CDSOT23

MATERIAL DECLARATION SHEET
Package Type
SOT23
Product Line
Diode Array
Compliance Date
January 1st, 2006
RoHS Compliant
No.
1
2
3
Construction
Element (subpart)
Encapsulation
Leadframe
Chip
Yes
Homogeneous
Material
Epoxy resin
Copper alloy
Silicon
MSL
1
Material
weight [g]
Homogeneous
Material\
Substances
0.005271
Fused Silica (SiO2)
Epoxy resin
Epoxy CN
Phenol resin
Carbon Black
0.004021
0.000402
if applicable
Materials
Mass %
Material
Mass % of
total unit wt.
Subpart
mass of total
wt. (%)
60676-86-0
Trade Secret
29690-82-2
Trade Secret
1333-86-4
87.70
5.00
2.00
5.00
0.30
47.10
2.69
1.07
2.69
0.16
53.71
Copper
7440-50-8
94.11
37.84
Iron
7439-89-6
2.22
0.89
Zinc
7440-66-6
0.01
0.00
Phosphorous
7723-14-0
0.03
0.01
Silver (Plating)
7440-22-4
3.63
1.46
Silicon
7440-21-3
93.73
3.77
Aluminum
7429-90-5
3.05
0.12
Nickel
7440-02-0
3.08
0.12
Gold
7440-57-5
0.13
0.01
Silver
7440-22-4
75.00
0.59
Epoxy
9003-36-5
25.00
0.20
CASRN
40.21
4.02
4
Die Attach
Silver epoxy
0.000079
5
Bond wires
Gold
0.000044
Gold
7440-57-5
100.00
0.44
0.44
6
Terminal Finish
Matte Tin
0.000083
Matte Tin
7440-31-5
100.00
0.83
0.83
Total Weight
0.79
0.0099
.
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Rev Sept 2008 page 1 of 1
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