506CD

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
DFN12 3x3, 0.5P
CASE 506CD
ISSUE A
DATE 18 FEB 2014
1
SCALE 4:1
L
A B
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L
L1
PIN ONE
INDICATOR
0.10 C
2X
2X
0.10 C
ÎÎÎ
ÎÎÎ
ÎÎÎ
DETAIL A
ALTERNATE
CONSTRUCTIONS
E
MOLD CMPD
EXPOSED Cu
TOP VIEW
A3
DETAIL B
0.05 C
A1
A
0.05 C
NOTE 4
SIDE VIEW
A1
D2
6
1
DETAIL B
A3
ALTERNATE
CONSTRUCTION
C
0.10
DETAIL A
ÎÎÎ
ÎÎÎ
ÏÏÏ
DIM
A
A1
A3
b
D
D2
E
E2
e
L
L1
L2
K
M
SEATING
PLANE
GENERIC
MARKING DIAGRAM*
C A B
L
12X
0.10
XXXXX
XXXXX
ALYWG
G
C A B
M
L2
E2
K
7
12
e
e/2
12X
A
L
Y
W
G
b
0.10
M
C A-B B
0.05
M
C
BOTTOM VIEW
NOTE 3
RECOMMENDED
SOLDERING FOOTPRINT*
2.86
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.20
0.30
3.00 BSC
2.60
2.80
3.00 BSC
1.90
2.10
0.50 BSC
0.20
0.40
−−−
0.15
0.10 REF
0.15 MIN
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
11X
0.32
12X
0.48
2.10 3.30
PACKAGE
OUTLINE
1
0.45
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON67174E
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
DFN12 3X3, 0.5P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON67174E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY D. GASTELUM.
14 FEB 2012
A
ADDED K DIMENSION. REQ. BY D. GASTELUM.
18 FEB 2014
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2014
February, 2014 − Rev. A
Case Outline Number:
506CD
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