567KB

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WLCSP6, 1.40x0.90
CASE 567KB
ISSUE A
SCALE 4:1
DATE 22 JUL 2015
D
ÈÈ
ÈÈ
PIN A1
REFERENCE
0.25 C
2X
0.25 C
2X
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
B
E
DIM
A
A1
A2
b
D
E
e
TOP VIEW
A2
0.10 C
GENERIC
MARKING DIAGRAM*
A
0.05 C
NOTE 3
6X
e
b
XXXG
AYWW
SEATING
PLANE
A
Y
WW
G
e/2
e
0.05 C A B
0.03 C
C
SIDE VIEW
A1
1
2
A
B
C
BOTTOM VIEW
MILLIMETERS
MIN
NOM
MAX
−−−
−−−
0.510
0.142
−−−
0.172
−−−
0.320
0.338
0.195
−−−
0.235
−−−
1.400
1.440
−−−
0.900
0.940
0.50 BSC
= Assembly Location
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
RECOMMENDED
SOLDERING FOOTPRINT*
PACKAGE
OUTLINE
0.50
PITCH
6X
A1
0.50
PITCH
0.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON85977F
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
WLCSP6, 1.40X0.90
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON85977F
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY M. COMBES.
13 MAY 2014
A
CHANGED DIMENSIONS A2, D & E FROM BASIC DIMENSIONS TO NOMINAL
AND MAX VALUES. REQ. BY R. AVILA.
22 JUL 2015
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over
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© Semiconductor Components Industries, LLC, 2015
July, 2015 − Rev. A
Case Outline Number:
567KB
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