CD143A-SR3.3

MATERIAL DECLARATION
ESD Suppressing Device
Material Number
CD143A-SR3.3
Product Line
Semiconductor Products
Compliance Date
RoHS Compliant
2013/8/2
Yes
MSL
3
No.
Construction
Element(subpart)
Homogeneous
Material
Material
weight [g]
Homogeneous
Material\
Substances
1
Wafer
Silicon
0.0003500
Silicon
0.0000303
0.0000455
0.0000027
0.0036736
0.0000379
0.0001488
0.0000875
2
Lead frame
Copper Alloy
3
Epoxy
Polymer
Material
s Mass
%
Material Mass
% of total
unit wt.
7440-21-3
100.00%
3.16%
Nickel
7440-02-0
0.80%
0.28%
Tin
Phosphorus
Copper
Silver
Silicon dioxide
Epoxy resin
Aromatic
Amine
Epoxy resin
modifier
7440-31-5
7723-14-0
7440-50-8
7440-22-4
14808-60-7
Proprietary
1.20%
0.07%
96.93%
1.00%
43.60%
25.64%
0.42%
0.02%
33.15%
0.34%
1.35%
0.79%
Proprietary
15.38%
0.47%
Proprietary
15.38%
0.47%
0.0000006
Palladium
7440-05-3
2.00%
0.005%
0.0000274
0.0051888
0.0006486
0.0006291
Copper
Silica
Epoxy Resin
Phenolic Resin
7440-50-8
60676-86-0
Trade Secret
Trade Secret
98.00%
80.00%
10.00%
9.70%
0.245%
46.83%
5.85%
5.68%
0.0000195
Carbon Black
1333-86-4
0.30%
0.18%
0.0000525
0.0000525
4
Cu wire
Noble metal
5
Mold Compound
Polymer
Headquarters Riverside CA
CASRN
if applicable
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CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society
Subpart
mass of
total wt.
(%)
3.16%
34.21%
3.08%
0.25%
58.54%
page 1 of 2
MATERIAL DECLARATION
6
Plating
plating
Total weight
This Document was updated on:
0.0000849
Tin
7440-31-5
99.90%
0.759%
0.0000001
Misc., not to declare
N/A
0.10%
0.001%
0.76%
0.0110803g
2014/04/16
Important remarks:
1.
It is the responsibility of the user to verify they are accessing the latest version.
Headquarters Riverside CA
www.bourns.com
CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society
page 2 of 2
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