419AF

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TSOT−23, 6 LEAD
CASE 419AF−01
ISSUE O
DATE 19 DEC 2008
SYMBOL
D
MIN
NOM
A
e
E1
MAX
1.00
A1
0.01
0.05
0.10
A2
0.80
0.87
0.90
b
0.30
c
0.12
E
0.45
0.15
D
2.90 BSC
E
2.80 BSC
E1
1.60 BSC
e
0.95 TYP
0.30
L
L1
0.40
0.20
0.50
0.60 REF
L2
0.25 BSC
0º
θ
8º
TOP VIEW
A2 A
b
q
L
A1
c
L2
L1
SIDE VIEW
END VIEW
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MO-193.
DOCUMENT NUMBER:
STATUS:
98AON34406E
ON SEMICONDUCTOR STANDARD
REFERENCE:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
TSOT−23, 6 LEAD
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON34406E
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION FROM POD #TSOT236−006−01 TO ON
SEMICONDUCTOR. REQ. BY B. BERGMAN.
DATE
19 DEC 2008
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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© Semiconductor Components Industries, LLC, 2008
December, 2008 − Rev. 01O
Case Outline Number:
419AF