CDSOT563-0502

MATERIAL DECLARATION SHEET
CDSOT563-0502
Material Number
Product Line
Semiconductor Products
2013/8/6
Compliance Date
RoHS Compliant
Yes
3
MSL
No.
Construction
Element(subpart)
Homogeneo
us Material
Material
weight [g]
1
Wafer
Silicon
0.000131
0.000003
2
Lead frame
Copper Alloy
0.000104
0.000007
0.000025
0.000005
0.000001
0.000952
0.000000
0.000175
3
Epoxy
Polymer
0.000096
0.000009
0.000070
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Material
Mass % of
total unit
wt.
Homogeneou
s Material\
Substances
CASRN
if applicable
Materials
Mass %
Silicon
Manganese
7440-21-3
7439-96-5
100.00%
0.30%
0.083%
Nickel
Iron
Tin
Zinc
Lead
Copper
Silver
Si-oxide
Quartz
Epoxy resin
Aromatic
Amine
Epoxy resin
modifier
7440-02-0
7439-89-6
7440-31-5
7440-66-6
7439-92-1
7440-50-8
7740-22-4
9.50%
0.60%
2.30%
0.50%
0.05%
86.74%
0.01%
2.635%
0.166%
0.638%
0.139%
0.014%
24.057%
0.003%
14808-60-7
50.00%
4.420%
Proprietary
27.50%
2.431%
Proprietary
2.50%
0.221%
Proprietary
20.00%
1.768%
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3.309%
Subpart
mass of
total wt. (%)
3.309%
27.734%
8.841%
page 1 of 2
MATERIAL DECLARATION SHEET
4
5
6
Wire
Mold Compound
Plating
Noble metal
0.000152
Aurum
7440-57-5
99.99%
3.839%
0.00000002
other
/
0.01%
0.0004%
0.001737
Silica
60676-86-0
80.00%
43.8696%
0.000217
Epoxy Resin
Trade Secret
10.00%
5.484%
0.000211
Phenolic Resin
Trade Secret
9.70%
5.319%
0.000007
Carbon Black
1333-86-4
0.30%
0.165%
0.000057
Tin
7440-31-5
99.90%
1.438%
0.00000006
Others
/
0.1%
0.001%
Polymer
Plating
Total weight
This Document was updated on:
3.8394%
54.8376%
1.439%
0.003959 g
2013/8/6
Important remarks:
1.
It is the responsibility of the user to verify they are accessing the latest version.
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page 2 of 2
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