INTERSIL ISL9001AIRCZ-T

ISL9001A
®
Data Sheet
January 18, 2007
LDO with Low ISUPPLY, High PSRR
Features
ISL9001A is a high performance Low Dropout linear
regulator capable of sourcing 300mA current. It has a low
standby current and high-PSRR and is stable with output
capacitance of 1μF to 10μF with ESR of up to 200mΩ.
• 300mA high performance LDO
The ISL9001A has a very high PSRR of 90dB and output
noise less than 30μVRMS. A reference bypass pin allows
connection of a noise-filtering capacitor for low-noise and
high-PSRR applications. When coupled with a no load
quiescent current of 25μA (typical), and 0.1μA shutdown
current, the ISL9001A is an ideal choice for portable wireless
equipment.
The ISL9001A provides a PGOOD signal with delay time
programmable through an external capacitor.
FN6433.0
• Excellent transient response to large current steps
• Excellent load regulation: <0.1% voltage change across
full range of load current
• High PSRR: 90dB @ 1kHz
• Wide input voltage capability: 2.3V to 6.5V
• Extremely low quiescent current: 25μA
• Low dropout voltage: typically 200mV @ 300mA
• Low output noise: typically 30μVRMS @ 100µA (1.5V)
• Stable with 1μF to 10μF ceramic capacitors
• Soft-start to limit input current surge during enable
Several different fixed voltage outputs are standard. Other
output voltage options for the LDO are available on request
and range from 1.3V to 3.6V.
• Current limit and overheat protection
Pinout
• Tiny 2mmx3mm 8 Ld DFN package
• Delayed POR, programmable with external capacitor
• ±1.8% accuracy over all operating conditions
• -40°C to +85°C operating temperature range
ISL9001A
(8 LD DFN)
TOP VIEW
• Pb-free plus anneal available (RoHS compliant)
Applications
VIN
1
8 VO
EN
2
7 POR
CBYP
3
6 NC
• Portable instruments, MP3 players
CPOR
4
5 GND
• Handheld devices including medical handhelds
• PDAs, cell phones and smart phones
Ordering Information
PART NUMBER
(Note 1)
ISL9001AIRBZ-T
PART
MARKING
EBB
VO VOLTAGE (V)
(Note 2)
TEMP
RANGE (°C)
3.3
-40 to +85
PACKAGE
(Pb-free)
PKG.
DWG. #
8 Ld DFN 2x3 Tape and Reel
L8.2x3
ISL9001AIRCZ-T
EBC
3.0
-40 to +85
8 Ld DFN 2x3 Tape and Reel
L8.2x3
ISL9001AIRFZ-T
EBD
2.9
-40 to +85
8 Ld DFN 2x3 Tape and Reel
L8.2x3
ISL9001AIRJZ-T
EBE
2.85
-40 to +85
8 Ld DFN 2x3 Tape and Reel
L8.2x3
ISL9001AIRKZ-T
EBF
2.8
-40 to +85
8 Ld DFN 2x3 Tape and Reel
L8.2x3
ISL9001AIRLZ-T
EBG
2.6
-40 to +85
8 Ld DFN 2x3 Tape and Reel
L8.2x3
ISL9001AIRMZ-T
EBH
2.5
-40 to +85
8 Ld DFN 2x3 Tape and Reel
L8.2x3
ISL9001AIRNZ-T
EBJ
1.8
-40 to +85
8 Ld DFN 2x3 Tape and Reel
L8.2x3
ISL9001AIRRZ-T
EBK
1.5
-40 to +85
8 Ld DFN 2x3 Tape and Reel
L8.2x3
NOTES:
1. Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are
MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
2. For other output voltages, contact Intersil Marketing.
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2007. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
ISL9001A
Absolute Maximum Ratings
Thermal Information
Supply Voltage (VIN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7.1V
All Other Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to (VIN+0.3)V
ESD Rating
Human Body Model (Per MIL-STD-883 Method 3015.7) . . .2500V
Machine Model (Per EIAJ ED-4701 Method C-111) . . . . . . . .200V
Thermal Resistance (Notes 3, 4)
θJA (°C/W)
θJC (°C/W)
8 Ld DFN 2x3 Package . . . . . . . . . . . .
69
10
Junction Temperature Range . . . . . . . . . . . . . . . . .-40°C to +125°C
Operating Temperature Range . . . . . . . . . . . . . . . . .-40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . . . . . . .-65°C to +150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . +300°C
Recommended Operating Conditions
Ambient Temperature Range (TA) . . . . . . . . . . . . . . .-40°C to +85°C
Supply Voltage (VIN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.3 to 6.5V
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
3. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
4. θJC, “case temperature” location is at the center of the exposed metal pad on the package underside. See Tech Brief TB379.
Electrical Specifications
Unless otherwise noted, all parameters are guaranteed over the operational supply voltage and temperature
range of the device as follows: TA = -40°C to +85°C; VIN = (VO+0.5V) to 5.5V with a minimum VIN of 2.3V;
CIN = 1µF; CO = 1µF;
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
6.5
V
DC CHARACTERISTICS
Supply Voltage
VIN
Ground Current
2.3
Quiescent condition: IO = 0μA
IDD
LDO active
25
32
μA
LDO disabled @ +25°C
0.1
1.0
μA
Shutdown Current
IDDS
UVLO Threshold
VUV+
1.9
2.1
2.3
V
VUV-
1.6
1.8
2.0
V
Regulation Voltage Accuracy
Maximum Output Current
IMAX
Internal Current Limit
ILIM
Dropout Voltage (Note 5)
Thermal Shutdown Temperature
Initial accuracy at VIN = VO+0.5V, IO = 10mA, TJ = +25°C
-0.7
+0.7
%
VIN = VO+0.5V to 5.5V, IO = 10μA to 300mA, TJ = +25°C
-0.8
+0.8
%
VIN = VO+0.5V to 5.5V, IO = 10μA to 300mA,
TJ = -40°C to +125°C
-1.8
+1.8
%
Continuous
300
350
mA
475
600
mA
VDO1
IO = 300mA; VO < 2.5V
300
500
mV
VDO2
IO = 300mA; 2.5V ≤ VO ≤ 2.8V
250
400
mV
VDO3
IO = 300mA; VO > 2.8V
200
325
mV
TSD+
145
°C
TSD-
110
°C
@ 1kHz
90
dB
@ 10kHz
70
dB
@ 100kHz
50
dB
IO = 100µA, VO = 1.5V, TA = +25°C, CBYP = 0.1µF
BW = 10Hz to 100kHz
30
µVRMS
AC CHARACTERISTICS
Ripple Rejection
IO = 10mA, VIN = 2.8V (min), VO = 1.8V, CBYP = 0.1µF
Output Noise Voltage
2
FN6433.0
January 18, 2007
ISL9001A
Electrical Specifications
Unless otherwise noted, all parameters are guaranteed over the operational supply voltage and temperature
range of the device as follows: TA = -40°C to +85°C; VIN = (VO+0.5V) to 5.5V with a minimum VIN of 2.3V;
CIN = 1µF; CO = 1µF; (Continued)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
DEVICE START-UP CHARACTERISTICS
Device Enable Time
TEN
Time from assertion of the ENx pin to when the output voltage
reaches 95% of the VO (nom)
250
500
μs
LDO Soft-Start Ramp Rate
TSSR
Slope of linear portion of LDO output voltage ramp during
start-up
30
60
μs/V
EN PIN CHARACTERISTICS
Input Low Voltage
VIL
-0.3
0.5
V
Input High Voltage
VIH
1.4
VIN+0.3
V
0.1
μA
Input Leakage Current
IIL, IIH
Pin Capacitance
CPIN
Informative
5
pF
POR PIN CHARACTERISTICS
POR Thresholds
VPOR+
As a percentage of nominal output voltage
VPORPOR Delay
TPLH
CPOR = 0.01μF
91
94
97
%
87
90
93
%
100
200
300
ms
TPHL
POR Pin Output Low Voltage
VOL
POR Pin Internal Pull-up
Resistance
μs
25
@ IOL = 1.0mA
RPOR
78
100
0.2
V
180
kΩ
NOTES:
5. VOx = 0.98 * VOx(NOM); Valid for VOx greater than 1.85V.
EN
TEN
VPOR+
VPOR-
VPOR+
VPOR-
<tPHL
VO
tPLH
tPHL
POR
FIGURE 1. TIMING PARAMETER DEFINITION
3
FN6433.0
January 18, 2007
ISL9001A
Typical Performance Curves
0.8
0.10
VO = 3.3V
ILOAD = 0mA
0.4
0.2
-40°C
0.0
+25°C
-0.2
85°C
-0.4
VIN = 3.8V
VO = 3.3V
0.08
OUTPUT VOLTAGE CHANGE (%)
OUTPUT VOLTAGE, VO (%)
0.6
-0.6
0.06
0.04
-40°C
0.02
+25°C
0.00
-0.02
+85°C
-0.04
-0.06
-0.08
-0.8
3.4
3.8
4.6
4.2
5.0
5.4
5.8
6.2
6.6
-0.10
50
0
200
250
300
350
400
LOAD CURRENT - IO (mA)
FIGURE 2. OUTPUT VOLTAGE vs INPUT VOLTAGE (3.3V
OUTPUT)
FIGURE 3. OUTPUT VOLTAGE CHANGE vs LOAD CURRENT
3.4
0.10
VIN = 3.8V
VO = 3.3V
ILOAD = 0mA
0.08
0.06
0.04
0.02
0.00
-0.02
-0.04
-0.06
VO = 3.3V
IO = 0mA
3.3
OUTPUT VOLTAGE, VO (V)
OUTPUT VOLTAGE CHANGE (%)
150
100
INPUT VOLTAGE (V)
3.2
IO = 150mA
3.1
IO = 300mA
3.0
2.9
-0.08
2.8
-0.10
-40
-25
5
-10
20 35 50 65
TEMPERATURE (°C)
80
95
3.1
110 125
4.1
4.6
5.1
5.6
6.1
6.5
INPUT VOLTAGE (V)
FIGURE 4. OUTPUT VOLTAGE CHANGE vs TEMPERATURE
FIGURE 5. OUTPUT VOLTAGE vs INPUT VOLTAGE (3.3V
OUTPUT)
350
2.9
VO = 2.8V
IO = 0mA
300
DROPOUT VOLTAGE, VDO (mV)
2.8
OUTPUT VOLTAGE, VO (V)
3.6
2.7
IO = 150mA
2.6
IO = 300mA
2.5
2.4
2.3
2.6
250
VO = 2.8V
200
VO = 3.3V
150
100
50
0
3.1
3.6
4.1
4.6
5.1
5.6
6.1
6.5
INPUT VOLTAGE (V)
FIGURE 6. OUTPUT VOLTAGE vs INPUT VOLTAGE (2.8V
OUTPUT)
4
0
50
100
150
200
250
OUTPUT LOAD (mA)
300
350
400
FIGURE 7. DROPOUT VOLTAGE vs LOAD CURRENT
FN6433.0
January 18, 2007
ISL9001A
Typical Performance Curves
(Continued)
350
40
VO = 3.3V
35
GROUND CURRENT (µA)
DROPOUT VOLTAGE, VDO (mV)
300
250
+25°C
+85°C
200
-40°C
150
100
+125°C
30
+25°C
25
-40°C
20
VO = 3.3V
15
50
0
10
0
50
100
150
200
250
OUTPUT LOAD (mA)
300
350
400
3.0
3.5
4.0
4.58
5.0
5.5
6.5
6.0
INPUT VOLTAGE (V)
FIGURE 8. DROPOUT VOLTAGE vs LOAD CURRENT
FIGURE 9. GROUND CURRENT vs INPUT VOLTAGE
40
200
180
35
GROUND CURRENT (µA)
GROUND CURRENT (µA)
160
+85°C
140
120
+25°C
100
-40°C
80
60
40
25
20
VIN = 3.8V
VO = 3.3V
20
0
30
0
50
100
150
200
250
300
350
VIN = 3.8V
VO = 3.3V
ILOAD = 0µA
15
10
-40 -25
400
-10
5
LOAD CURRENT (mA)
FIGURE 10. GROUND CURRENT vs LOAD
20 35
50
65
TEMPERATURE (°C)
4
2
VO (V)
3
VIN
2
VIN = 5.0V
VO = 2.85V
IL = 150mA
CL = 1µF
CBYP = 0.01µF
1
0
POR
1
VO
VEN (V)
VOLTAGE (V)
5
0
0
110 125
95
FIGURE 11. GROUND CURRENT vs TEMPERATURE
VO = 2.85V
IL = 150mA
3
80
0.5
1.0
1.5
2.0
2.5
TIME (s)
3.0
3.5
4.0
FIGURE 12. POWER-UP/POWER-DOWN
5
4.5
5.0
5
0
0
0.2
0.4
0.6
0.8
1.0
1.2
TIME (ms)
1.4
1.6
1.8
2.0
FIGURE 13. TURN ON/TURN OFF RESPONSE
FN6433.0
January 18, 2007
ISL9001A
Typical Performance Curves
(Continued)
VO = 3.3V
ILOAD = 300mA
CLOAD = 1µF
CBYP = 0.01µF
VO = 2.8V
ILOAD = 300mA
CLOAD = 1µF
CBYP = 0.01µF
4.3V
4.2V
3.6V
3.5V
10mV/DIV
10mV/DIV
400µs/DIV
400µs/DIV
FIGURE 14. LINE TRANSIENT RESPONSE, 3.3V OUTPUT
FIGURE 15. LINE TRANSIENT RESPONSE, 2.8V OUTPUT
VO (25mV/DIV)
VO = 1.8V
VIN = 2.8V
300mA
ILOAD
SPECTRAL NOISE DENSITY (nV/√Hz)
1000
100
10
VIN = 3.6V
VO = 1.8V
ILOAD = 10mA
CBYP = 0.1µF
1
CIN = 1µF
CLOAD = 1µF
100µA
0.1
10
100
100µs/DIV
FIGURE 16. LOAD TRANSIENT RESPONSE
1k
10k
FREQUENCY (Hz)
100k
1M
FIGURE 17. SPECTRAL NOISE DENSITY vs FREQUENCY
100
VIN = 3.6V
VO = 1.8V
IO = 10mA
CBYP = 0.1µF
CLOAD = 1µF
90
80
PSRR (dB)
70
60
50
40
30
20
10
0
100
1k
10k
FREQUENCY (Hz)
100k
1M
FIGURE 18. PSRR vs FREQUENCY
6
FN6433.0
January 18, 2007
ISL9001A
Pin Description
PIN #
PIN NAME
DESCRIPTION
1
VIN
Supply Voltage/LDO Input:
Connect a 1µF capacitor to GND.
2
EN
LDO Enable.
3
CBYP
Reference Bypass Capacitor Pin:
Optionally connect capacitor of value 0.01µF to 0.1µF between this pin and GND to achieve lowest noise and
highest PSRR.
4
CPOR
POR Delay Setting Capacitor Pin:
Connect a capacitor between this pin and GND to delay the POR output release after the output reaches 94% of
its specified voltage level. (200ms delay per 0.01µF).
5
GND
6
NC
7
POR
8
VO
GND is the connection to system ground. Connect to PCB Ground plane.
Do not connect.
Open-drain POR Output (active-low):
Internally connected to VO through 100kΩ resistor.
LDO Output:
Connect capacitor of value 1µF to 10µF to GND (1µF recommended).
Typical Application
ISL9001A
VIN (2.3-5V)
1
ON
2
ENABLE
OFF
3
C1
C2
8
VIN
EN
POR
VOUT OK
7
VOUT TOO LOW
CBYP
5
4
C4
VO
CPOR
GND
VOUT
(200ms DELAY,
C4 = 0.01µF)
C3
C1, C3: 1µF X5R CERAMIC CAPACITOR
C2: 0.1µF X7R CERAMIC CAPACITOR
C4: 0.01µF X7R CERAMIC CAPACITOR
7
FN6433.0
January 18, 2007
ISL9001A
Block Diagram
VIN
VO
UVLO
CONTROL
LOGIC
SHORT CIRCUIT,
THERMAL PROTECTION,
SOFT-START
EN
1.0V
100K
VO
GND
POR
BANDGAP AND
TEMPERATURE
SENSOR
VOLTAGE AND
REFERENCE
GENERATOR
CBYP
Functional Description
The ISL9001A contains all circuitry required to implement a
high performance LDO. High performance is achieved
through a circuit that delivers fast transient response to
varying load conditions. In a quiescent condition, the
ISL9001A adjusts its biasing to achieve the lowest standby
current consumption.
The device also integrates current limit protection, smart
thermal shutdown protection, and soft-start. Smart thermal
shutdown protects the device against overheating.
Power Control
The ISL9001A has an enable pin (EN) to control power to
the LDO output. When EN is low, the device is in shutdown
mode. During this condition, all on-chip circuits are off, and
the device draws minimum current, typically less than 0.1μA.
When the enable pin is asserted, the device first polls the
output of the UVLO detector to ensure that VIN voltage is at
least about 2.1V. Once verified, the device initiates a start-up
sequence. During the start-up sequence, trim settings are
first read and latched. Then, sequentially, the bandgap,
reference voltage and current generation circuitry power up.
Once the references are stable, a fast-start circuit quickly
charges the external reference bypass capacitor (connected
to the CBYP pin) to the proper operating voltage. Once the
bypass capacitor has been charged, the LDO powers up.
8
POR
DELAY
1.0V
0.94V
0.9V
CPOR
GND
During operation, whenever the VIN voltage drops below
about 1.84V, the ISL9001A immediately disables the LDO
output. When VIN rises back above 2.1V, the device reinitiates its start-up sequence and LDO operation will
resume automatically.
Reference Generation
The reference generation circuitry includes a trimmed
bandgap, a trimmed voltage reference divider, a trimmed
current reference generator, and an RC noise filter. The filter
includes the external capacitor connected to the CBYP pin.
A 0.01μF capacitor connected CBYP implements a 100Hz
lowpass filter, and is recommended for most high
performance applications. For the lowest noise application, a
0.1μF CBYP capacitor should be used. This filters the
reference noise to below the 10Hz to 1kHz frequency band,
which is crucial in many noise-sensitive applications.
The bandgap generates a zero temperature coefficient (TC)
voltage for the reference divider. The reference divider
provides the regulation reference, POR detection thresholds,
and other voltage references required for current generation
and over-temperature detection.
The current generator outputs references required for
adaptive biasing as well as references for LDO output
current limit and thermal shutdown determination.
FN6433.0
January 18, 2007
ISL9001A
LDO Regulation and Programmable Output Divider
The LDO Regulator is implemented with a high-gain
operational amplifier driving a PMOS pass transistor. The
design of the ISL9001A provides a regulator that has low
quiescent current, fast transient response, and overall
stability across all operating and load current conditions.
LDO stability is guaranteed for a 1μF to 10μF output
capacitor that has a tolerance better than 20% and ESR less
than 200mΩ. The design is performance-optimized for a 1μF
capacitor. Unless limited by the application, use of an output
capacitor value above 4.7μF is not recommended as LDO
performance improvement is minimal.
Soft-start circuitry integrated into each LDO limits the initial
ramp-up rate to about 30μs/V to minimize current surge. The
ISL9001A provides short-circuit protection by limiting the
output current to about 425mA.
The LDO uses an independently trimmed 1V reference as its
input. An internal resistor divider drops the LDO output
voltage down to 1V. This is compared to the 1V reference for
regulation. The resistor division ratio is programmed in the
factory.
Power-On Reset Generation
The power-good state is exited when the LDO output falls
below 90% of the expected output voltage for a period longer
than the PGOOD exit delay time. While power-good is false,
the ISL9001A pulls the POR pin low.
The PGOOD entry and exit delays are determined by the
value of an external capacitor connected to the CPOR pin.
For a 0.01μF capacitor, the entry and exit delays are 200ms
and 25μs respectively. Larger or smaller capacitor values will
yield proportionately longer or shorter delay times. The POR
exit delay should never be allowed to be less than 10μs to
ensure sufficient immunity against transient induced false
POR triggering.
Overheat Detection
The bandgap outputs a proportional-to-temperature current
that is indicative of the temperature of the silicon. This
current is compared with references to determine if the
device is in danger of damage due to overheating. When the
die temperature reaches about +140°C, if the LDO is
sourcing more than 50mA, it shuts down until the die cools
sufficiently. Once the die temperature falls back below about
+110°C, the disabled LDO is re-enabled and soft-start
automatically takes place.
The ISL9001A has a Power-on Reset signal generation
circuit which indicates that output power is good. The POR
signal is generated as follows:
A POR comparator continuously monitors the output of the
LDO. The LDO enters a power-good state when the output
voltage is above 94% of the expected output voltage for a
period exceeding the LDO PGOOD entry delay time (see
below). In the power-good state, the open-drain POR output
is in a high-impedance state. An internal 100kΩ pull-up
resistor pulls the pin up to the LDO output voltage. An
external resistor can be added between the POR output and
the LDO output for a faster rise time, however, the POR
output should not connect through an external resistor to a
supply greater than the LDO voltage.
9
FN6433.0
January 18, 2007
ISL9001A
Dual Flat No-Lead Plastic Package (DFN)
L8.2x3
2X
0.15 C A
A
D
8 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE
2X
MILLIMETERS
0.15 C B
SYMBOL
E
MIN
A
0.80
A1
-
6
A3
INDEX
AREA
b
TOP VIEW
D2
0.20
0.10
SIDE VIEW
C
SEATING
PLANE
D2
(DATUM B)
0.08 C
A3
7
0.90
1.00
-
-
0.05
-
0.25
0.32
1.50
1.65
1.75
1
7,8
3.00 BSC
-
8
1.65
e
1.80
1.90
7,8
0.50 BSC
-
k
0.20
-
-
-
L
0.30
0.40
0.50
8
N
8
Nd
4
D2/2
6
INDEX
AREA
5,8
C
E2
A
NOTES
2.00 BSC
E
//
MAX
0.20 REF
D
B
NOMINAL
2
3
Rev. 0 6/04
2
NX k
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd refers to the number of terminals on D.
(DATUM A)
E2
4. All dimensions are in millimeters. Angles are in degrees.
E2/2
5. Dimension b applies to the metallized terminal and is measured
between 0.25mm and 0.30mm from the terminal tip.
NX L
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
N N-1
NX b
e
8
5
0.10
(Nd-1)Xe
REF.
M C A B
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
8. Nominal dimensions are provided to assist with PCB Land
Pattern Design efforts, see Intersil Technical Brief TB389.
BOTTOM VIEW
CL
(A1)
NX (b)
L
5
SECTION "C-C"
C C
TERMINAL TIP
e
FOR EVEN TERMINAL/SIDE
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Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
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10
FN6433.0
January 18, 2007