CDSOT563-T05C

MATERIAL DECLARATION SHEET
Material Number
CDSOT563-T05C
Product Line
Semiconductor Products
2008/7/29
Compliance Date
RoHS Compliant
YES
Construction
Material
Homogeneous
No. Element(subpa
weight
Material
rt)
[mg]
1
Die Chip
Wafer
1
MSL
0.085
CASRN
Materials Mass
%
Silicon
7440-21-3
99.00
0.084
other
-
1.00
0.001
7439-96-5
0.30
Nickel
7440-02-0
9.50
0.104
Iron
7439-89-6
0.60
0.007
Tin
7440-31-5
2.30
0.025
Zinc
7440-66-6
0.50
0.005
Lead
7439-92-1
0.05
0.001
Copper
7440-50-8
86.74
0.952
Silver
7440-22-4
0.01
0
Silver
7440-22-4
74.50
0.238
TS ref# 10030
15.00
Manganese
2
3
Leadframe
Epoxy
Headquarters Riverside CA
CAC92
Epoxy
1.098
0.32
Material Mass % Subpart mass of
total wt. (%)
of total unit wt.
Homogeneous
Material\
Epoxy resin
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CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society
2.23
0.003
0.048
28.84
8.41
page 1 of 2
MATERIAL DECLARATION SHEET
1,4Butanedioldiglycidyl
ether
Wire
Au
0.076
Compound
Outer
2.171
Aurum
7440-57-5
100.00
0.076
Silica
60676-86-0
80.00
1.737
Trade Secret
10.00
Trade Secret
9.70
1333-86-4
0.30
7440-31-5
100.00
Phenolic Resin
Carbon Black
6
Plating
Sn
0.057
Total weight
3.807
This Document was updated on:
0.024
3.00
Epoxy Resin
5
7.50
TS ref# 10039
Amine
4
2425-79-8
Tin
0.01
1.99
0.217
0.211
57.03
0.007
0.057
1.5
2015/12/14
Important remarks:
1. It is the responsibility of the user to verify they are accessing the latest version.
2. * 7(a)-Lead in high melting temperature type solders (i.e. lead- based alloys containing 85% by weight or more lead)
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CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society
page 2 of 2
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