Application Note (Migration Document) KSZ8864RMN/RMNI//RMNU To KSZ8864CNX/RMNUB Rev 1.2 Introduction This application note summarizes the differences between KSZ8864RMN/RMNU and KSZ8864CNX/RMNUB devices. The KSZ8864CNX/RMNUB devices provide a functional drop in replacement to KSZ8864RMN/RMNU devices. Specific part numbers for the pin-compatible replacements are shown in Table 1 below. Table 2 shows major commonality between two families. Table 3 shows the differences between the two product families. Part Numbers for the Pin-Compatible Replacements (Table 1) Discontinued Devices Replacement Devices KSZ8864RMN/RMNI KSZ8864CNX KSZ8864RMNU (Rev A4) KSZ8864RMNUB (KSZ8864RMNU Rev B2) Summary of major commonality between the two product families (Table 2) KSZ8864RMN/RMNI/RMNU KSZ8864CNX/RMNUB Pins Configuration Same Strap-in Pins Functions Same Features Supports existing features plus new features Package Same except E-Pad, see below Table 3. MII/RMII interface Same VDDC, VDDIO, VDDAT Voltage Same Registers set Same, except LinkMD. For details, please see below Table 3. Summary of Change between Families (Table 3) Descriptions KSZ8864RMN/RMNI/RMNU KSZ8864CNX/RMNUB Process Technology 0.13um 0.11um Identification Register 137 (0x89) bits [7:4]=0x1, 0x3 for 0.13um silicon Register 137 (0x89): Bits [7:4] = 0x4 for KSZ8864CNX Rev. A2 and RMNUB Rev.B2. Bits [7:4] = 0x5 for KSZ8864CNX Rev. A3 and RMNUB Rev.B3. LinkMD Cable Diagnostic No Yes Add the Port registers (0x2A to 0x3A) and Port LinkMD Result registers (0x2B to 0x3B). February 2015 Application Note Digital I/O current strength 4/8/12/16mA in Register 132 bits [7:6] 4/8/10/14mA in Register 132 bits [7:6] HBM ESD Rating 4KV 5KV 1.8V VDDIO: 100Kohm 1.8V VDDIO: 99Kohm Internal I/O Pull-Up Resistor 2.5V VDDIO: 59Kohm 2.5V VDDIO: 61Kohm 3.3V VDDIO: 43Kohm 3.3V VDDIO: 45Kohm Internal I/O Pull-Down Resistor 1.8V VDDIO: 100Kohm 1.8V VDDIO: 99Kohm 2.5V VDDIO: 60Kohm 2.5V VDDIO: 59Kohm 3.3V VDDIO: 43Kohm 3.3V VDDIO: 43Kohm KSZ8864RMN/RMNI rev A3 6.5 mm x 6.5 mm 4.2 mm x 4.2 mm Size of thermal E-pad underneath of the chip KSZ8864RMN/RMNI rev A4 6.2 mm x 6.2 mm (SPNZ801113, SPNY801113) KSZ8864RMNU 6.2 mm x 6.2 mm Conclusion For the detail device information, please refer to the relevant datasheets at www.micrel.com Revision History Revision Date Summary of Changes 1.0 06/06/14 Initial document created. 1.1 03/18/15 Update the size of thermal E-pad for KSZ8864RMN/RMNI/RMNU. 1.2 06/19/15 Add identification register 137 for 0.13um silicon and 0.11um silicon. February 2015 2