485BF

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
QFN18 3x3, 0.5P
CASE 485BF−01
ISSUE O
1
SCALE 2:1
PIN 1
REFERENCE
0.15 C
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
0.15 C
EDGE OF PACKAGE
A
B
D
L
L1
DETAIL A
E
EXPOSED Cu
18X
5
C
A1
SIDE VIEW
L
ÏÏÏ
ÏÏÏ
DETAIL B
(A3)
D2
MOLD CMPD
OPTIONAL
CONSTRUCTION
A
0.08 C
GENERIC
MARKING DIAGRAM*
SEATING
PLANE
1
DETAIL A
9
4
10
E2
K
MILLIMETERS
DIM MIN
MAX
A
0.80
1.00
A1 0.00
0.05
A3
0.20 REF
b
0.18
0.30
D
3.00 BSC
D2 1.75
1.95
E
3.00 BSC
E2 1.75
1.95
e
0.50 BSC
K
0.20
−−−
L 0.275 0.375
L1 0.00
0.15
OPTIONAL
CONSTRUCTION
DETAIL B
NOTE 4
NOTES:
1. DIMENSIONS AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND 0.30
MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L
TOP VIEW
0.10 C
DATE 10 FEB 2010
1
13
18
18X
e
b
0.10 C A B
BOTTOM VIEW
0.05 C
NOTE 3
RECOMMENDED
MOUNTING FOOTPRINT
3.30
1.95
3.30
18X
0.53
XXXX
XXXX
ALYWG
G
XXXXX = Specific Device Code
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
PACKAGE
OUTLINE
1.95
18X
0.31
0.50
PITCH
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON48573E
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
QFN18 3X3, 0.5P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON48573E
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY B. JENSEN.
DATE
10 FEB 2010
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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© Semiconductor Components Industries, LLC, 2010
February, 2010 − Rev. 01O
Case Outline Number:
485BF
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