CDNBS16

MATERIAL DECLARATION SHEET
Material #
CDNBS16 Series
Product Line
Integrated Passive & Active Devices
Date
5/27/2004
RoHS Compliant
Yes
COMPONENT DETAILS
No.
1
Construction
element
Lead Frame
Material group
Lead Frame
Material
weight [g]
0.0757
2
Wafer
Silicon
0.01434
3
Gold Bond wire
Conductor
0.000352
4
Silver paste
Die Attach
0.000808
5
Molding
Component
Outer
0.0576
Total weight
Materials
CAS
if applicable
Average mass
[%]
Cu
Ni
Sn
7440-50-8
7440-02-0
7440-31-5
48.23
0
2.447
Silicon
7440-21-3
9.444
Other material
Au
SI
Ag
.1927
7440-57-5
7440-22-4
Epoxy
Silica fused
Epoxy resin
Phenol resin
.2352
.0023
.4235
.1195
60676-86-0
68928-70-1
29690-82-2
32.90
3.871
2.322
Sum [%]
Traces
50.87
9.637
.2365
.5430
38.71
0.1488
Pb Free Part Number Example: CDNBS16-T05C
Note: Avg. mass and sum data is a % of the component weight.
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