INTERSIL RFP8N20L

RFP8N20L
Data Sheet
July 1999
8A, 200V, 0.600 Ohm, Logic Level,
N-Channel Power MOSFET
File Number
Features
• 8A, 200V
This N-Channel enhancement mode silicon gate power field
effect transistor is specifically designed for use with logic
level (5V) driving sources in applications such as
programmable controllers, automotive switching and
solenoid drivers. This performance is accomplished through
a special gate oxide design which provides full rated
conduction at gate biases in the 3V to 5V range, thereby
facilitating true on-off power control directly from logic circuit
supply voltages.
• rDS(ON) = 0.600Ω
• Design Optimized for 5V Gate Drives
• Can be Driven Directly from QMOS, NMOS,
TTL Circuits
• Compatible with Automotive Drive Requirements
• SOA is Power Dissipation Limited
• Nanosecond Switching Speeds
Formerly developmental type TA09534.
• Linear Transfer Characteristics
Ordering Information
• High Input Impedence
PART NUMBER
RFP8N20L
PACKAGE
TO-220AB
1514.3
• Majority Carrier Device
BRAND
• Related Literature
- TB334 “Guidelines for Soldering Surface Mount
Components to PC Boards”
RFP8N20L
NOTE: When ordering, include the entire part number.
Symbol
D
G
S
Packaging
JEDEC TO-220AB
SOURCE
DRAIN
GATE
DRAIN (FLANGE)
6-278
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD Handling Procedures.
http://www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999
RFP8N20L
Absolute Maximum Ratings
TC = 25oC, Unless Otherwise Specified
RFP8N20L
UNITS
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDS
200
V
Drain to Gate Voltage (RGS = 20kΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR
200
V
Continuous Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID
8
A
Pulsed Drain Current (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .IDM
20
A
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS
10
V
Maximum Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD
60
W
0.48
W/oC
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TJ, TSTG
-55 to 150
oC
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TL
Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tpkg
300
260
oC
oC
Above TC = 25oC, Derate Linearly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. TJ = 25oC to 125oC.
Electrical Specifications
TC = 25oC, Unless Otherwise Specified
PARAMETER
SYMBOL
TEST CONDITIONS
Drain to Source Breakdown Voltage
BVDSS
ID = 250µA, VGS = 0
Gate to Threshold Voltage
VGS(TH)
VGS = VDS, ID = 250µA
Zero Gate Voltage Drain Current
Gate to Source Leakage Current
IDSS
IGSS
MIN
TYP
MAX
UNITS
200
-
-
V
1
-
2
V
VDS = 0.8 x Rated BVDSS
TC = 25oC
-
-
1
µA
VDS = 0.8 x Rated BVDSS
TC = 125oC
-
-
50
µA
VGS = 10V, VDS = 0
-
-
100
nA
Drain to Source On-Voltage (Note 2)
VDS(ON)
ID = 8A, VGS = 5V
-
-
4.8
V
Drain to Source On Resistance (Note 2)
rDS(ON)
ID = 4A, VGS = 5V
-
-
0.600
Ω
ID = 4A, VDD = 50V, RG = 6.25 , VGS = 5V
-
15
45
ns
tr
-
45
150
ns
td(OFF)
-
100
135
ns
tf
-
60
105
ns
-
-
900
pF
Turn On Delay Time
td(ON)
Rise Time
Turn Off Delay Time
Fall Time
Input Capacitance
CISS
VGS = 0V, VDS = 25V, f = 1MHz
Output Capacitance
COSS
-
-
250
pF
Reverse Transfer Capacitance
CRSS
-
-
120
pF
Thermal Resistance Junction to Case
RθJC
2.083
oC/W
RFP8N20L
Source to Drain Diode Specifications
PARAMETER
Source to Drain Diode Voltage (Note 2)
Diode Reverse Recovery Time
SYMBOL
VSD
trr
TEST CONDITIONS
MIN
TYP
MAX
UNITS
ISD = 4A
-
-
1.4
V
ISD = 4A, dISD/dt = 100A/µs
-
250
-
ns
NOTES:
2. Pulsed: pulse duration = 300µs max, duty cycle = 2%.
3. Repetitive rating: pulse width limited by maximum junction temperature.
6-279
RFP8N20L
Typical Performance Curves
Unless Otherwise Specified
100
0.8
0.6
0.4
10
DC OPERATION
60W
1
0.2
0
0
50
100
0.1
150
TC, CASE TEMPERATURE (oC)
24
TC = 25oC
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
20
16
VGS = 10V
12
VGS = 5V
VGS = 4V
8
VGS = 3V
4
VGS = 2V
0
0
1
3
4
5
6
2
VDS, DRAIN TO SOURCE VOLTAGE (V)
1
10
100
VDS, DRAIN TO SOURCE (V)
16
VDS = 10V
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
25oC
8
125oC
4
0
1
2
3
4
VGS, GATE TO SOURCE VOLTAGE (V)
0.6
25oC
0.4
-40oC
0.2
5
10
ID, DRAIN CURRENT (A)
15
20
FIGURE 5. DRAIN TO SOURCE ON RESISTANCE vs DRAIN
CURRENT
6-280
ID = 4A, VGS = 5V
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX.
1.5
ON RESISTANCE
NORMALIZED DRAIN TO SOURCE
rDS(ON), DRAIN TO SOURCE ON
RESISTANCE(Ω)
2.0
125oC
0
5
FIGURE 4. TRANSFER CHARACTERISTICS
0.8
0
-40oC
125oC
0
7
VDS = 5V
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX.
1.0
-40oC
12
FIGURE 3. SATURATION CHARACTERISTICS
1.2
1000
FIGURE 2. FORWARD BIAS SAFE OPERATING AREA
IDS(ON), DRAIN TO SOURCE CURRENT (A)
FIGURE 1. NORMALIZED POWER DISSIPATION vs CASE
TEMPERATURE
IDS, DRAIN TO SOURCE CURRENT (A)
TC = 25oC
TJ = MAX RATED
OPERATION IN THIS AREA
LIMITED BY rDS(ON)
1.0
ID, DRAIN CURRENT (A)
POWER DISSIPATION MULTIPLIER
1.2
1.0
0.5
0
-50
0
50
100
TJ, JUNCTION TEMPERATURE (oC)
FIGURE 6. NORMALIZED DRAIN TO SOURCE ON
RESISTANCE vs JUNCTION TEMPERATURE
150
RFP8N20L
Typical Performance Curves
700
1.1
600
1.0
0.9
0.8
0.7
CISS
500
VGS = 0V, f = 1MHz
CISS = CGS + CGD
CRSS = CGD
COSS ≈ CDS + CGD
400
300
200
COSS
100
0.6
0.5
-50
0
50
100
TC, JUNCTION TEMPERATURE (oC)
0
150
FIGURE 7. NORMALIZED GATE THRESHOLD VOLTAGE vs
JUNCTION TEMPERATURE
CRSS
0
10
20
30
40
VDS, DRAIN TO SOURCE VOLTAGE (V)
FIGURE 8. CAPACITANCE vs DRAIN TO SOURCE VOLTAGE
VDS, DRAIN TO SOURCE VOLTAGE (V)
200
10
BVDSS
RL = 25
IG(REF) = 0.45mA
VGS = 5V
150
8
6
VDD = BVDSS
100
50
VDD = BVDSS
GATE
SOURCE
VOLTAGE
4
0.75 BVDSS
0.50 BVDSS
0.25 BVDSS
2
DRAIN SOURCE VOLTAGE
0
50
VGS, GATE TO SOURCE VOLTAGE (V)
NORMALIZED GATE
THRESHOLD VOLTAGE (V)
1.2
800
VDS = VGS
ID = 250µA
C, CAPACITANCE (pF)
1.3
Unless Otherwise Specified (Continued)
0
I
20 G(REF)
IG(ACT)
I
80 G(REF)
IG(ACT)
t, TIME (µs)
NOTE: Refer to Intersil Application Notes AN7254 and AN7260.
FIGURE 9. NORMALIZED SWITCHING WAVEFORMS FOR CONSTANT GATE CURRENT
Test Circuits and Waveforms
tON
tOFF
td(ON)
td(OFF)
tf
tr
RL
VDS
90%
90%
+
RG
-
VDD
10%
10%
0
DUT
90%
VGS
VGS
0
FIGURE 10. SWITCHING TIME TEST CIRCUIT
6-281
10%
50%
50%
PULSE WIDTH
FIGURE 11. RESISTIVE SWITCHING WAVEFORMS
RFP8N20L
Test Circuits and Waveforms
(Continued)
VDS
VDD
RL
Qg(TOT)
VDS
VGS = 10V
VGS
Qg(5)
+
VDD
DUT
VGS = 5V
VGS
-
VGS = 1V
IG(REF)
0
Qg(TH)
IG(REF)
0
FIGURE 12. GATE CHARGE TEST CIRCUIT
FIGURE 13. GATE CHARGE WAVEFORMS
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
Sales Office Headquarters
NORTH AMERICA
Intersil Corporation
P. O. Box 883, Mail Stop 53-204
Melbourne, FL 32902
TEL: (407) 724-7000
FAX: (407) 724-7240
6-282
EUROPE
Intersil SA
Mercure Center
100, Rue de la Fusee
1130 Brussels, Belgium
TEL: (32) 2.724.2111
FAX: (32) 2.724.22.05
ASIA
Intersil (Taiwan) Ltd.
7F-6, No. 101 Fu Hsing North Road
Taipei, Taiwan
Republic of China
TEL: (886) 2 2716 9310
FAX: (886) 2 2715 3029