Surface Mount Solder Reflow Profile – Semiconductor Packages Surface Mount Packages are qualified by simulating the solder reflow conditions specified in IPC/JEDEC J-STD-020, which defines soldering conditions for moisture reflow sensitivity classification. Users should ensure they do not exceed the scope of IPC/JEDEC J-STD-020 (Pb-Free) during solder assembly. Profile Feature Profile Limits Preheat temperature min. (Tsmin) 150oC Preheat temperature max. (Tsmax) 200oC Ramp time (Tsmax - Tsmin) 60 – 120 seconds Ramp –up rate ( TL to Tp) 3 oC/second max Liquidus temperature (TL) 217oC Time maintained above TL 60-150 seconds Peak package body temperature 260oC Time within 5oC of peak temperature (tp) 30 seconds max Ramp –down rate ( Tp to TL) 6 oC/second max Time from 25oC to peak temperature www.bourns.com 8 minutes max. Oct 2015