CDSOT23-6 Package

MATERIAL DECLARATION SHEET
Package Type
SOT236
Version
2
Product Line
TISP and Diode Arrays
Compliance Date
RoHS Compliant
August 28th, 2015
Yes
No.
Construction Element
(subpart)
Homogeneous
Material
MSL
Material
Weight (g)
1
Encapsulation
Epoxy resin
0.00854
2
Leadframe
Copper Alloy
0.00674
3
Chip
Silicon
0.00043
4
5
6
Die Attach
Bond wires
Terminal Finish
Headquarters Riverside CA
Epoxy
Gold
Tin
Total weight (g)
0.00004
0.00007
0.00073
0.01655
1
Homogeneous
Material/
Substances
Fused Silica (SiO2)
Epoxy Resin
Phenol Resin
Epoxy, Cresol Novolac
Carbon Black
Copper (Cu)
Iron (Fe)
Silver (Ag)
Zinc (Zn)
Phosphorus (P)
Silicon (Si)
Aluminum (Al)
Nickel (Ni)
Gold (Au)
Silver (Ag)
Formaldehyde, polymer with aniline,
maleated, cyclized
Phenol, 4,4'-(1-methylethylidene)bis-,
polymer with 2,2'-[(1methylethylidene)bis(4,1phenyleneoxymethylene)]bis[oxirane]
Reaction product: bisphenol-A(epichlorhydrin); epoxy resin (number
average molecular weight <= 700)
Gold (Au)
Tin (Sn)
CASRN
87.70
5.00
5.00
2.00
0.30
94.95
2.35
2.50
0.12
0.08
97.40
1.27
1.28
0.06
88.50
Material
Mass (%) of
total units wt.
45.23
2.58
2.58
1.03
0.15
38.67
0.96
1.02
0.05
0.03
2.51
0.03
0.03
0.00
0.22
67784-74-1
5.50
0.01
25036-25-3
5.50
0.01
25068-38-6
0.50
0.00
7440-57-5
07440-31-5
100.00
100.00
0.45
4.41
if applicable
60676-86-0
Trade secret
Trade secret
29690-82-2
1333-86-4
7440-50-8
7439-89-6
7440-22-4
7440-66-6
7723-14-0
7440-21-3
7429-90-5
7440-02-0
7440-57-5
7440-22-4
Material
Mass (%)
www.bourns.com
CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society
Subpart
Mass of total
wt. (%)
51.58
40.73
2.58
0.25
0.45
4.41
Rev1 - Aug 2015 page 1 of 1
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