four Data Lines
Using Internal TVS Diode as Reference
To
Protected
IC
I/O 1
I/O 2
6
1
VCC
GND
6
GND
NC
VCC
3
3
4
To
Protected
IC
I/O 3
I/O 4
Figure 1
4
To
Protected
IC
I/O 3
I/O 4
Figure 2
Universal Serial Bus ESD Protection
The UM5204EECD/EECE may also be used to protect the USB ports on monitors, computers,
peripherals or portable systems. Each device will protect up to two USB ports (Figure 3). When
the voltage on the data lines exceed the bus voltage (plus one diode drop), the internal rectifiers
are forward biased conducting the transient current away from the protected controller chip. The
TVS diode directs the surge to ground. The TVS diode also acts to suppress ESD strikes directly
on the voltage bus. Thus, both power and data pins are protected with a single device.
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UM5204
VBUS
VBUS
D+
RT
RT
USB
PORT
DVBUS
CT
GND
CT
USB
Controller
VBUS
UM5204EECD
VBUS
RT
D+
USB
PORT
RT
DGND
CT
CT
Figure 3 Dual USB Port Protection
Figure 4 USB Eye Diagram
Note: Figure 4 is tested by the MSO9254A oscilloscope of Agilent including E2678 probe, 1169
differential probe and E2645B-66401 fixture, when the chip is linked into the data line.
10/100 Ethernet Protection
Ethernet ICs are vulnerable to damage from electrostatic discharge (ESD). The internal protection
in the PHY chip, if any, often is not enough due to the high energy of the discharges specified by
IEC61000-4-2. If the discharge is catastrophic, it will destroy the protected IC. If it is less severe,
it will cause latent failures that are very difficult to find.
10/100 Ethernet operates at 125MHz clock over a twisted pair interface. In a typical system, the
twisted pair interface for each port consists of two differential signal pairs: one for the transmitter
and one for the receiver, with the transmitter input being the most sensitive to damage. The fatal
discharge occurs differentially across the transmitter or receiver line pair and is capacitively
coupled through the transformer to the Ethernet chip. Figure 5 shows how to design the
UM5204EECD/EECE on the line side of a 10/100 ethernet port to provide differential mode
protection. The common mode isolation of the transformer will provide common mode protection
to the rating of the transformer isolation which is usually >1.5kV. If more common mode
protection is needed, figure 6 shows how to design the UM5204EECD/EECE on the IC side of the
10/100 Ethernet circuit to provide differential and common mode protection. The
UM5204EECD/EECE can not be grounded on the line side because the hi-pot test requires the
line side not to be grounded.
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UM5204
RJ45
TX+
UNUSED
10/100
ETHERNET
PHY
To Twisted-Pair Network
UNUSED
TX+
TX-
TX-
1
6
2
5
3
4
RX+
UM5204EECD
RX-
RX+
UNUSED
UNUSED
75Ω
75Ω
75Ω
75Ω
RXVCC
VCC
GND
Figure 5 10/100 Ethernet Differential Protection
RJ45
8
75Ω
100Ω
1%
50Ω
50Ω
7
6
ETHERNET
TRANCEIVER
50Ω
1
6
2
5
3
4
5
75Ω
50Ω
50Ω
UM5204EECD
4
3
50Ω
1%
2
To Twisted-Pair Network
50Ω
1
50Ω
1%
0.01μF
0.01μF
0.001μF, 2kV
Figure 6 10/100 Ethernet Differential and Common Mode Protection
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte
tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads
is small compared to the solder paste volume that is placed on the land pattern of the PCB, the
reflow profile will be determined by the requirements of the solder paste. Therefore, these devices
are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other
lead-free compositions, matte tin does not have any added alloys that can cause degradation of the
solder joint.
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UM5204
Package Information
UM5204EECD SOT23-6
Outline Drawing
θ
D
b
L
Symbol
5
1
2
4
E
E1
6
3
e1
c
Top View
End View
A1
A2
A
e
Side View
A
A1
A2
b
c
D
E
E1
e
e1
L
θ
DIMENSIONS
MILLIMETERS
INCHES
Min Typ Max Min
Typ
Max
1.013 1.15 1.40 0.040 0.045 0.055
0.00 0.05 0.10 0.000 0.002 0.004
1.00 1.10 1.30 0.039 0.043 0.051
0.30
0.50 0.012
0.020
0.10 0.15 0.20 0.004 0.006 0.008
2.82
3.10 0.111
0.122
1.50 1.60 1.70 0.059 0.063 0.067
2.60 2.80 3.00 0.102 0.110 0.118
0.95REF
0.037REF
1.90REF
0.075REF
0.30
0.60 0.012
0.024
0°
8°
0°
8°
Land Pattern
2.35
0.56
1.20
NOTES:
1. Compound dimension: 2.92×1.60;
2. Unit: mm;
3. General tolerance ±0.05mm unless otherwise
specified;
4. The layout is just for reference.
0.95
0.95
UCF
XX
Tape and Reel Orientation
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UM5204
UM5204EECE SOT23-6
Outline Drawing
θ
D
b
L
Symbol
5
1
2
4
E
E1
6
3
e1
c
Top View
End View
A1
A2
A
e
Side View
A
A1
A2
b
c
D
E
E1
e
e1
L
θ
DIMENSIONS
MILLIMETERS
INCHES
Min Typ Max Min
Typ
Max
1.013 1.15 1.40 0.040 0.045 0.055
0.00 0.05 0.10 0.000 0.002 0.004
1.00 1.10 1.30 0.039 0.043 0.051
0.30
0.50 0.012
0.020
0.10 0.15 0.20 0.004 0.006 0.008
2.82
3.10 0.111
0.122
1.50 1.60 1.70 0.059 0.063 0.067
2.60 2.80 3.00 0.102 0.110 0.118
0.95REF
0.037REF
1.90REF
0.075REF
0.30
0.60 0.012
0.024
0°
8°
0°
8°
Land Pattern
2.35
0.56
1.20
NOTES:
1. Compound dimension: 2.92×1.60;
2. Unit: mm;
3. General tolerance ±0.05mm unless otherwise
specified;
4. The layout is just for reference.
0.95
0.95
UCC
XX
Tape and Reel Orientation
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UM5204
GREEN COMPLIANCE
Union Semiconductor is committed to environmental excellence in all aspects of its
operations including meeting or exceeding regulatory requirements with respect to the use
of hazardous substances. Numerous successful programs have been implemented to
reduce the use of hazardous substances and/or emissions.
All Union components are compliant with the RoHS directive, which helps to support
customers in their compliance with environmental directives. For more green compliance
information, please visit:
http://www.union-ic.com/index.aspx?cat_code=RoHSDeclaration
IMPORTANT NOTICE
The information in this document has been carefully reviewed and is believed to be
accurate. Nonetheless, this document is subject to change without notice. Union assumes
no responsibility for any inaccuracies that may be contained in this document, and makes
no commitment to update or to keep current the contained information, or to notify a
person or organization of any update. Union reserves the right to make changes, at any
time, in order to improve reliability, function or design and to attempt to supply the best
product possible.
Union Semiconductor, Inc
Add: Unit 606, No.570 Shengxia Road, Shanghai 201210
Tel: 021-51093966
Fax: 021-51026018
Website: www.union-ic.com
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