CDSOT236-0502

MATERIAL DECLARATION SHEET
Material Number
CDSOT236-0502
Product Line
Semiconductor Products
2013/8/6
Compliance Date
RoHS Compliant
Yes
3
MSL
0.000500
Homogeneous
Material\
Substances
Silicon
CASRN
if applicable
Materials
Mass %
7440-21-3
100.00%
Material
Mass % of
total unit wt.
3.125%
0.003335
Copper
7440-50-8
95.295%
20.845%
0.000088
0.000004
0.000004
0.000070
0.0000002
Iron
phosphorous
Zinc
Siliver
Lead
7439-89-6
7723-14-0
7440-66-6
7440-22-4
7439-92-1
2.50%
0.10%
0.10%
2%
0.005%
0.547%
0.022%
0.022%
0.438%
0.001%
0.000280
Acrylic Resin
28.00%
1.748%
15.00%
0.938%
3.00%
0.188%
25.00%
1.561%
No.
Construction
Element(subpart)
Homogeneous
Material
Material
weight [g]
1
Wafer
Silicon
2
Lead frame
Copper Alloy
0.000150
0.000030
3
Epoxy
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Polymer
Polybutadiene
derivative
Butadiene
copolymer
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Secret
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0.000250
Acrylate
0.000050
Epoxy resin
Trade
Secret
5.00%
0.313%
0.000050
Peroxide
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5.00%
0.313%
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Subpart
mass of total
wt. (%)
3.125%
21.875%
6.250%
page 1 of 2
MATERIAL DECLARATION SHEET
4
5
6
Cu Wire
Mold Compound
Plating
0.000050
Additive
Trade
Secret
5.00%
0.313%
0.000070
Silica
68611--44-9
7.00%
0.438%
0.000070
Boron
compound
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7.00%
0.438%
0.000975
Copper
7440-50-8
97.50%
6.094%
Noble metal
Polymer
Plating
Total weight
This Document was updated on:
6.250%
0.000025
Palladium
7440-05-3
2.50%
0.156%
0.000450
Solid Epoxy
Resin
0.000450
Phenol Resin
Trade
Secret
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5.00%
2.813%
5.00%
2.813%
0.007650
Fused Silica
60676-86-0
85.00%
47.812%
0.000045
Crystalline Silica
14808-60-7
0.50%
0.281%
0.000045
Carbon Black
01333-86-4
0.50%
0.281%
0.000360
Metal Hydroxide
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4.00%
2.250%
0.001000
Tin
Others
7440-31-5
99.99%
6.249%
0.01%
0.001%
0.0000001
56.250%
6.250%
0.016 g
2013/8/6
Important remarks:
1.
It is the responsibility of the user to verify they are accessing the latest version.
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