CDSOT236-0504C

MATERIAL DECLARATION SHEET
CDSOT236-0504C
Material Number
Product Line
Semiconductor Products
2015/8/28
Compliance Date
RoHS Compliant
Yes
3
MSL
No.
Construction
Element(subpart)
Homogeneous
Material
Material
weight [mg]
1
Wafer
Silicon
0.5000
2
Lead frame
Copper Alloy
3
Epoxy
Polymer
4
Wire
Noble metal
3.3353
0.0875
0.0035
0.0035
0.0700
0.0002
0.4200
0.4000
0.1500
0.0300
0.9999
0.0001
0.7200
5
Mold Compound
Headquarters Riverside CA
Polymer
0.7200
7.4970
0.0450
0.0180
Homogeneous
Material\
Substances
Silicon
Material
Mass % of
total unit wt.
3.125%
CASRN
if applicable
Materials
Mass %
7440-21-3
100.00%
Copper
7440-50-8
95.29%
Iron
phosphorous
Zinc
Lead*
Silver
Si-oxide Quartz
Epoxy resin
Epoxy resin
modifier
Aromatic amine
Gold
Misc, not to
declare
Solid Epoxy
Resin
Phenol Resin
Fused Silica*1
Carbon Black
Metal Hydroxide
7439-89-6
7723-14-0
7440-66-6
7439-92-1
7440-22-4
14808-60-7
Confidential
2.50%
0.10%
0.10%
2.00%
0.01%
42.00%
40.00%
20.846%
0.547%
0.022%
0.022%
0.438%
0.001%
2.625%
2.500%
Confidential
15.00%
0.938%
Confidential
7440-57-5
3.00%
99.99%
0.188%
6.2494%
/
0.01%
0.0006%
Confidential
8.00%
4.500%
Confidential
60676-86-0
1333-86-4
Confidential
8.00%
83.30%
0.50%
0.20%
4.500%
46.854%
0.281%
0.113%
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CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society
Subpart
mass of total
wt. (%)
3.125%
21.876%
6.251%
6.25%
56.248%
page 1 of 2
MATERIAL DECLARATION SHEET
6
Plating
Plating
Total weight
This Document was updated on:
0.9999
0.0001
Tin
Misc., not to
declare
7440-31-5
99.99%
6.249%
/
0.01%
0.001%
6.25%
16 mg
2015/10/28
Important remarks:
1. It is the responsibility of the user to verify they are accessing the latest version.
2. * 6c – copper alloy containing up to 4% lead by weight.
Headquarters Riverside CA
www.bourns.com
CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society
page 2 of 2
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