CD143A-SR2.8

MATERIAL DECLARATION SHEET
ESD Suppressing Device
Material Number
CD143A-SR2.8
Product Line
Semiconductor Products
Compliance Date
RoHS Compliant
2013/8/2
Yes
MSL
3
if applicable
Materials
Mass %
0.00035
Homogeneous
Material\
Substances
Silicon
7440-21-3
100.00%
Material
Mass % of
total unit wt.
3.16%
0.00003
Nickel
7440-02-0
0.80%
0.28%
0.00005
0.000003
0.00367
0.00004
Tin
Phosphorus
Copper
Silver
7440-31-5
7723-14-0
7440-50-8
7440-22-4
1.20%
0.07%
96.93%
1.00%
0.42%
0.02%
33.15%
0.34%
0.00015
Silicon dioxide
14808-60-7
43.60%
1.35%
0.00009
Epoxy resin
Aromatic
Amine
Epoxy resin
modifier
Proprietary
25.64%
0.79%
Proprietary
15.38%
0.47%
Proprietary
15.38%
0.47%
0.000001
Palladium
7440-05-3
2.00%
0.005%
0.00003
0.00519
Copper
Silica
98.00%
80.00%
0.245%
46.83%
0.00065
Epoxy Resin
10.00%
5.85%
0.00063
Phenolic Resin
7440-50-8
60676-86-0
Trade
Secret
Trade
Secret
9.70%
5.68%
0.00002
Carbon Black
1333-86-4
0.30%
0.18%
No.
Construction
Element(subpart)
Homogeneous
Material
Material
weight [g]
1
Wafer
Silicon
2
3
Lead frame
Epoxy
Copper Alloy
Polymer
0.00005
0.00005
4
5
Cu wire
Mold Compound
Headquarters Riverside CA
Noble metal
Polymer
CASRN
Subpart
mass of total
wt. (%)
3.16%
34.21%
3.08%
0.25%
58.54%
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MATERIAL DECLARATION SHEET
6
Plating
plating
Total weight
This Document was updated on:
0.00008
Tin
7440-31-5
99.90%
0.759%
0.0000001
Misc., not to
declare
N/A
0.10%
0.001%
0.76%
0.0110803g
2013/8/2
Important remarks:
1.
It is the responsibility of the user to verify they are accessing the latest version.
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