D2Pak

REEL TAPING SPECIFICATIONS FOR
SURFACE MOUNT DEVICES - D2-PAK
P
P0
d
P1
E
F
W
B
A
T
c
D
D1
D2
W1
Fig.: Configuration of DIP REEL TAPING
ITEM
Carrier width
SYMBOL
A
SPECIFICATIONS (mm)
10.8 0.1
SPECIFICATIONS (inch)
0.425 0.004
Carrier length
B
16.13
0.1
0.635
0.004
Carrier depth
C
5.21
0.1
0.205
0.004
Sprocket hole
d
1.5 + 0.1/-0
Reel outside diameter
D
329.5
Reel inner diameter
D1
104.95
2.0
4.132
0.079
Feed hole diameter
D2
13.11
0.2
0.516
0.008
Sprocket hole position
E
1.75
0.1
0.069
0.004
Punch hole position
F
11.5
0.1
0.453
0.004
Punch hole pitch
P
16.0
0.1
0.630
0.004
Sprocket hole pitch
P0
4.0
0.1
0.156
0.004
Embossment center
P1
2.0
0.1
0.079
0.004
Tape width
W
Reel width
W1
Tape thickness
T
2.0
24.0+0.3/-0.1
24.44
0.059+0.004/-0
12.974 0.079
0.945+0.012/-0.004
1.0
0.356 0.013
0.962
0.014
0.039
0.0005
Note : Devices are packed in accordance with EIA stand RS-481-A and specifications listed above. Available only for D2-PAK
devices.
Visit http:// www.rectron.com for complete datasheets
E10
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