DV102014 PCap Multi-Touch with 3D GestIC Sensing Dev. Kit User's Guide

DV102014 Projected Capacitive
Multi-Touch with 3D GestIC® Sensing
Development Kit User’s Guide
 2016 Microchip Technology Inc.
DS40001834A
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Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
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Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
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Trademarks
The Microchip name and logo, the Microchip logo, AnyRate,
dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq,
KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST,
MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo,
RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O
are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
ClockWorks, The Embedded Control Solutions Company,
ETHERSYNCH, Hyper Speed Control, HyperLight Load,
IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut,
BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, Dynamic Average Matching, DAM, ECAN,
EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip
Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker,
Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total
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WiperLock, Wireless DNA, and ZENA are trademarks of
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SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
DS40001834A-page 2
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2016, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
ISBN: 978-1-5224-0316-6
 2016 Microchip Technology Inc.
Object of Declaration: DV102014 Projected Capacitive with 3D GestIC® Sensing Development Kit
 2016 Microchip Technology Inc.
DS40001834A-page 3
Digital Power Starter Kit User’s Guide
NOTES:
DS40001834A-page 4
 2016 Microchip Technology Inc.
DV102014 PROJECTED CAPACITIVE MULTI-TOUCH WITH
3D GestIC® SENSING DEVELOPMENT KIT USER’S GUIDE
Table of Contents
Preface ........................................................................................................................... 7
Chapter 1. Overview
1.1 Introduction ................................................................................................... 13
1.2 Working Principle ......................................................................................... 13
Chapter 2. Getting Started
2.1 Setup ............................................................................................................ 16
2.2 Troubleshooting ............................................................................................ 25
Appendix A. Schematics
A.1 2D and 3D Boards ....................................................................................... 27
A.2 Demonstrator Cross-Section Example ......................................................... 28
Worldwide Sales and Service .................................................................................... 31
 2016 Microchip Technology Inc.
DS40001834A-page 5
DV102014 Projected Capacitive Multi-touch with 3D GestIC® Sensing Development Kit User’s Guide
NOTES:
DS40001834A-page 6
 2016 Microchip Technology Inc.
DV102014 PROJECTED CAPACITIVE MULTI-TOUCH WITH
3D GestIC® SENSING DEVELOPMENT KIT USER’S GUIDE
Preface
NOTICE TO CUSTOMERS
All documentation becomes dated, and this manual is no exception. Microchip tools and
documentation are constantly evolving to meet customer needs, so some actual dialogs and/
or tool descriptions may differ from those in this document. Please refer to our website
(www.microchip.com) to obtain the latest documentation available.
Documents are identified with a “DS” number. This number is located on the bottom of each
page, in front of the page number. The numbering convention for the DS number is
“DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the
document.
For the most up-to-date information on development tools, see the MPLAB® IDE online help.
Select the Help menu, and then Topics to open a list of available online help files.
INTRODUCTION
This chapter contains general information that will be useful to know before using the
DV102014 Projected Capacitive Multi-Touch with 3D GestIC® Sensing Development
Kit. Topics discussed in this chapter include:
•
•
•
•
•
•
•
Document Layout
Conventions Used in this Guide
Recommended Reading
The Microchip Website
Development Systems Customer Change Notification Service
Customer Support
Revision History
DOCUMENT LAYOUT
This user’s guide provides important details for using the projected capacitive 2D and
3D GestIC Sensing assembly as quick as possible. The document is organized as
follows:
• Chapter 1. “Overview” – provides details on the kit contents, theory of operation
and the block diagram.
• Chapter 2. “Getting Started” – includes information on the hardware and
software setup, first-time parameterization and overview of the GUI.
• Appendix A. “Schematics” – includes reference material for the schematics,
recommendations for adding a display and details about the PCAP touch screen.
 2016 Microchip Technology Inc.
DS40001834A-page 7
DV102014 Projected Capacitive Multi-Touch with 3D GestIC® Sensing Development Kit User’s Guide
CONVENTIONS USED IN THIS GUIDE
This manual uses the following documentation conventions:
DOCUMENTATION CONVENTIONS
Description
Arial font:
Italic characters
Initial caps
Quotes
Underlined, italic text with
right angle bracket
Bold characters
N‘Rnnnn
Text in angle brackets < >
Courier New font:
Plain Courier New
Represents
Referenced books
Emphasized text
A window
A dialog
A menu selection
A field name in a window or
dialog
A menu path
MPLAB® IDE User’s Guide
...is the only compiler...
the Output window
the Settings dialog
select Enable Programmer
“Save project before build”
A dialog button
A tab
A number in verilog format,
where N is the total number of
digits, R is the radix and n is a
digit.
A key on the keyboard
Click OK
Click the Power tab
4‘b0010, 2‘hF1
Italic Courier New
Sample source code
Filenames
File paths
Keywords
Command-line options
Bit values
Constants
A variable argument
Square brackets [ ]
Optional arguments
Curly brackets and pipe
character: { | }
Ellipses...
Choice of mutually exclusive
arguments; an OR selection
Replaces repeated text
Represents code supplied by
user
DS40001834A-page 8
Examples
File>Save
Press <Enter>, <F1>
#define START
autoexec.bat
c:\mcc18\h
_asm, _endasm, static
-Opa+, -Opa0, 1
0xFF, ‘A’
file.o, where file can be
any valid filename
mcc18 [options] file
[options]
errorlevel {0|1}
var_name [,
var_name...]
void main (void)
{ ...
}
 2016 Microchip Technology Inc.
Preface
WARRANTY REGISTRATION
Please complete the enclosed Warranty Registration Card and mail it promptly.
Sending in the Warranty Registration Card entitles users to receive new product
updates. Interim software releases are available at the Microchip website.
RECOMMENDED READING
This user’s guide describes how to configure the DV102014 Projected Capacitive with 3D
GestIC assembly. Other useful documents are listed below. The following documents are
available and recommended as supplemental reference resources:
MTCH6303 Projected Capacitive Touch Controller Data Sheet (DS40001803)
This data sheet provides specific information about the features and adjustable
parameters of the MTCH6303, useful for configuring and tuning your application.
MGC3030/3130 3D Tracking and Gesture Controller Data Sheet
(DS40001667)
This document provides specific information about the features and adjustable
parameters of the MGC3130, useful for configuring and tuning your application.
MTCH650/2 Programmable Voltage Boost with Built-in Level Shifters and
Serial Interface with Output Enable (DS40001749)
This document provides information to configure the MTCH652 in your application.
For the 2D-3D AUREA Utility software application and more information about
Microchip’s human interface portfolio, visit:
www.microchip.com/DV102014.
To obtain any of Microchip’s documents, visit the Microchip website at
www.microchip.com.
 2016 Microchip Technology Inc.
DS40001834A-page 9
DV102014 Projected Capacitive Multi-Touch with 3D GestIC® Sensing Development Kit User’s Guide
THE MICROCHIP WEBSITE
Microchip provides online support via our website at www.microchip.com. This website
is used as a means to make files and information easily available to customers.
Accessible by using your favorite Internet browser, the website contains the following
information:
• Product Support – Data sheets and errata, application notes and sample
programs, design resources, user’s guides and hardware support documents,
latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQs), technical
support requests, online discussion groups, Microchip consultant program
member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip
press releases, listing of seminars and events, listings of Microchip sales offices,
distributors and factory representatives
DEVELOPMENT SYSTEMS CUSTOMER CHANGE NOTIFICATION SERVICE
Microchip’s customer notification service helps keep customers current on Microchip
products. Subscribers will receive e-mail notification whenever there are changes,
updates, revisions or errata related to a specified product family or development tool of
interest.
To register, access the Microchip website at www.microchip.com, click on Customer
Change Notification and follow the registration instructions.
The Development Systems product group categories are:
• Compilers – The latest information on Microchip C compilers, assemblers, linkers
and other language tools. These include all MPLAB C compilers; all MPLAB
assemblers (including MPASM™ assembler); all MPLAB linkers (including
MPLINK™ object linker); and all MPLAB librarians (including MPLIB™ object
librarian).
• Emulators – The latest information on Microchip in-circuit emulators.This
includes the MPLAB REAL ICE™ and MPLAB ICE 2000 in-circuit emulators.
• In-Circuit Debuggers – The latest information on the Microchip in-circuit
debuggers. This includes MPLAB ICD 3 in-circuit debuggers and PICkit™ 3
debug express.
• MPLAB® IDE – The latest information on Microchip MPLAB IDE, the Windows®
Integrated Development Environment for development systems tools. This list is
focused on the MPLAB IDE, MPLAB IDE Project Manager, MPLAB Editor and
MPLAB SIM simulator, as well as general editing and debugging features.
• Programmers – The latest information on Microchip programmers. These include
production programmers such as MPLAB REAL ICE in-circuit emulator, MPLAB
ICD 3 in-circuit debugger and MPLAB PM3 device programmers. Also included
are non-production development programmers such as PICSTART® Plus and
PICkit 2 and 3.
DS40001834A-page 10
 2016 Microchip Technology Inc.
Preface
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers should contact their distributor, representative or field application engineer
(FAE) for support. Local sales offices are also available to help customers. A listing of
sales offices and locations is included in the back of this document.
Technical support is available through the website at:
http://www.microchip.com/support.
REVISION HISTORY
Revision A (February 2016)
Initial release of this document.
 2016 Microchip Technology Inc.
DS40001834A-page 11
DV102014 Projected Capacitive Multi-Touch with 3D GestIC® Sensing Development Kit User’s Guide
NOTES:
DS40001834A-page 12
 2016 Microchip Technology Inc.
DV102014 PROJECTED CAPACITIVE MULTI-TOUCH WITH
3D GestIC® SENSING DEVELOPMENT KIT USER’S GUIDE
Chapter 1. Overview
1.1
INTRODUCTION
Microchip’s DV102014 development kit builds a complete reference system for
evaluation and design of 2D multi-touch and 3D gesture human-machine interfaces.
This combination enables user command input with multi-touch detection on surfaces
as well as natural hand movements in free space.
The kit content is described below:
• 2D/3D Electronics Board with Microchip parts:
- MTCH6303 2D PCAP (Projected Capacitive) controller
- MGC3130 3D GestIC® controller
- MTCH652 high-voltage driver
• 2D/3D Sensor Module
- 8" PCAP touch screen
- 3D Printed Circuit Board (PCB) electrodes
• Micro-USB cable
1.2
WORKING PRINCIPLE
This combined 2D/3D technology solution uses Microchip’s MTCH6303 2D PCAP
Controller, the MGC3130 3D GestIC Controller, and the MTCH652 High-Voltage
Driver. The system works in Time-Multiplex mode that dynamically detects 2D and 3D
operations.
FIGURE 1-1:
BLOCK DIAGRAM
2D RX
I2C
TS
MCLR
Mode 2D3D
Sync (1 ms)
USB
I2C
MGC3130
MTCH6303
3D RX
3D: North
3D TX
PWM
SPI
OE
2D3D TX
OSCIN
MTCH652
3D: West
2D TX
Touchscreen
3D: East
HOST
3D: South
 2016 Microchip Technology Inc.
DS40001834A-page 13
DV102014 Projected Capacitive Multi-Touch with 3D GestIC® Sensing Development Kit User’s Guide
NOTES:
DS40001834A-page 14
 2016 Microchip Technology Inc.
DV102014 PROJECTED CAPACITIVE MULTI-TOUCH WITH
3D GestIC® SENSING DEVELOPMENT KIT USER’S GUIDE
Chapter 2. Getting Started
Follow the following steps to get started:
1. Download and install the 2D/3D design-in utility AUREA 2.x to your Windows®
7/8/10 PC from www.microchip.com/DV102014.
2. Connect the micro-USB cable to the 2D/3D Electronics Board and your PC, as
shown in Figure 2-1.
FIGURE 2-1:
BACKSIDE VIEW
3. Carefully turn the assembled hardware over and lay on a flat table surface. The
six stand-offs support the hardware, creating a flat level touch surface.
FIGURE 2-2:
 2016 Microchip Technology Inc.
TOPSIDE VIEW
DS40001834A-page 15
DV102014 Projected Capacitive Multi-Touch with 3D GestIC® Sensing Development Kit User’s Guide
2.1
SETUP
1. Launch the Aurea 2.x Software Utility, (note the green check on the USB symbol
to indicate a successful connection
).
2. Navigate to the Setup tab and select 3D Parameterization (see Figure 2-3).
FIGURE 2-3:
DS40001834A-page 16
SETUP TAB
 2016 Microchip Technology Inc.
Getting Started
3. Select Start Autoparameterization (this step automatically optimizes the settings
for the development kit by pushing the Autoparameterization button).
FIGURE 2-4:
AUTOPARAMETERIZE
 2016 Microchip Technology Inc.
DS40001834A-page 17
DV102014 Projected Capacitive Multi-Touch with 3D GestIC® Sensing Development Kit User’s Guide
4. The signals can be noticed in Figure 2-5 coming together and running through
the center of the graph on the sample point (the dotted vertical line on the right
side).
5. Once this happens, click Flash to save the new automatically-tuned parameters.
FIGURE 2-5:
DS40001834A-page 18
FLASH NEW SETTINGS
 2016 Microchip Technology Inc.
Getting Started
6. The Flash button will display a green check mark; exit this screen using the Exit
button.
FIGURE 2-6:
EXIT AUTOPARAMETERIZATION
 2016 Microchip Technology Inc.
DS40001834A-page 19
DV102014 Projected Capacitive Multi-Touch with 3D GestIC® Sensing Development Kit User’s Guide
7. Navigate to the Colibri Suite tab to demonstrate 2D and 3D capabilities, as
briefly described below. See the utility documentation for a more detailed introduction to the various built-in features.
FIGURE 2-7:
DS40001834A-page 20
COLIBRI SUITE TAB
 2016 Microchip Technology Inc.
Getting Started
8. The Colibri Suite tab allows the user to turn on/off the 2D and 3D gesture
reporting. These controls are found on the left side of the program and help
simulate the conditions and features of the user’s application. Gestures that are
performed by the user are seen in the Gesture output window in the bottom right
corner.
FIGURE 2-8:
COLIBRI SUITE – 2D AND 3D GESTURES
 2016 Microchip Technology Inc.
DS40001834A-page 21
DV102014 Projected Capacitive Multi-Touch with 3D GestIC® Sensing Development Kit User’s Guide
9. Real-time position data is provided in the other three windows. The Auto-default
setting presents the real-time 2D or 3D data transmitted by the electronics.
Selecting 2D or 3D will limit the output window visualization to the desired setting.
FIGURE 2-9:
DS40001834A-page 22
COLIBRI SUITE – 2D AND 3D DATA
 2016 Microchip Technology Inc.
Getting Started
10. Use your finger(s) to draw a circle on the touch screen surface area inside the
black borders and verify that the points in the top center 2D Measurement
window follow your circular motion.
FIGURE 2-10:
COLIBRI SUITE – 2D TEST
 2016 Microchip Technology Inc.
DS40001834A-page 23
DV102014 Projected Capacitive Multi-Touch with 3D GestIC® Sensing Development Kit User’s Guide
11. Use your hand to swipe left to right over the 2D/3D sensor module. Verify that
the red gesture arrows follow your movements in the bottom right Gestures
window. The hand distance should be ~10 cm (up to 20 cm) above the sensor.
Always check that the desired gesture is actually activated in the 2D and/or 3D
overview on the left side of the screen.
FIGURE 2-11:
DS40001834A-page 24
COLIBRI SUITE – 3D TEST
 2016 Microchip Technology Inc.
Getting Started
2.2
TROUBLESHOOTING
• In case of problems, make sure the 2D/3D electronics board connection is secure;
a loose connection may result in poor performance (see Figure 2-12).
• Check the AUREA HTML documentation for the latest news on the available code
updates for the MTCH6303 and MGC3130 devices.
FIGURE 2-12:
TROUBLESHOOTING – CHECK CONNECTIONS
• References: additional information about Microchip’s 2D and 3D electronic
solutions may be found on the Microchip website at:
- MTCH6303 – 2D PCAP touch controller www.microchip.com/mtch6303
- MGC3130 – 3D GestIC® controller www.microchip.com/mgc3130
- MTCH652 – High-voltage driver www.microchip.com/mtch652
 2016 Microchip Technology Inc.
DS40001834A-page 25
DV102014 Projected Capacitive Multi-Touch with 3D GestIC® Sensing Development Kit User’s Guide
NOTES:
DS40001834A-page 26
 2016 Microchip Technology Inc.
DV102014 PROJECTED CAPACITIVE MULTI-TOUCH WITH
3D GestIC® SENSING DEVELOPMENT KIT USER’S GUIDE
Appendix A. Schematics
A.1
2D AND 3D BOARDS
FIGURE A-1:
2D/3D ELECTRONICS BOARD – DIMENSIONS (mm)
Full schematics, BOM and gerbers are available on the DV102014 Development Kit
website www.microchip.com/DV102014.
 2016 Microchip Technology Inc.
DS40001834A-page 27
Schematics
FIGURE A-2:
3D PCB ELECTRODES – DIMENSIONS (mm)
The 3D electrode consists of 2
parts:
a) inner frame = electrodes
b) outer frame = mounting frame
* Optional feature:
12 break-away points for
removing mounting frame
A.2
DEMONSTRATOR CROSS-SECTION EXAMPLE
When building up a demo, the following mechanical setup can be used:
FIGURE A-3:
MECHANICAL SETUP WITH DISPLAY
2-component
Epoxy glue
Double
adhesive
GIC-El
Coverglass
Touchpanel-Stackup
GIC-El
Display
PCB
Full schematics, BOM and gerbers are available on the DV102014 Development Kit
website www.microchip.com/DV102014.
DS40001834A-page 28
 2016 Microchip Technology Inc.
DV102014 SCHEMATIC
USB Connector + Power Supply
Touchpanel Interface
Series Resistors for Touch-RX-Channels
VBUS
6
5
4
R1
10R 0603 5%
VBUS054B-HS3-GS08
10R 0603 5%
R3
VIN
C1
VOUT
GND
2
1
10uF
25V
0805
D-
D1
VDD
C2
GND
GND
GND
LD1
47uF
6.3V
0805
D+
1
2
3
USB MICRO-AB Female
MCP1703T-3302E/CB
3
VUSB
FB1
J2
U1
FERRITE 12A 0.05R SMD 0603
1
VBUS
2
D3
D+
4
ID
5
GND
GND
BLUE
PGC/RX15
PGD/RX16
RX17
RX18
R4
1.8k
0603
1%
4
3
2
1
5
6
7
8
SRX15
SRX16
SRX17
SRX18
RX19
RX20
RX21
RX22
GND
4
3
2
1
5
6
7
8
SRX19
SRX20
SRX21
SRX22
Touch Controller
U2
5
6
7
8
SRX23
SRX24
SRX25
SRX26
VDD
7
10k 0603 5%
VUSB
34
VDD
C3
0.1uF
25V
0603
35
VDD
MCLR
VUSB3V3
57
VDD
26
VDD
38
VDD
10
VDD
GND
19
20
AVDD
AVSS
9
VSS
25
VSS
41
VSS
C4
10uF 25V
0805
56
65
16
15
14
13
12
11
17
18
21
22
23
24
27
28
29
30
PGD/RX16
PGC/RX15
RX14
RX13
RX12
RX11
RX17
RX18
RX19
RX20
RX21
RX22
RX23
RX24
RX25
RX26
40
OSC2/CLKO/RC15
48
SOSCO/RPC14/T1CK/RC14
47
SOSCI/RPC13/RC13
39
OSC1/CLKI/RC12
OSC2
COMM_SEL
MGC_Sync
OSC1
PGED1/VREF+/CVREF+/AN0/RPB0/PMA6/RB0
PGEC1/VREF-/CVREF-/AN1/RPB1/CTED12/RB1
PGEC3/AN2/C2INB/RPB2/CTED13/RB2
PGED3/AN3/C2INA/RPB3/RB3
AN4/C1INB/RB4
AN5/C1INA/RPB5/VBUSON/RB5
PGEC2/AN6/RPB6/RB6
PGED2/AN7/RPB7/CTED3/RB7
AN8/RPB8/CTED10/RB8
AN9/RPB9/CTED4/PMA7/RB9
TMS/CVREFOUT/AN10/RPB10/CTED11/PMA13/RB10
TDO/AN11/PMA12/RB11
TCK/AN12/PMA11/RB12
TDI/AN13/PMA10/RB13
AN14/RPB14/CTED5/PMA1/RB14
AN15/RPB15/OCFB/CTED6/PMA0/RB15
VBUS
VCAP
Thermal Pad
1k
0804
5%
37
D+
36
D-
UART_TX
UART_RX
RPD11/PMCS1/RD11
RPD10/SCL1/PMCS2/RD10
RPD9/SDA1/RD9
RPD8/RTCC/RD8
RD7
RD6
RPD5/PMRD/RD5
RPD4/PMWR/RD4
AN26/RPD3/RD3
AN25/RPD2/SCK1/RD2
AN24/RPD1/RD1
RPD0/INT0/RD0
58
RPF0/RF0
59
TRCLK/RPF1/RF1
33
USBID/RPF3/RF3
31
RPF4/SDA2/PMA9/RF4
32
RPF5/SCL2/PMA8/RF5
SDA
SCL
RX10
RX9
RX8
RX7
AN27/PMD7/RE7
AN23/PMD6/RE6
AN22/RPE5/PMD5/RE5
AN21/PMD4/RE4
TRD3/RPE3/CTPLS/PMD3/RE3
TRD2/AN20/PMD2/RE2
TRD1/PMD1/RE1
TRD0/PMD0/RE0
8
AN19/C2INC/RPG9/PMA2/RG9
6
AN18/C2IND/RPG8/PMA3/RG8
5
AN17/C1INC/RPG7/PMA4/RG7
4
AN16/C1IND/RPG6/SCK2/PMA5/RG6
45
44
43
42
55
54
53
52
51
50
49
46
3
2
1
64
63
62
61
60
RX8
RX9
RX10
4
3
2
1
RX11
RX12
RX13
RX14
4
3
2
1
5
6
7
8
SRX4
SRX5
SRX6
SRX7
5
6
7
8
SRX8
SRX9
SRX10
5
6
7
8
SRX11
SRX12
SRX13
SRX14
SRX26
SRX25
SRX24
SRX23
SRX22
SRX21
SRX20
SRX19
SRX18
SRX17
SRX16
SRX15
SRX14
SRX13
SRX12
SRX11
SRX10
SRX9
SRX8
SRX7
SRX6
SRX5
SRX4
SRX3
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
TX0
TX1
TX2
TX3
TX4
TX5
TX6
TX7
TX8
TX9
TX10
TX11
TX12
TX13
TX14
TX15
TX16
TX17
TX18
SRX0
SRX1
SRX2
X1
FFC/FPC 50P Female
C8
18pF
50V
0603
18pF
50V
0603
GND
GND
VDD
VDD
25
VDD
24
VSS
L1
3
2.2uH
BOOST_OE1
BOOST_LE1
BOOST_DIN
BOOST_CLK
BOOST_PWM
GND
0603
R13 DNP
0R
26
29
GND
R12
0R
GND
0.1uF
25V
0603
1uF
50V
0805
VUSB
VPP
C5
C6
C7
GND
MNT
I2C Port
PCAP Voltage Booster
BOOST_DIN
MGC_SCL
MGC_SDA
MGC_TS
BOOST_LE2
BOOST_LE1
BOOST_OE2
BOOST_OE1
RX1
BOOST_CLK
RX0
BOOST_PWM
GND
R11
8MHz
D+
D-
GND
4
3
2
1
SRX0
SRX1
SRX2
SRX3
R9
R10
MCLR
R7
4
3
2
1
RX4
RX5
RX6
RX7
GND
5
6
7
8
R6
R8
RX23
RX24
RX25
RX26
4
3
2
1
R2
R5
GND
RX0
RX1
RX2
RX3
0603
EX_PAD
LC
11
OE
12
LE
13
DIN
14
CLK
10
OSCIN
100k
0603
5%
C10
0.1uF
25V
0603
GND
OUT00
OUT01
OUT02
OUT03
OUT04
OUT05
OUT06
OUT07
OUT08
OUT09
OUT10
OUT11
OUT12
OUT13
OUT14
OUT15
OUT16
OUT17
OUT18
R14
C9
RX6
RX5
RX4
RX3
IRQ
RX2
MGC_MCLR
MGC_Mode
VPP
1uF
50V
0805
J3
IRQ
VDD
TX16
TX15
TX14
TX13
TX12
TX11
TX10
TX9
TX8
TX7
TX6
TX5
TX4
TX3
TX2
TX1
TX0
TX18
TX17
SDA
SCL
MCLR
GND
1
2
3
4
5
6
HDR-2.54 Male 1x6
ICSPŒ
J4
MCLR
VDD
PGD/RX16
PGC/RX15
GND
U3
MTCH652 QFN-28
GND
GND
7
6
5
4
2
1
28
27
23
22
21
20
19
18
17
16
15
9
8
1
2
3
4
5
6
DNP
HDR-1.27 Male 1x6
GestICElectrodeConnector
C11
12pF
GIC_RX0
MTCH6303-I/RG
R16
MOV1
GND
5V
0402
MOV2
J7
5V
0402
1 2 3 4 5
J1
0
 2016 Microchip Technology Inc.
FIGURE A-4:
10k
GestICŠChipandElectrodeConnector
C20
BOOST_OE1
J6
12pF
VDD
MGC_MCLR
keep PIC in Reset, when connecting with I2C bridge (J4: MCLR-GND)
VDD_GestIC
C13
0.1uF
25V
0603
C14
C15
0.1uF
25V
0603
0.1uF
25V
0603
C16
0.1uF
25V
0603
VDD
C17
0.1uF
25V
0603
R20
1.8k
0603
1%
J9 DNP
Pin 10,26,38,57,19
1
2
3
4
5
6
GND
R21
1.8k
0603
1%
R22
10k
0603
5%
R32
R23
24
28
VDD_GestIC
0R
0603
0.1uF
25V
0603
C12
10k
0603
5% MGC_TS
HDR-1.27 Male 1x6
C18
C19 VDD_GestIC
4.7uF
10V
0603
4.7uF
10V
0603
*NO STUFF*
20
SI0
21
SI1
22
SI2
23
SI3
2
VINDS
1
VCAPS
12
EIO0
13
EIO1
14
EIO2
19
EIO3
16
NC
17
NC
18
NC
26
NC
NC3
NC2
NC1
GND
25
4
RX0
5
RX1
6
RX2
7
RX3
8
RX4
IS2
15
10k
R18 DNP
0R 0603
GIC_RX0
GIC_RX1
GIC_RX2
GIC_RX3
MGC_SDA
MGC_SCL
SI2
MGC_Sync
R19
0R 0603
C21
GND
12pF
GIC_RX2
MGC_TS
EIO1
MGC_Mode
EIO3
10k
12pF
IS2
BOOST_LE2
TP2
BOOST_CLK
TP3
BOOST_LE1
TP4
MGC_Sync
TP5
BOOST_OE1
TP6
MGC_Mode
SI2
TP8
TP9
BOOST_PWM
TP10
TP11
GND
GND
VDD
EIO1
R30
IS2
10k
0603
5%
R28 DNP
0R
0603
MOV3
GestIC Interface Selection
10k
0603
5%
GND
COMM_SEL
5V
0402
GND
5V
0402
MOV5
5V
0402
GND
DNP: Do Not Populate
GND
R29
0R
0603
MOV4
R31
J8, J10, J11: Improve mechanical stability
COMM_SEL:
J8
GND -> USB communciation
VDD -> I2C communciation
3
2
1
3
2
1
HDR-2.54 Female 1x3
HDR-2.54 Female 1x3
J10
J11
1 2
DS40001834A-page 29
BOOST_OE2
TP1
TP12
R25
10k
Communication Select
TP7
R24
C22
GIC_RX3
Test Points
EIO3
R17
HDR-2.54 Female 1x2
Schematics
GND
GND
TXD
VDD
9
VCAPA
11
VCAPD
GND
MGC_SDA
MGC_SCL
MGC_MCLR
MCLR
27
VSS1
3
VSS2
10
VSS3
29
EPAD
GIC_RX1
33k
0603
5%
U4
MGC3130
GestICŠInterface
1 2 3 4 5
R15
PICŠDecouplingCaps
DNP
2D 8” PROJECTED CAPACITIVE TOUCH PANEL – PART NUMBER TXP080BA02
 2016 Microchip Technology Inc.
The downloadable PDF is available on the DV102014 development kit website www.microchip.com/DV102014.
DV102014 Projected Capacitive Multi-touch with 3D GestIC® Sensing Development Kit User’s Guide
DS40001834A-page 30
FIGURE A-5:
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Germany - Dusseldorf
Tel: 49-2129-3766400
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Hong Kong
Tel: 852-2943-5100
Fax: 852-2401-3431
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
Austin, TX
Tel: 512-257-3370
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
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Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Canada - Toronto
Tel: 905-673-0699
Fax: 905-673-6509
China - Dongguan
Tel: 86-769-8702-9880
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
India - Pune
Tel: 91-20-3019-1500
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Kaohsiung
Tel: 886-7-213-7828
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Germany - Karlsruhe
Tel: 49-721-625370
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Venice
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Poland - Warsaw
Tel: 48-22-3325737
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
07/14/15
 2016 Microchip Technology Inc.
DS40001834A-page 31
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