MATERIAL DECLARATION SHEET CDSOT236-0504C Material Number Product Line Semiconductor Products 2015/8/28 Compliance Date RoHS Compliant Yes 3 MSL No. Construction Element(subpart) Homogeneous Material Material weight [mg] 1 Wafer Silicon 0.5000 2 Lead frame Copper Alloy 3 Epoxy Polymer 4 Wire Noble metal 3.3353 0.0875 0.0035 0.0035 0.0700 0.0002 0.4200 0.4000 0.1500 0.0300 0.9999 0.0001 0.7200 5 Mold Compound Headquarters Riverside CA Polymer 0.7200 7.4970 0.0450 0.0180 Homogeneous Material\ Substances Silicon Material Mass % of total unit wt. 3.125% CASRN if applicable Materials Mass % 7440-21-3 100.00% Copper 7440-50-8 95.29% Iron phosphorous Zinc Lead* Silver Si-oxide Quartz Epoxy resin Epoxy resin modifier Aromatic amine Gold Misc, not to declare Solid Epoxy Resin Phenol Resin Fused Silica*1 Carbon Black Metal Hydroxide 7439-89-6 7723-14-0 7440-66-6 7439-92-1 7440-22-4 14808-60-7 Confidential 2.50% 0.10% 0.10% 2.00% 0.01% 42.00% 40.00% 20.846% 0.547% 0.022% 0.022% 0.438% 0.001% 2.625% 2.500% Confidential 15.00% 0.938% Confidential 7440-57-5 3.00% 99.99% 0.188% 6.2494% / 0.01% 0.0006% Confidential 8.00% 4.500% Confidential 60676-86-0 1333-86-4 Confidential 8.00% 83.30% 0.50% 0.20% 4.500% 46.854% 0.281% 0.113% www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society Subpart mass of total wt. (%) 3.125% 21.876% 6.251% 6.25% 56.248% page 1 of 2 MATERIAL DECLARATION SHEET 6 Plating Plating Total weight This Document was updated on: 0.9999 0.0001 Tin Misc., not to declare 7440-31-5 99.99% 6.249% / 0.01% 0.001% 6.25% 16 mg 2015/10/28 Important remarks: 1. It is the responsibility of the user to verify they are accessing the latest version. 2. * 6c – copper alloy containing up to 4% lead by weight. Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 2 of 2