Presentation, Click to open in new window

A 1mm2 Two Stage LNA and
SP2T Switch RFIC FEM for
WLAN 802.11a Application
January 18, 2012
Lei Ma, Cody Hale, Bob Baeten
Motivation / Outline
Motivation:
• Low Cost, Low NF LNA for high band WLAN 4.9-5.85GHz
• Highly integrated MMIC single chip solution for PA/LNA/Switch
Outline:
• pHEMT device Noise Figure FOM
• RFMD E/D-mode pHEMT Device Noise Figure Characteristics
• RF5540 LNA design and data
• Summary
pHEMT LNA Noise Figure FOM - Fukui equations
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Reference:
Optimal noise figure of microwave GaAs MESFET's
Fukui, H.;
Electron Devices, IEEE Transactions
Volume 26, Issue 7, Jul 1979 Page(s):1032 - 1037
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Rs 
NF at 5GHz
Scaling Rule based Prediction
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More fingers reduces Gate resistance
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Ft does not scale due to cancellation of
Cgs and Gm scale, so Noise Figure
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Assuming Normalized Gmn, Rgn, Rsn does
Not change, reducing UW will reduce noise figure
• Normalized Rg should be only dependent on gate metal resistivity, Gate length and
gate thickness.
• Due to layout difference, there should also be additional routing resistance
(gate access resistance) added to gate resistance.
Device Noise Pull
E-Mode device Noise parameters 3V 40mA/mm 5.4GHz
Wg
S11*
Sopt & S11*
8x35
8x30
8x25
8x20
8x15
8x10
6x40
6x30
6x25
4x40
4x35
4x30
Gopt
freq (5.400GHz to 5.400GHz)
• Lower NF for smaller UW as expected
• Trade off between NF and noise match inductance
E-Mode 8x25um device Noise Parameters Vds=3.5V
5mA/mm
10mA/mm
15mA/mm
20mA/mm
25mA/mm
30mA/mm
40mA/mm
60mA/mm
80mA/mm
Raw
symbol
smoothed
line
E-Mode 8x25um NFmin vs. Vds and Idn
Idn = Id/gate width
Normalized drain current
NFmin is flat over Vds
And increases slightly
at higher Idn
Input Noise Match
Width
(um)
L (nH)
R(Ohm)
Q
150x150 3.75
10
1.37
5.15
9.03
310x200
2.5
22
1.94
4.22
15.8
310x200
2.5
25
1.67
3.94
14.6
310x190 2.25
22
1.61
3.08
17.9
310x220
2.5
25
1.76
3.3
18
310x310 1.75
28
1.50
2.16
23.9
310x330 1.75
29
1.56
2.24
23.8
Inductor
size
N
NF performance for input match with different Q
5GHz
• NF improve with larger first
stage FET from 80um to
200um
• NF improve with higher Q
input match
RF5540 Circuit Micro-photograph 916um x 950um
SP2T
Bypass switch
• Full die Momentum
simulation is necessary to
predict RF performance
• Sensitivity of Coupling for
critical RF path esp. Noise
match has to be considered
Stage 1
Bias network
Stage 2
• Stand alone LNA with
NF=1.1dB is possible with
less than half of the die size
RF5540 NF performance
• Note: this is one of the best performing part to date at this frequency
RF5540 RX LNA mode S parameters
Gain
IRL
ORL
RF5540 RX Bypass mode S parameters
Gain
ORL
IRL
0
-10
-10
-20
-20
0
1
2
3
4
5
freq, GHz
6
7
8
9
RX BYPASS IRL and ORL (dB)
RX BYPASS GAIN (dB)
0
RF5540 TX mode S parameters
0
0
-1
-20
-30
-2
-40
0
1
2
3
4
5
freq, GHz
6
7
8
9
TX IRL and ORL and ISO (dB)
-10
TX IL (dB)
IL
IRL
ORL
ISO
RFMD and Competitor’s LNA in high band WLAN 4.9-5.85GHz
• RF5540 has over 1dB loss on SP2T switch, so the NF of the LNA is 1.1dB
Reference:
Ref [1]: TQL5000, LNA for 5GHz UNI I Band 802.11a Systems. Triquint Semiconductor data sheet, www. Triquint.com
Ref [2]: ALM-2812, Dual-Band(2.4-2.5)GHz&(4.9-6)GHz WLAN Low-Noise Amplifier, Avago Technologies data sheet,
www.avagotech.com
Ref [3]: MGA-675T6, Low Noise Amplifier with Shutdown Mode in Low Profile Package for 4.9-6GHz Application, Avago
Technologies data sheet, www. avagotech.com
Ref [4]: SKY65404-21, 5GHz Low Noise Amplifier, Skyworks Solutions Inc data sheet, www.skyworksinc.com
RF5540 block diagram
Summary/Conclusion
• Competitive NF performance is achieved in RFMD’s low cost E/D-mode
pHEMT process using high Q and narrow band matching at WLAN high
band 4.9-5.85GHz
• The LNA NF at 5GHz is close to the limit of RFMD’s E-mode pHEMT
device capability. (1.1dB RF5540 excluding switch loss vs. 1.0dB
8x25um)
• High Q inductor has to be used for lower loss and higher NF.
• Stand alone LNA with 1dB NF is possible with less than half of the size of
RF5540.
• Lower noise figure 0.5dB at 5GHz is possible to achieve but at a higher
processing cost than is acceptable for handset BOMs (RFMD E/D pHEMT
vs. RFMD FSS25)
• RFMD E/D-mode pHEMT process provide a technology for highly
integrated RFIC solution with PA/LNA/Switch on the same die.
Acknowledgement
• Fab Device engineering: John Fendrich, Dain Miller
• Cooperate Engineering: Bill Clausen, Joe Gering