CDSOT353-T05_MDS

MATERIAL DECLARATION SHEET
CDSOT353-T05
Material Number
Semiconductor Products
Product Line
2008/07/30
Compliance Date
RoHS Compliant
No.
Construction
Element(subpart)
Yes
Homogeneous
Material
MSL
Material
weight
[mg]
1
Die
Silicon
0.0638
2
Leadframe
A42
1.7607
3
4
Leadframe plating
Golden wire
Ag
Au
0.0611
0.0394
Epoxy
3.872
5
6
7
Molding compound
Epoxy
Plating Tin
84-1
Tin
Total weight
Headquarters Riverside CA
0.026
0.33
1
Homogeneous
Material\
Substances
Si
Alumium
Titanium
Nickel
Silver
Fe
Ni
Mn
Cr(not Cr 6+)
Co
Si
Ag
Au
SiO2
Epoxy Resin
Phenol Resin
Aromatic polyphosphate
C
Ag
epoxy resin
curing agent &
hardener
Tin
CASRN
Materials
Mass %
7440-21-3
7429-90-5
7440-32-6
7440-02-0
7440-22-4
7439-89-6
7440-02-0
7439-96-5
7440-47-3
7440-48-4
7440-21-3
7440-22-4
7440-57-5
60676-86-0
29690-82-2
26834-02-6
71
15
1
5
8
57.65
41
0.6
0.1
0.5
0.15
100
100
87.3
5
5
Material
Mass % of
total unit wt.
0.74
0.16
0.01
0.05
0.08
16.5
11.73
0.17
0.03
0.14
0.05
0.99
0.64
54.93
3.15
3.15
----
2.5
1.57
1333-86-4
7440-22-4
Trade secret
0.2
75
20
0.13
0.31
0.08
Trade secret
5
0.02
7440-31-5
100
5.37
if applicable
Subpart
mass of total
wt. (%)
1.04
28.62
0.99
0.64
62.92
0.42
5.37
6.153
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MATERIAL DECLARATION SHEET
This Document was updated on:
2015/4/27
Important remarks:
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CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society
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