TLE4922 1 Product Description The TLE4922 is an active mono cell Hall sensor suited to detect the motion and position of ferromagnetic and permanent magnet structures. An additional selfcalibration module has been implemented to achieve optimum accuracy during normal running operation. 1.1 Target Application The TLE4922 is a speed sensor for small engine (2- and 3 wheeler) applications. Figure 1-1 Crankshaft speed and position sensing Transmission speed on output shaft Speedometer application Excellent sensitivity and accuracy combined with its wide operational temperature range makes the sensor ideally suited for harsh environments. 1.2 • • • • • • • • • • • Package PG-SSO-4-1 Key Features and benefits Twist independent mounting (TIM) “enables one sensor fits all”. Small thin package (PG-SSO-4-1) Protected against harsh environment due to – Short-circuit at the output – Over temperature shutdown at the output and – Reverse voltage protection Supreme performance due to adaptive symmetrical hysteresis / threshold Independent of back bias magnet polarity due to ±440mT full scale range Enhanced EMC & ESD robustness - ESD : ±4kV HBM Wide operating temperature range - Tjunction: -40 °C - 155 °C True zero speed up to 8kHz signal frequency Enabling Low Power Application: Idd = 5mA at Vdd = 9V Large operating voltage range of 4.5V up to 18V Robustness against wheel run outs enables to sense broad range of wheels Figure 1-2 Pinning, Sensitive Area VDD Hall Supply Analog Supply Digital Supply GND Chopped Hall Probe Tracking ADC Figure 1-3 D-Core (Min/Max, Offset, Comparator) Open Drain Blockdiagram TLE4922 V BATT V LOAD R SERIES 200 Ω VBATT Figure 1-4 Product Type Marking Ordering Code Package TLE4922-XAN-F 22BAA1 SP001106758 PG-SSO-4-1 TLE4922-XIN-F 22BAA2 SP001154230 PG-SSO-4-1 Product Information 1 VQ RLOAD 1.2 k Ω V DD CV DD 47 nF Q GND IC1 TLE4922 VQ IQ CQ 4.7 nF CLOAD 50 pF Application circuit TLE4922 Figure 1-5 Wheel with sensor V 1.0, 2016-04-26 TLE4922 Specification 2 Specification The listed characteristics are ensured over the operating range and lifetime of the integrated circuit. 2.1 Absolute Maximum Ratings Table 2-1 Absolute Maximum Ratings Parameter Symbol Values Unit Note or Test Condition Min. Typ. Max. Supply voltage Output OFF voltage Output ON voltage Junction temperature Passive overall lifetime -18 - - V - - 18 V valid for TLE4922-XAN-F - - 24 V max. 1 hour, valid for TLE4922-XIN-F VSAC - - 30 V max. 1 min with RSERIES = 200Ω VQ -1 - - V max. 60 min @ TA = 25°C -0.3 - 18 V - - 18 V 195 °C 3h 150 °C 0.2 years for TLE4922-XAN-F VS VQ 1) TJ TPol 2) -40 - 0.5 years for TLE4922-XIN-F ESD compliance 1) 2) ESDHBM -40 - 50 °C 15 years -4 - 4 kV HBM according ANSI/ESDA/JEDEC JS-001 In temperature range between operating temperature and absolute maximum temperature no functionality is guaranteed. Maximum exposure time at other junction temperatures shall be calculated based on the values specified using the Arrhenius-model. Note: Stresses above the max. values listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. 2.2 Operating Range The following operating conditions must not be exceeded in order to ensure correct operation of the IC. All parameters specified in the following sections refer to these operating conditions unless otherwise mentioned. Table 2-2 Operating Range Parameter Symbol Values Unit Note or Test Condition Min. Typ. Max. Supply voltage Continuous output ON current Operating junction temperature Frequency range of magnetic input signal 1) 2) VS IQ TJ f 1) 4.5 - 16 V valid for TLE4922-XAN-F 4.5 - 18 V valid for TLE4922-XIN-F - - 8.8 mA -40 - 155 °C 2000h for TLE4922-XAN-F -40 - 155 °C 5000h for TLE4922-XIN-F 02) - 8000 Hz Typical RthJA is 170K/W. As soon as back bias magnet is attached or customer mold coveres the TLE4922 this value will decrease due to larger surface and mass of the module. Maximum exposure time at other junction temperatures shall be calculated based on the values specified using the Arrhenius-model. Maximum one additional pulse may occur due to temperature variation during stand still. Product Information 2 V 1.0, 2016-04-26 TLE4922 Specification 2.3 Electrical Characteristics Table 2-3 Electrical Parameters Parameter Symbol Values Unit Note or Test Condition Min. Typ. Max. Supply current IS 3.5 5.3 7.0 mA Output saturation voltage VQSAT - 0.15 0.4 V Output leakage current IQLEAK - - 1 μA Current limit for short-circuit protection IQSHORT1) 40 46 52 mA Junction temperature for output protection TPROT1) - 195 tbd °C Power on time tON1) Output fall time Output rise time Delay time 1) 2) 3) tf IQ = 8.8 mA Output will shut down (high impedance) when exceeded - 0.7 0.9 ms 2) 2.2 2.8 3.8 μs VLOAD = 5 V, CLOAD =4.7 nF, RLOAD = 1.2 kΩ 1)2) 1 - 20 µs VLOAD = 5 V, CLOAD =4.7 nF, RLOAD = 1.2 kΩ 1)3) 12.5 18 23.5 μs VLOAD = 5 V, CLOAD =4.7 nF, RLOAD = 1.2 kΩ, f=5kHz, see Figure 2-1 tr td Parameter is characterized by simulation/verification Time between 20% and 80% value of VLOAD Only valid for the falling edge 2.4 Magnetic Characteristics and Self-Calibration Characteristics Table 2-4 Magnetic Characteristics and Self-Calibration Characteristics: 10 Gauss = 1mT Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. Linear Region BLR 1) Peak to peak magnetic hysteresis BMIN 1) -400 - 400 mT 2.0 3.0 5.3 mT Full frequency range 2.0 3.0 3.8 mT Up to 3kHz signal frequency At Ta=25°C, please notice relation between back bias magnet and linear region as described in user manual Back Bias Magnet Range BBIAS -400 - 400 mT Duty Cycle DC2) 40 50 60 % 30 50 70 % Including EMC (magnetic distortion) - 3 - At 4th falling edge full accuracy reached. Number of falling output edges required to be calibrated nCalib 2)3) - Relative phase error in calibrated ϕrel2)4) mode - ± 0.3 ± 1.5 °crank Forward and backward rotational direction. Temperature and airgap included. Output falling edge repeatability ϕjitter2)4) (phase jitter) in calibrated mode - 0.05 0.2 1) 2) 3) 4) °crank 99.7 %, 3 pulses out of 1000 above limit. Equivalent to ± 3sigma of a Gaussian distribution. is calculated out of measured sensitivity Parameter is characterized by simulation/verification Maximum one additional pulse may occur due to temperature variation during stand still Performance measured on wheel described in Chapter 2.6 within air gap range 0.5mm to 3.2mm Product Information 3 V 1.0, 2016-04-26 TLE4922 Specification M agnetic encoder N S N S N Tooth Gearwheel Notch Threshold crossing switching points Magnetic input signal Sensor output signal Threshold crossing switching points Delay time td ᵠ jitter Delay time td Figure 2-1 Phase error and delay time definition 2.5 Electromagnetic Compatibility (EMC) 99.7% Sensor output signal Phase jitter definition The TLE4922 is characterized according to the IC level EMC requirements described in the “Generic IC EMC Test Specification” Version 1.2 from 20071). Additionally, component level EMC characterizations according to ISO 76372:2011, ISO 7637-3:2007 and ISO 16750-2:2010 regarding pulse immunity and CISPR 25 (2009-01) Ed. 3.0 regarding conducted emissions are performed. Figure 1-4 on first page outlines all needed external components to operate the DUT under application conditions. They are treated as inherent part of the DUT during component level EMC characterizations. Note: Characterisation of Electro Magnetic Compatibility (EMC) are carried out on sample base of one qualification lot. Not all specification parameters are monitored during EMC exposure. Only key parameters e.g. switching current and duty cycle are monitored. Parameter Symbol Level Class Testpulse 1 VEMC -100 V C Testpulse 2a1) 100 V A Testpulse 2b 10 V C Testpulse 3a -150 V A Testpulse 3b 100 V A -7 V C 86.5 V A Testpulse 4 2) Testpulse 5b 3) 1) 2) 3) ISO 7637-2 (2004) describes internal resistance = 2Ω According to 7637-2 for test pulse 4 the test voltage shall be 12 V +/- 0.2 V. A central load dump protection of 35V is used. 1) The document is available online at http://www.zvei.org/Verband/Publikationen/Seiten/Generic-IC-EMCTest-Specification-english.aspx Product Information 4 V 1.0, 2016-04-26 TLE4922 Specification 2.6 Reference Target Wheel Table 2-5 Toothed wheel performance Parameter Symbol Values Unit Note or Test Condition Min. Typ. Max. AG1)2) Operational IC air-gap - - 3.2 mm Field strength of 300mT at 0.7mm above surface of back-bias magnet; Air-gap variation over one complete AGGLRO 1) target revolution. Global run-out. - 0.5 mm Difference between min. and max. air-gap over one complete target revolution. 1) 2) Parameter is characterized by verification Measured from surface of package to toothed wheel, explained in Figure 2-2. Figure 2-2 Infineon reference toothed wheel: dimension in mm Table 2-6 Reference target wheel geometry Parameter Typ value Unit Material ST37 - Tooth notch ratio 1.00 Product Information 5 Remarks V 1.0, 2016-04-26 TLE4922 Specification 2.7 Performance Graphs Following graphs of typical sensor behavior will help to optimize application performance: Supply current @ Vdd=9V Supply current 6,5 5,5 6 5,25 5,5 [mA] [mA] Tj=25°C 5 Tj=100°C 5 4,75 4,5 4 4,5 -60 -30 0 30 60 90 120 150 180 3 5 7 9 Tj[C] Fall time @ Vout=5V 15 17 19 3 3 [us] [us] 3,5 2,5 2 2 -50 0 50 100 150 4 6 8 10 Tj [°C] 14 16 18 Minimum magnetic field @ Tj=25°C 4,5 4 4 3,5 3,5 [mTpp] 4,5 3 3 2,5 2,5 2 2 -50 0 50 100 150 100 Duty cycle @ 'B=10mTpp Duty cycle @ 'B=10mTpp 60 10000 1000 Freq[Hz] Tj[C] 60 58 58 56 56 54 54 52 52 [%] [%] 12 VDD [V] Minimum magnetic field @ f=1kHz [mTpp] 13 Fall time @ Vout=5V @ Tj=25°C 3,5 2,5 50 50 48 48 46 46 44 44 42 42 40 40 -50 0 50 100 150 10 Tj[C] Figure 2-3 11 Vdd[V] 100 1000 10000 Freq[Hz] Typical Performance Product Information 6 V 1.0, 2016-04-26 TLE4922 Specification 2.8 Application Basic functionality The TLE4922 is a mono-cell Hall sensor with analog to digital converter and full digital signal processing for detecting the magnetic field crossing of the threshold levels. A chopped Hall probe is used to get rid of the offset and has advantages for 0-Hz feature. The Figure 2-1 shows the basic functionality of TLE4922. Unique Feature: Polarity of Pre Induction The back bias magnet can be mounted in both directions to TLE4922 without any difference in performance. One polarity results in switching the output to “LOW” when passing a tooth and to “HIGH” when passing a notch, whereas the other poarity of back-bias magnet will switch the output to “HIGH” when passing a tooth and to “LOW” when passing a notch. Figure 2-4 Changing polarity of back bias magnet will change the polarity of TLE4922 output Start-Up and Running Mode In Start-Up-Mode the TLE4922 starts with output at “HIGH” and stays there until a first minimum in magnetic field is detected after start-up time. Calibrated mode is reached after a maximum of four output transitions (3 falling output edges). At the 4th falling edge full accuracy on output signal is reached. These first transitions are determined by the detection of magnetic signal maxima and minima. Output transitions in running phase are determined by the hidden adaptive hysteresis algorithm. Application circuit Figure 1-4 on page one shows an option of an application circuit. The resistor RS is recommended due to reason of EMC. The resistor RL has to be at a value to match the applied VECU to keep IQ limited to the operating range of maximal 8.8mA. e.g.: VLOAD = 9V: IQ = 9V/1200 Ω = 7.5mA Consideration on RthJA The Rth is modified by attaching a back-bias magnet or doing overmolding at the customer. There is a further dependency on the attached wires: The thicker the attached wire the smaller the value of Rth. Further it depends on ambient condition: When one end of the module is cooled in oil or through air-flow the RthJA will further decrease. Global run out Due to averaging global run out is depending on the number of teeth. The wheel in Chapter 2.6 allows a global run out of 0.8mm. As designed wheels with equal or more then 8 teeth are still capable of up to 0.5mm global run out. Product Information 7 V 1.0, 2016-04-26 TLE4922 Package Information 3 Package Information Green Product (RoHS compliant) To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020). 3.1 Package Information PG-SSO-4-1 Pure tin covering (green lead plating) is used. The product is RoHS (Restriction of Hazardous Substances) compliant and marked with letter G in front of the data code marking and may contain a data matrix code on the rear side of the package (see also information note 136/03). Please refer to your key account team or regional sales if your need further information. Figure 3-1 Marking pattern Figure 3-2 PG-SSO-4-1 package dimensions Product Information 8 V 1.0, 2016-04-26 TLE4922 Package Information Figure 3-3 PG-SSO-4-1 packaging Product Information 9 V 1.0, 2016-04-26 Trademarks of Infineon Technologies AG AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, CoolMOS™, CoolSET™, CORECONTROL™, CROSSAVE™, DAVE™, DI-POL™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPIM™, EconoPACK™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™, ISOFACE™, IsoPACK™, LITIX™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OptiMOS™, ORIGA™, POWERCODE™, PRIMARION™, PrimePACK™, PrimeSTACK™, PRO-SIL™, PROFET™, RASIC™, ReverSave™, SatRIC™, SIEGET™, SINDRION™, SIPMOS™, SmartLEWIS™, SPOC™, SOLID FLASH™, TEMPFET™, thinQ!™, TRENCHSTOP™, TriCore™. Other Trademarks Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™, PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG. FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics Corporation. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited. Last Trademarks Update 2011-11-11 www.infineon.com Edition 2016-04-26 Published by Infineon Technologies AG 81726 Munich, Germany © 2014 Infineon Technologies AG. All Rights Reserved. Do you have a question about any aspect of this document? Email: [email protected] Document reference Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. 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